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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    2013620-1

    2013620-1

    CONN SOCKET PGA ZIF 989POS GOLD

    TE Connectivity AMP Connectors

    2,813
    RFQ

    -

    - Tray Active PGA, ZIF (ZIP) 989 (35 x 36) 0.039" (1.00mm) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Open Frame Solder 0.039" (1.00mm) - - Copper Alloy Thermoplastic -
    1981837-1

    1981837-1

    CONN SOCKET LGA 1366POS GOLD

    TE Connectivity AMP Connectors

    4,872
    RFQ
    1981837-1

    Tabla de datos

    - Tray Obsolete LGA 1366 (32 x 41) 0.040" (1.02mm) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Open Frame Solder 0.040" (1.01mm) - - Copper Alloy Thermoplastic -
    8080-1G3-LF

    8080-1G3-LF

    CONN TRANSIST TO-3 3POS TIN

    TE Connectivity AMP Connectors

    4,920
    RFQ
    8080-1G3-LF

    Tabla de datos

    8080 Bulk Obsolete Transistor, TO-3 3 (Oval) - Tin 200.0µin (5.08µm) Beryllium Copper Chassis Mount Closed Frame Solder - Tin 200.0µin (5.08µm) Beryllium Copper Polytetrafluoroethylene (PTFE) -55°C ~ 125°C
    8-1437504-2

    8-1437504-2

    CONN TRANSIST TO-3 3POS TIN

    TE Connectivity AMP Connectors

    4,984
    RFQ
    8-1437504-2

    Tabla de datos

    8080 Bulk Obsolete Transistor, TO-3 3 (Oval) - Tin 200.0µin (5.08µm) Beryllium Copper Chassis Mount Closed Frame Solder - Tin 200.0µin (5.08µm) Beryllium Copper Polytetrafluoroethylene (PTFE) -55°C ~ 125°C
    8-1437504-0

    8-1437504-0

    CONN TRANSIST TO-3 3POS GOLD

    TE Connectivity AMP Connectors

    2,158
    RFQ
    8-1437504-0

    Tabla de datos

    8080 Bulk Obsolete Transistor, TO-3 3 (Oval) - Gold 30.0µin (0.76µm) Beryllium Copper Chassis Mount Closed Frame Solder - Gold 30.0µin (0.76µm) Beryllium Copper Polytetrafluoroethylene (PTFE) -55°C ~ 125°C
    9-1437504-7

    9-1437504-7

    CONN TRANSIST TO-3 3POS TIN

    TE Connectivity AMP Connectors

    2,842
    RFQ
    9-1437504-7

    Tabla de datos

    8080 Bulk Obsolete Transistor, TO-3 3 (Oval) - Tin 200.0µin (5.08µm) Beryllium Copper Chassis Mount Closed Frame Solder - Tin 200.0µin (5.08µm) Beryllium Copper Polytetrafluoroethylene (PTFE) -55°C ~ 125°C
    9-1437504-1

    9-1437504-1

    CONN TRANSIST TO-3 3POS GOLD

    TE Connectivity AMP Connectors

    2,734
    RFQ
    9-1437504-1

    Tabla de datos

    8080 Bulk Obsolete Transistor, TO-3 3 (Oval) - Gold 30.0µin (0.76µm) Beryllium Copper Chassis Mount Closed Frame Solder - Gold 30.0µin (0.76µm) Beryllium Copper Polytetrafluoroethylene (PTFE) -55°C ~ 125°C
    8058-1G29

    8058-1G29

    CONN TRANSIST TO-5 3POS GOLD

    TE Connectivity AMP Connectors

    3,143
    RFQ
    8058-1G29

    Tabla de datos

    8058 Bulk Active Transistor, TO-5 3 (Round) - Gold - Beryllium Copper Panel Mount Closed Frame Solder - Gold - Brass Polytetrafluoroethylene (PTFE) -55°C ~ 125°C
    8058-1G45

    8058-1G45

    CONN TRANSIST TO-5 8POS GOLD

    TE Connectivity AMP Connectors

    2,514
    RFQ
    8058-1G45

    Tabla de datos

    8058 Bulk Obsolete Transistor, TO-5 8 (Round) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Brass Polytetrafluoroethylene (PTFE) -55°C ~ 125°C
    8058-1G59

    8058-1G59

    CONN TRANSIST TO-5 3POS GOLD

    TE Connectivity AMP Connectors

    4,144
    RFQ
    8058-1G59

    Tabla de datos

    8058 Bulk Active Transistor, TO-5 3 (Round) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Brass Polytetrafluoroethylene (PTFE) -55°C ~ 125°C
    5-6437504-0

    5-6437504-0

    CONN TRANSIST TO-3 3POS SILVER

    TE Connectivity AMP Connectors

    2,173
    RFQ
    5-6437504-0

    Tabla de datos

    8080 Bulk Obsolete Transistor, TO-3 3 (Oval) - Silver - Beryllium Copper Chassis Mount Closed Frame Solder - Silver - Beryllium Copper Diallyl Phthalate (DAP) -55°C ~ 125°C
    1-1747890-2

    1-1747890-2

    CONN SOCKET LGA 771POS GOLD

    TE Connectivity AMP Connectors

    2,436
    RFQ
    1-1747890-2

    Tabla de datos

    - Tray Obsolete LGA 771 (33 x 33) 0.043" (1.09mm) Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder 0.043" (1.09mm) - - - Thermoplastic -25°C ~ 100°C
    XR2C-3200-HSG

    XR2C-3200-HSG

    CONN IC SOCKET 32POS

    Omron Electronics Inc-EMC Div

    3,660
    RFQ
    XR2C-3200-HSG

    Tabla de datos

    XR2 Bulk Active Housing 32 (1 x 32) 0.100" (2.54mm) - - Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) - - Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
    PLCC-044-F-N

    PLCC-044-F-N

    CONN SOCKET PLCC 44POS GOLD

    Samtec Inc.

    2,992
    RFQ
    PLCC-044-F-N

    Tabla de datos

    PLCC Tube Obsolete PLCC 44 (4 x 11) 0.050" (1.27mm) Gold Flash Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    PLCC-044-T-N

    PLCC-044-T-N

    CONN SOCKET PLCC 44POS TIN

    Samtec Inc.

    4,979
    RFQ
    PLCC-044-T-N

    Tabla de datos

    PLCC Tube Obsolete PLCC 44 (4 x 11) 0.050" (1.27mm) Tin - Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    PLCC-084-T-N

    PLCC-084-T-N

    CONN SOCKET PLCC 84POS TIN

    Samtec Inc.

    4,920
    RFQ
    PLCC-084-T-N

    Tabla de datos

    PLCC Tube Obsolete PLCC 84 (4 x 21) 0.050" (1.27mm) Tin - Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    IC-628-SGG

    IC-628-SGG

    CONN IC DIP SOCKET 28POS GOLD

    Samtec Inc.

    4,659
    RFQ
    IC-628-SGG

    Tabla de datos

    IC Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Phosphor Bronze Polyester, Glass Filled -55°C ~ 125°C
    ICO-314-SST-L

    ICO-314-SST-L

    CONN IC DIP SOCKET 14POS GOLD

    Samtec Inc.

    3,537
    RFQ
    ICO-314-SST-L

    Tabla de datos

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 125°C
    0475939000

    0475939000

    CONN SOCKET LGA 1366POS NICKEL

    Molex

    4,707
    RFQ
    0475939000

    Tabla de datos

    47594 Tray Obsolete LGA 1366 (32 x 41) - Nickel 3.00µin (0.076µm) - Surface Mount Closed Frame Solder - Nickel 3.00µin (0.076µm) - - -
    CUSTOM BGA

    CUSTOM BGA

    CONN SOCKET BGA CUSTOM

    3M

    4,925
    RFQ
    CUSTOM BGA

    Tabla de datos

    Textool™ - Active BGA Custom 0.026" ~ 0.050" (0.65mm ~ 1.27mm) Custom Custom - Through Hole Custom - - - - - - -
    Total 19086 Record«Prev1... 935936937938939940941942...955Next»
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