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Zócalos para circuitos integrados
| Foto | N.º de Parte del Fabricante | Disponibilidad | Cantidad | Hoja de Datos | Serie | Embalaje | Estado del producto | Tipo | Número de posiciones o clavijas (cuadrícula) | Paso: acoplamiento | Acabado de contacto: acoplamiento | Espesor del acabado del contacto: acoplamiento | Material del contacto: acoplamiento | Tipo de montaje | Características | Terminación | Paso: poste | Acabado del contacto: poste | Espesor del acabado del contacto: poste | Material del contacto: Poste | Material de la carcasa | Temperatura de funcionamiento |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
1939416-1CONN SOCKET LGA 1207POS GOLD |
2,502 |
|
Tabla de datos |
- | Tray | Active | LGA | 1207 (33 x 34) | 0.043" (1.09mm) | Gold | - | Beryllium Copper | Surface Mount | Closed Frame | Solder | 0.043" (1.09mm) | - | - | - | Thermoplastic | -55°C ~ 110°C |
|
|
516-AG7DCONN IC DIP SOCKET 16POS GOLD |
4,739 |
|
- |
500 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | - | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | - | Copper Alloy | Polyester | -55°C ~ 125°C |
|
|
1939416-2CONN SOCKET LGA 1207POS GOLD |
2,184 |
|
Tabla de datos |
- | Tray | Active | LGA | 1207 (33 x 34) | 0.043" (1.09mm) | Gold | - | Beryllium Copper | Surface Mount | Closed Frame | Solder | 0.043" (1.09mm) | - | - | - | Thermoplastic | -55°C ~ 110°C |
|
|
2-641262-4CONN IC DIP SOCKET 16POS GOLD |
3,705 |
|
Tabla de datos |
Diplomate DL | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Phosphor Bronze | Thermoplastic, Glass Filled | -55°C ~ 125°C |
|
|
1-1437538-3CONN IC DIP SOCKET 28POS TINLEAD |
3,974 |
|
Tabla de datos |
800 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Tin-Lead | - | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester | -55°C ~ 105°C |
|
|
1554116-2CONN SOCKET LGA 1356POS GOLD |
3,753 |
|
Tabla de datos |
- | Tray | Obsolete | LGA | 1356 (32 x 41) | 0.040" (1.02mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.040" (1.01mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Thermoplastic | -25°C ~ 100°C |
|
|
1554116-3CONN SOCKET LGA 1356POS GOLD |
4,844 |
|
Tabla de datos |
- | Tray | Obsolete | LGA | 1356 (32 x 41) | 0.040" (1.02mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.040" (1.01mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Thermoplastic | -25°C ~ 100°C |
|
|
1761122-1POWER ASSY |
4,961 |
|
Tabla de datos |
- | Bulk | Active | LGA | 145 | 0.050" (1.27mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Thermoplastic, Glass Filled | - |
|
|
1939737-1CONN SOCKET LGA 1366POS |
2,269 |
|
- |
- | Tray | Obsolete | LGA | 1366 (32 x 41) | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
8059-2G2CONN TRANSIST TO-5 3POS GOLD |
3,464 |
|
Tabla de datos |
8059 | Bulk | Obsolete | Transistor, TO-5 | 3 (Round) | - | Gold | - | Copper Alloy | Through Hole | - | Solder | - | Gold | - | Copper Alloy | Polyamide (PA), Nylon | -55°C ~ 125°C |
|
|
5-1437530-2CONN IC SIP SOCKET 8POS GOLD |
2,515 |
|
Tabla de datos |
500 | Tube | Obsolete | SIP | 8 (1 x 8) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Tin-Lead | - | Brass | Polyester | -55°C ~ 125°C |
|
|
528-AG11DCONN IC DIP SOCKET 28POS GOLD |
3,185 |
|
Tabla de datos |
500 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester | -55°C ~ 105°C |
|
|
808-AG12DCONN IC DIP SOCKET 8POS TIN-LEAD |
3,376 |
|
Tabla de datos |
800 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Tin-Lead | - | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester | -55°C ~ 105°C |
|
|
506-AG11D-ESCONN IC DIP SOCKET 6POS GOLD |
2,328 |
|
- |
500 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester | -55°C ~ 105°C |
|
|
2-382468-4CONN IC DIP SOCKET 40POS GOLD |
2,512 |
|
Tabla de datos |
Diplomate DL | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | - | Phosphor Bronze | Thermoplastic | -55°C ~ 125°C |
|
|
2-382712-1CONN IC DIP SOCKET 16POS TIN |
3,576 |
|
Tabla de datos |
Diplomate DL | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled | -55°C ~ 105°C |
|
|
8080-1G7CONN TRANSIST TO-3 4POS GOLD |
2,343 |
|
Tabla de datos |
8080 | Bulk | Obsolete | Transistor, TO-3 | 4 (Round) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Beryllium Copper | Fluoropolymer (FP) | -55°C ~ 125°C |
|
|
822064-5CONN SOCKET PQFP 132POS TIN-LEAD |
4,989 |
|
Tabla de datos |
- | Tube | Active | QFP | 132 (4 x 33) | 0.025" (0.64mm) | Tin-Lead | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.025" (0.64mm) | Tin-Lead | 200.0µin (5.08µm) | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - |
|
|
1814655-7CONN SOCKET SIP 10POS GOLD |
3,914 |
|
Tabla de datos |
- | Bulk | Obsolete | SIP | 10 (1 x 10) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Thermoplastic, Polyester | -55°C ~ 125°C |
|
|
2-382719-1CONN IC DIP SOCKET 30POS TIN |
2,604 |
|
Tabla de datos |
Diplomate DL | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 30 (2 x 15) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled | -55°C ~ 105°C |
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