Sesión o Registro
    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    100-032-051

    100-032-051

    CONN IC DIP SOCKET 32POS GOLD

    3M

    2,603
    RFQ
    100-032-051

    Tabla de datos

    100 Bulk Obsolete DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Closed Frame, Seal Tape Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
    100-040-050

    100-040-050

    CONN IC DIP SOCKET 40POS GOLD

    3M

    4,540
    RFQ
    100-040-050

    Tabla de datos

    100 Bulk Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
    100-040-051

    100-040-051

    CONN IC DIP SOCKET 40POS GOLD

    3M

    3,890
    RFQ
    100-040-051

    Tabla de datos

    100 Bulk Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Closed Frame, Seal Tape Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
    100-042-050

    100-042-050

    CONN IC DIP SOCKET 42POS GOLD

    3M

    3,830
    RFQ
    100-042-050

    Tabla de datos

    100 Bulk Obsolete DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
    100-048-050

    100-048-050

    CONN IC DIP SOCKET 48POS GOLD

    3M

    2,480
    RFQ
    100-048-050

    Tabla de datos

    100 Bulk Obsolete DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
    822516-1

    822516-1

    CONN SOCKET PLCC 44POS TIN

    TE Connectivity AMP Connectors

    4,912
    RFQ
    822516-1

    Tabla de datos

    - Tube Obsolete PLCC 44 (4 x 11) 0.050" (1.27mm) Tin 100.0µin (2.54µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 100.0µin (2.54µm) Phosphor Bronze Thermoplastic -
    822516-6

    822516-6

    CONN SOCKET PLCC 84POS TIN

    TE Connectivity AMP Connectors

    3,118
    RFQ
    822516-6

    Tabla de datos

    - Tube Obsolete PLCC 84 (4 x 21) 0.050" (1.27mm) Tin 100.0µin (2.54µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 100.0µin (2.54µm) Phosphor Bronze Thermoplastic -
    XR2A-2815

    XR2A-2815

    CONN IC DIP SOCKET 28POS GOLD

    Omron Electronics Inc-EMC Div

    4,857
    RFQ
    XR2A-2815

    Tabla de datos

    XR2 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
    XR2C-1511-N

    XR2C-1511-N

    CONN SOCKET SIP 15POS GOLD

    Omron Electronics Inc-EMC Div

    3,929
    RFQ
    XR2C-1511-N

    Tabla de datos

    XR2 Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
    XR2E-3204

    XR2E-3204

    CONN SOCKET SIP 32POS GOLD

    Omron Electronics Inc-EMC Div

    3,072
    RFQ
    XR2E-3204

    Tabla de datos

    XR2 Bulk Obsolete SIP 32 (1 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
    XR2H-1611-N

    XR2H-1611-N

    CONN ZIG-ZAG 16POS GOLD

    Omron Electronics Inc-EMC Div

    4,576
    RFQ
    XR2H-1611-N

    Tabla de datos

    XR2 Bulk Active Zig-Zag 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
    2-1814640-0

    2-1814640-0

    CONN IC DIP SOCKET 16POS TIN

    TE Connectivity AMP Connectors

    2,662
    RFQ
    2-1814640-0

    Tabla de datos

    - Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Thermoplastic, Polyester -55°C ~ 125°C
    1814654-3

    1814654-3

    CONN IC DIP SOCKET 8POS GOLD

    TE Connectivity AMP Connectors

    3,586
    RFQ
    1814654-3

    Tabla de datos

    - Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) - - Bronze Thermoplastic, Polyester -55°C ~ 125°C
    1-822473-3

    1-822473-3

    CONN SOCKET PLCC 32POS TIN

    TE Connectivity AMP Connectors

    4,941
    RFQ
    1-822473-3

    Tabla de datos

    - Box Obsolete PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin 80.0µin (2.03µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 80.0µin (2.03µm) Phosphor Bronze Thermoplastic -
    1-390262-5

    1-390262-5

    CONN IC DIP SOCKET 40POS TIN

    TE Connectivity AMP Connectors

    2,945
    RFQ
    1-390262-5

    Tabla de datos

    - Box Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze - -40°C ~ 105°C
    1-390262-7

    1-390262-7

    CONN IC DIP SOCKET 48POS TIN

    TE Connectivity AMP Connectors

    3,904
    RFQ
    1-390262-7

    Tabla de datos

    - Box Obsolete DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze - -40°C ~ 105°C
    1-390263-2

    1-390263-2

    CONN IC DIP SOCKET 32POS TIN

    TE Connectivity AMP Connectors

    2,683
    RFQ
    1-390263-2

    Tabla de datos

    - Box Obsolete DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze - -40°C ~ 105°C
    210227-4

    210227-4

    CONN SOCKET PGA 169POS GOLD

    TE Connectivity AMP Connectors

    2,707
    RFQ
    210227-4

    Tabla de datos

    - Bulk Active PGA 169 (17 x 17) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin-Lead 196.9µin (5.00µm) Phosphor Bronze Thermoplastic, Polyester, Glass Filled -
    2-5916783-5

    2-5916783-5

    CONN SOCKET PGA ZIF 370POS GOLD

    TE Connectivity AMP Connectors

    3,484
    RFQ

    -

    - Tray Active PGA, ZIF (ZIP) 370 (19 x 19) 0.100" (2.54mm) Gold 15.0µin (0.38µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Gold 15.0µin (0.38µm) Copper Alloy Liquid Crystal Polymer (LCP) -
    69802-128LF

    69802-128LF

    CONN SOCKET PLCC 28POS TIN

    Amphenol ICC (FCI)

    4,299
    RFQ
    69802-128LF

    Tabla de datos

    - Tube Obsolete PLCC 28 (4 x 7) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Polyphenylene Sulfide (PPS) -55°C ~ 125°C
    Total 19086 Record«Prev1... 932933934935936937938939...955Next»
    Correo electrónico
    Lo que contiene
    KATY Electronic Technology Co., LTD

    Casa

    KATY Electronic Technology Co., LTD

    Productos

    KATY Electronic Technology Co., LTD

    Teléfono

    KATY Electronic Technology Co., LTD

    Usuarios