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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    APH-1436-G-T

    APH-1436-G-T

    APH-1436-G-T

    Samtec Inc.

    4,677
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1536-G-T

    APH-1536-G-T

    APH-1536-G-T

    Samtec Inc.

    3,319
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0636-G-T

    APH-0636-G-T

    APH-0636-G-T

    Samtec Inc.

    3,566
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0836-G-T

    APH-0836-G-T

    APH-0836-G-T

    Samtec Inc.

    2,872
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1636-G-T

    APH-1636-G-T

    APH-1636-G-T

    Samtec Inc.

    4,662
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    514-83-292M20-001148

    514-83-292M20-001148

    CONN SOCKET BGA 292POS GOLD

    Preci-Dip

    3,692
    RFQ
    514-83-292M20-001148

    Tabla de datos

    514 Bulk Active BGA 292 (20 x 20) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    APO-632-G-T

    APO-632-G-T

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    2,475
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    101-PGM13022-10H

    101-PGM13022-10H

    CONN SOCKET PGA GOLD

    Aries Electronics

    2,302
    RFQ
    101-PGM13022-10H

    Tabla de datos

    PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    546-87-419-19-111147

    546-87-419-19-111147

    CONN SOCKET PGA 419POS GOLD

    Preci-Dip

    2,086
    RFQ
    546-87-419-19-111147

    Tabla de datos

    546 Bulk Active PGA 419 (19 x 19) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    160-PGM14029-40

    160-PGM14029-40

    CONN SOCKET PGA GOLD

    Aries Electronics

    4,524
    RFQ
    160-PGM14029-40

    Tabla de datos

    PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    546-83-321-17-101147

    546-83-321-17-101147

    CONN SOCKET PGA 321POS GOLD

    Preci-Dip

    2,361
    RFQ
    546-83-321-17-101147

    Tabla de datos

    546 Bulk Active PGA 321 (17 x 17) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    546-87-420-19-111147

    546-87-420-19-111147

    CONN SOCKET PGA 420POS GOLD

    Preci-Dip

    2,233
    RFQ
    546-87-420-19-111147

    Tabla de datos

    546 Bulk Active PGA 420 (19 x 19) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-93-241-18-075002

    510-93-241-18-075002

    CONN SOCKET PGA 241POS GOLD

    Mill-Max Manufacturing Corp.

    2,082
    RFQ
    510-93-241-18-075002

    Tabla de datos

    510 Tube Active PGA 241 (18 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    60-9503-21

    60-9503-21

    CONN IC DIP SOCKET 60POS GOLD

    Aries Electronics

    4,712
    RFQ
    60-9503-21

    Tabla de datos

    503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 60 (2 x 30) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    60-9503-31

    60-9503-31

    CONN IC DIP SOCKET 60POS GOLD

    Aries Electronics

    3,310
    RFQ
    60-9503-31

    Tabla de datos

    503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 60 (2 x 30) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    100-PGM10001-51

    100-PGM10001-51

    CONN SOCKET PGA GOLD

    Aries Electronics

    3,417
    RFQ
    100-PGM10001-51

    Tabla de datos

    PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    108-PGM12005-41

    108-PGM12005-41

    CONN SOCKET PGA GOLD

    Aries Electronics

    2,154
    RFQ
    108-PGM12005-41

    Tabla de datos

    PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    52-536-11

    52-536-11

    CONN SOCKET PLCC ZIF 52POS GOLD

    Aries Electronics

    4,521
    RFQ

    -

    536 - Obsolete PLCC, ZIF (ZIP) 52 (4 x 13) 0.050" (1.27mm) Gold 12.0µin (0.30µm) - Through Hole Open Frame - - - - - - -
    32-536-11

    32-536-11

    CONN SOCKET PLCC ZIF 32POS GOLD

    Aries Electronics

    2,141
    RFQ

    -

    536 - Obsolete PLCC, ZIF (ZIP) 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Gold 12.0µin (0.30µm) - Through Hole Open Frame - - - - - - -
    APH-1834-G-R

    APH-1834-G-R

    APH-1834-G-R

    Samtec Inc.

    4,145
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
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