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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    42-3553-16

    42-3553-16

    CONN IC DIP SOCKET ZIF 42POS

    Aries Electronics

    2,658
    RFQ
    42-3553-16

    Tabla de datos

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    42-6551-16

    42-6551-16

    CONN IC DIP SOCKET ZIF 42POS

    Aries Electronics

    2,654
    RFQ
    42-6551-16

    Tabla de datos

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    42-6552-16

    42-6552-16

    CONN IC DIP SOCKET ZIF 42POS

    Aries Electronics

    3,298
    RFQ
    42-6552-16

    Tabla de datos

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    42-6553-16

    42-6553-16

    CONN IC DIP SOCKET ZIF 42POS

    Aries Electronics

    3,524
    RFQ
    42-6553-16

    Tabla de datos

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    42-6554-16

    42-6554-16

    CONN IC DIP SOCKET ZIF 42POS

    Aries Electronics

    2,728
    RFQ
    42-6554-16

    Tabla de datos

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    558-10-504M29-001101

    558-10-504M29-001101

    PGA SOLDER TAIL 1.27MM

    Preci-Dip

    4,067
    RFQ
    558-10-504M29-001101

    Tabla de datos

    558 Bulk Active PGA 504 (29 x 29) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    163-PGM15066-10T

    163-PGM15066-10T

    CONN SOCKET PGA TIN

    Aries Electronics

    4,152
    RFQ
    163-PGM15066-10T

    Tabla de datos

    PGM Bulk Active PGA - 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    163-PGM15067-10T

    163-PGM15067-10T

    CONN SOCKET PGA TIN

    Aries Electronics

    3,556
    RFQ
    163-PGM15067-10T

    Tabla de datos

    PGM Bulk Active PGA - 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    64-PRS16016-12

    64-PRS16016-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    3,324
    RFQ
    64-PRS16016-12

    Tabla de datos

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    101-PLS14030-12

    101-PLS14030-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    3,954
    RFQ
    101-PLS14030-12

    Tabla de datos

    PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    HLS-0820-G-38

    HLS-0820-G-38

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,798
    RFQ
    HLS-0820-G-38

    Tabla de datos

    HLS Bulk Active SIP 160 (8 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    558-10-478M26-131104

    558-10-478M26-131104

    BGA SURFACE MOUNT 1.27MM

    Preci-Dip

    4,124
    RFQ
    558-10-478M26-131104

    Tabla de datos

    558 Bulk Active BGA 478 (26 x 26) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Open Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    44-PLS12017-12

    44-PLS12017-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,229
    RFQ
    44-PLS12017-12

    Tabla de datos

    PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    44-PRS12017-12

    44-PRS12017-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    3,771
    RFQ
    44-PRS12017-12

    Tabla de datos

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    100-PLS10001-12

    100-PLS10001-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,169
    RFQ
    100-PLS10001-12

    Tabla de datos

    PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    518-77-478M26-131105

    518-77-478M26-131105

    CONN SOCKET PGA 478POS GOLD

    Preci-Dip

    4,530
    RFQ
    518-77-478M26-131105

    Tabla de datos

    518 Bulk Active PGA 478 (26 x 26) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
    558-10-480M29-001104

    558-10-480M29-001104

    BGA SURFACE MOUNT 1.27MM

    Preci-Dip

    2,141
    RFQ
    558-10-480M29-001104

    Tabla de datos

    558 Bulk Active BGA 480 (29 x 29) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    144-PRS13095-12

    144-PRS13095-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,120
    RFQ
    144-PRS13095-12

    Tabla de datos

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    514-83-576M30-001148

    514-83-576M30-001148

    CONN SOCKET BGA 576POS GOLD

    Preci-Dip

    3,173
    RFQ
    514-83-576M30-001148

    Tabla de datos

    514 Bulk Active BGA 576 (30 x 30) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    518-77-480M29-001105

    518-77-480M29-001105

    CONN SOCKET PGA 480POS GOLD

    Preci-Dip

    4,509
    RFQ
    518-77-480M29-001105

    Tabla de datos

    518 Bulk Active PGA 480 (29 x 29) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
    Total 19086 Record«Prev1... 897898899900901902903904...955Next»
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