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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Disipadores de calor

    制造商 Serie Embalaje Estado del producto Tipo Paquete refrigerado Método de fijación Forma Longitud Ancho Diámetro Altura de la aleta Disipación de energía a aumento de temperatura Resistencia térmica a flujo de aire forzado Resistencia térmica a natural Material Acabado del 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    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Paquete refrigerado Método de fijación Forma Longitud Ancho Diámetro Altura de la aleta Disipación de energía a aumento de temperatura Resistencia térmica a flujo de aire forzado Resistencia térmica a natural Material Acabado del material
    6238BG

    6238BG

    BOARD LEVEL HEAT SINK

    Boyd Laconia, LLC

    3,105
    RFQ
    6238BG

    Tabla de datos

    - Bulk Active Board Level, Vertical TO-220 Clip Rectangular, Fins 1.159" (29.44mm) 1.005" (25.53mm) - 0.610" (15.49mm) 2.0W @ 40°C 6.00°C/W @ 600 LFM 13.60°C/W Aluminum Black Anodized
    TV1505G

    TV1505G

    THM,ZA2565 ISS 4 TV-1505G

    Boyd Laconia, LLC

    3,487
    RFQ

    -

    - Bulk Active Board Level, Vertical TO-220 Clip and PC Pin Rectangular, Fins 1.181" (30.00mm) 0.500" (12.70mm) - 1.189" (30.20mm) 1.0W @ 30°C 12.00°C/W @ 200 LFM 17.00°C/W - -
    335814B00000G

    335814B00000G

    HEAT SINK

    Boyd Laconia, LLC

    3,119
    RFQ
    335814B00000G

    Tabla de datos

    - Bulk Active Top Mount BGA Thermal Tape, Adhesive (Included) Square, Fins 1.181" (30.00mm) 1.181" (30.00mm) - 0.354" (9.00mm) - 5.61°C/W @ 200 LFM 10.50°C/W Aluminum Black Anodized
    335714B00000G

    335714B00000G

    HEAT SINK

    Boyd Laconia, LLC

    3,132
    RFQ
    335714B00000G

    Tabla de datos

    - Bulk Active Top Mount BGA Thermal Tape, Adhesive (Included) Square, Fins 1.181" (30.00mm) 1.181" (30.00mm) - 0.275" (7.00mm) - 8.13°C/W @ 200 LFM 15.20°C/W Aluminum Black Anodized
    V2012SN

    V2012SN

    STAMPED HEATSINK

    Assmann WSW Components

    4,305
    RFQ

    -

    - Bulk Active Board Level, Vertical TO-126, TO-220 PC Pin Rectangular, Fins 0.748" (19.00mm) 0.866" (22.00mm) - 0.433" (11.00mm) - - 21.00°C/W Aluminum Alloy Tin
    XL25-35-35-10-T1-0.25

    XL25-35-35-10-T1-0.25

    CERAMIC HEAT SPREADER 35X35MM GR

    t-Global Technology

    3
    RFQ
    XL25-35-35-10-T1-0.25

    Tabla de datos

    XL-25 Tray Obsolete Heat Spreader Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) Square 1.378" (35.00mm) 1.378" (35.00mm) - 0.394" (10.00mm) - - - Ceramic -
    V2004W

    V2004W

    STAMPED HEATSINK

    Assmann WSW Components

    4,127
    RFQ

    -

    - Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 1.575" (40.00mm) 0.953" (24.20mm) - 0.512" (13.00mm) - - 16.00°C/W Aluminum Alloy Black Anodized
    V2221SN

    V2221SN

    STAMPED HEATSINK

    Assmann WSW Components

    2,720
    RFQ

    -

    - Bulk Active Board Level, Vertical - Bolt On and PC Pin Rectangular, Fins 1.180" (29.97mm) 1.000" (25.40mm) - 0.500" (12.70mm) - - - Copper Alloy Tin
    HSE-B20500-040H-01

    HSE-B20500-040H-01

    HEAT SINK, EXTRUSION, TO-220, 50

    Same Sky (Formerly CUI Devices)

    2,221
    RFQ
    HSE-B20500-040H-01

    Tabla de datos

    HSE Box Active Board Level, Vertical TO-220 PC Pin Rectangular, Angled Fins 1.969" (50.00mm) 1.359" (34.50mm) - 0.492" (12.50mm) 8.9W @ 75°C 8.90°C/W @ 200 LFM 8.43°C/W Aluminum Alloy Black Anodized
    V7466W4

    V7466W4

    PROFILE HEATSINK

    Assmann WSW Components

    3,948
    RFQ

    -

    - Bulk Active Board Level, Vertical SOT-32, TO-220, TOP-3 Bolt On and PC Pin Rectangular, Fins 1.000" (25.40mm) 1.772" (45.00mm) - 0.500" (12.70mm) - - 8.20°C/W Aluminum Alloy Black Anodized
    V2273E1

    V2273E1

    CPU HEATSINK, CROSS CUT, AL6063,

    Assmann WSW Components

    2,072
    RFQ
    V2273E1

    Tabla de datos

    - Bulk Active Top Mount - Thermal Tape, Adhesive (Not Included) Square, Pin Fins 0.906" (23.00mm) 0.906" (23.00mm) - 0.709" (18.00mm) - - 26.00°C/W Aluminum Alloy Black Anodized
    CW-T220-26E

    CW-T220-26E

    SINGLE TO-220 SPRING CLIP

    Ohmite

    2,519
    RFQ

    -

    - Box Active - - - - - - - - - - - - -
    CW-T247-21E

    CW-T247-21E

    SINGLE TO-247 SPRING CLIP

    Ohmite

    4,380
    RFQ

    -

    - Box Active - - - - - - - - - - - - -
    V7477Y4

    V7477Y4

    PROFILE HEATSINK

    Assmann WSW Components

    3,341
    RFQ

    -

    - Bulk Active Board Level, Vertical SOT-32, TO-220, TOP-3 Bolt On and PC Pin Rectangular, Fins 2.000" (50.80mm) 1.378" (35.00mm) - 0.500" (12.70mm) - - 9.00°C/W Aluminum Alloy Black Anodized
    V2199N1-F

    V2199N1-F

    HEATSINK CPU W/ADHESIVE STAMPED

    Assmann WSW Components

    4,565
    RFQ
    V2199N1-F

    Tabla de datos

    - Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) Rectangular, Fins 1.378" (35.00mm) 0.866" (22.00mm) - 0.394" (10.00mm) - - - Aluminum Alloy Natural Anodized
    HSE-B20508-035H

    HSE-B20508-035H

    HEAT SINK, EXTRUSION, TO-220, 50

    Same Sky (Formerly CUI Devices)

    4,803
    RFQ
    HSE-B20508-035H

    Tabla de datos

    HSE Box Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Angled Fins 2.000" (50.80mm) 1.375" (34.93mm) - 0.500" (12.70mm) 7.8W @ 75°C 5.17°C/W @ 200 LFM 9.62°C/W Aluminum Alloy Black Anodized
    HSE-B20508-035H-01

    HSE-B20508-035H-01

    HEAT SINK, EXTRUSION, TO-220, 50

    Same Sky (Formerly CUI Devices)

    2,319
    RFQ
    HSE-B20508-035H-01

    Tabla de datos

    HSE Box Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Angled Fins 2.000" (50.80mm) 1.378" (35.00mm) - 0.500" (12.70mm) 8.2W @ 75°C 4.76°C/W @ 200 LFM 9.15°C/W Aluminum Alloy Black Anodized
    V8511WE1

    V8511WE1

    PROFILE HEATSINK

    Assmann WSW Components

    4,186
    RFQ

    -

    - Bulk Active Board Level, Vertical TO-220 PC Pin Rectangular, Fins 1.000" (25.40mm) 1.638" (41.60mm) - 0.984" (25.00mm) - - 5.70°C/W Aluminum Alloy Black Anodized
    7121DG

    7121DG

    BOARD LEVEL HEAT SINK

    Boyd Laconia, LLC

    2,973
    RFQ
    7121DG

    Tabla de datos

    - Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 1.180" (29.97mm) 1.000" (25.40mm) - 0.500" (12.70mm) 1.0W @ 20°C 5.00°C/W @ 400 LFM 13.00°C/W Copper Tin
    V8511X4

    V8511X4

    PROFILE HEATSINK

    Assmann WSW Components

    3,307
    RFQ

    -

    - Bulk Active Board Level, Vertical SOT-32, TO-220, TOP-3 Bolt On and PC Pin Rectangular, Fins 1.500" (38.10mm) 1.638" (41.60mm) - 0.984" (25.00mm) - - 5.00°C/W Aluminum Alloy Black Anodized
    Total 122183 Record«Prev1... 22082209221022112212221322142215...6110Next»
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