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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    44-3575-16

    44-3575-16

    CONN IC DIP SOCKET ZIF 44POS TIN

    Aries Electronics

    3,375
    RFQ
    44-3575-16

    Tabla de datos

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    44-6571-16

    44-6571-16

    CONN IC DIP SOCKET ZIF 44POS

    Aries Electronics

    2,160
    RFQ
    44-6571-16

    Tabla de datos

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
    44-6572-16

    44-6572-16

    CONN IC DIP SOCKET ZIF 44POS TIN

    Aries Electronics

    4,675
    RFQ
    44-6572-16

    Tabla de datos

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    44-6573-16

    44-6573-16

    CONN IC DIP SOCKET ZIF 44POS TIN

    Aries Electronics

    2,895
    RFQ
    44-6573-16

    Tabla de datos

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    44-6574-16

    44-6574-16

    CONN IC DIP SOCKET ZIF 44POS TIN

    Aries Electronics

    4,450
    RFQ
    44-6574-16

    Tabla de datos

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    44-6575-16

    44-6575-16

    CONN IC DIP SOCKET ZIF 44POS TIN

    Aries Electronics

    2,562
    RFQ
    44-6575-16

    Tabla de datos

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    1011-1-0144-0B-00

    1011-1-0144-0B-00

    TEXTOOL1011-1-0144-0B-00

    3M

    3,463
    RFQ

    -

    - Bulk Active - - - - - - - - - - - - - - -
    558-10-456M26-001104

    558-10-456M26-001104

    BGA SURFACE MOUNT 1.27MM

    Preci-Dip

    4,630
    RFQ
    558-10-456M26-001104

    Tabla de datos

    558 Bulk Active BGA 456 (26 x 26) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    40-3574-16

    40-3574-16

    CONN IC DIP SOCKET ZIF 40POS GLD

    Aries Electronics

    4,760
    RFQ
    40-3574-16

    Tabla de datos

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    40-6574-16

    40-6574-16

    CONN IC DIP SOCKET ZIF 40POS TIN

    Aries Electronics

    4,907
    RFQ
    40-6574-16

    Tabla de datos

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    40-3570-16

    40-3570-16

    CONN IC DIP SOCKET ZIF 40POS

    Aries Electronics

    2,256
    RFQ
    40-3570-16

    Tabla de datos

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
    40-3571-16

    40-3571-16

    CONN IC DIP SOCKET ZIF 40POS

    Aries Electronics

    3,563
    RFQ
    40-3571-16

    Tabla de datos

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
    40-3572-16

    40-3572-16

    CONN IC DIP SOCKET ZIF 40POS

    Aries Electronics

    3,044
    RFQ
    40-3572-16

    Tabla de datos

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
    40-3573-16

    40-3573-16

    CONN IC DIP SOCKET ZIF 40POS

    Aries Electronics

    2,534
    RFQ
    40-3573-16

    Tabla de datos

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
    40-3575-16

    40-3575-16

    CONN IC DIP SOCKET ZIF 40POS GLD

    Aries Electronics

    4,536
    RFQ
    40-3575-16

    Tabla de datos

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    1017-2-0256-0B-03

    1017-2-0256-0B-03

    TEXTOOLTEST & BURN-IN BALL GRID

    3M

    4,078
    RFQ

    -

    - Bulk Active - - - - - - - - - - - - - - -
    518-77-456M26-001105

    518-77-456M26-001105

    CONN SOCKET PGA 456POS GOLD

    Preci-Dip

    4,784
    RFQ
    518-77-456M26-001105

    Tabla de datos

    518 Bulk Active PGA 456 (26 x 26) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
    48-3574-16

    48-3574-16

    CONN IC DIP SOCKET ZIF 48POS TIN

    Aries Electronics

    3,681
    RFQ
    48-3574-16

    Tabla de datos

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    48-6574-16

    48-6574-16

    CONN IC DIP SOCKET ZIF 48POS GLD

    Aries Electronics

    2,054
    RFQ
    48-6574-16

    Tabla de datos

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    121-PGM13012-10T

    121-PGM13012-10T

    CONN SOCKET PGA TIN

    Aries Electronics

    3,230
    RFQ
    121-PGM13012-10T

    Tabla de datos

    PGM Bulk Active PGA - 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    Total 19086 Record«Prev1... 895896897898899900901902...955Next»
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