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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    514-83-272M20-001148

    514-83-272M20-001148

    CONN SOCKET BGA 272POS GOLD

    Preci-Dip

    0
    RFQ
    514-83-272M20-001148

    Tabla de datos

    514 Bulk Active BGA 272 (20 x 20) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    210-2599-50-0602

    210-2599-50-0602

    3M TEXTOOL ZIP STRIP SOCKETS 210

    3M

    0
    RFQ

    -

    Textool™ Box Active - - - - - - - - - - - - - - -
    514-83-299-20-001117

    514-83-299-20-001117

    CONN SOCKET PGA 299POS GOLD

    Preci-Dip

    0
    RFQ
    514-83-299-20-001117

    Tabla de datos

    514 Bulk Active PGA 299 (20 x 20) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    514-87-352M26-001148

    514-87-352M26-001148

    CONN SOCKET BGA 352POS GOLD

    Preci-Dip

    0
    RFQ
    514-87-352M26-001148

    Tabla de datos

    514 Bulk Active BGA 352 (26 x 26) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    192-PGM17043-11H

    192-PGM17043-11H

    CONN SOCKET PGA GOLD

    Aries Electronics

    0
    RFQ
    192-PGM17043-11H

    Tabla de datos

    PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    550-10-256M20-001152

    550-10-256M20-001152

    BGA SOLDER TAIL

    Preci-Dip

    0
    RFQ
    550-10-256M20-001152

    Tabla de datos

    550 Bulk Active BGA 256 (20 x 20) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    550-10-256M16-000152

    550-10-256M16-000152

    BGA SOLDER TAIL

    Preci-Dip

    0
    RFQ
    550-10-256M16-000152

    Tabla de datos

    550 Bulk Active BGA 256 (16 x 16) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    517-83-545-17-000111

    517-83-545-17-000111

    CONN SOCKET PGA 545POS GOLD

    Preci-Dip

    0
    RFQ
    517-83-545-17-000111

    Tabla de datos

    517 Bulk Active PGA 545 (17 x 17) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    546-87-391-18-101147

    546-87-391-18-101147

    CONN SOCKET PGA 391POS GOLD

    Preci-Dip

    0
    RFQ
    546-87-391-18-101147

    Tabla de datos

    546 Bulk Active PGA 391 (18 x 18) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-91-256-16-000001

    510-91-256-16-000001

    SKT PGA SOLDRTL

    Mill-Max Manufacturing Corp.

    0
    RFQ
    510-91-256-16-000001

    Tabla de datos

    510 Bulk Active PGA 256 (16 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    40-6508-21

    40-6508-21

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    0
    RFQ
    40-6508-21

    Tabla de datos

    508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    40-6508-31

    40-6508-31

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    0
    RFQ
    40-6508-31

    Tabla de datos

    508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    514-87-356M26-001148

    514-87-356M26-001148

    CONN SOCKET BGA 356POS GOLD

    Preci-Dip

    0
    RFQ
    514-87-356M26-001148

    Tabla de datos

    514 Bulk Active BGA 356 (26 x 26) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-91-241-18-075003

    510-91-241-18-075003

    SKT PGA SOLDRTL

    Mill-Max Manufacturing Corp.

    0
    RFQ
    510-91-241-18-075003

    Tabla de datos

    510 Bulk Active PGA 241 (18 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APH-0534-G-T

    APH-0534-G-T

    APH-0534-G-T

    Samtec Inc.

    0
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1034-G-T

    APH-1034-G-T

    APH-1034-G-T

    Samtec Inc.

    0
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1434-G-T

    APH-1434-G-T

    APH-1434-G-T

    Samtec Inc.

    0
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1234-G-T

    APH-1234-G-T

    APH-1234-G-T

    Samtec Inc.

    0
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0434-G-T

    APH-0434-G-T

    APH-0434-G-T

    Samtec Inc.

    0
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1634-G-T

    APH-1634-G-T

    APH-1634-G-T

    Samtec Inc.

    0
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
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