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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    144-PGM13095-11

    144-PGM13095-11

    CONN SOCKET PGA GOLD

    Aries Electronics

    0
    RFQ
    144-PGM13095-11

    Tabla de datos

    PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    28-3552-16

    28-3552-16

    CONN IC DIP SOCKET ZIF 28POS

    Aries Electronics

    0
    RFQ
    28-3552-16

    Tabla de datos

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    APH-0532-G-R

    APH-0532-G-R

    APH-0532-G-R

    Samtec Inc.

    0
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0932-G-R

    APH-0932-G-R

    APH-0932-G-R

    Samtec Inc.

    0
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0632-G-R

    APH-0632-G-R

    APH-0632-G-R

    Samtec Inc.

    0
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0332-G-R

    APH-0332-G-R

    APH-0332-G-R

    Samtec Inc.

    0
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1732-G-R

    APH-1732-G-R

    APH-1732-G-R

    Samtec Inc.

    0
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0832-G-R

    APH-0832-G-R

    APH-0832-G-R

    Samtec Inc.

    0
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    232-1270-01-0602

    232-1270-01-0602

    CONN SOCKET PGA ZIF 32POS GOLD

    3M

    0
    RFQ
    232-1270-01-0602

    Tabla de datos

    Textool™ Bulk Obsolete PGA, ZIF (ZIP) 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
    232-1270-02-0602

    232-1270-02-0602

    CONN SOCKET PGA ZIF 32POS GOLD

    3M

    0
    RFQ
    232-1270-02-0602

    Tabla de datos

    Textool™ Bulk Obsolete PGA, ZIF (ZIP) 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
    517-83-529-21-121111

    517-83-529-21-121111

    CONN SOCKET PGA 529POS GOLD

    Preci-Dip

    0
    RFQ
    517-83-529-21-121111

    Tabla de datos

    517 Bulk Active PGA 529 (21 x 21) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    232-1270-51-0602

    232-1270-51-0602

    STAGGERED ZIP STRIP POCKETS 32 C

    3M

    0
    RFQ

    -

    Textool™ - Obsolete - - - - - - - - - - - - - - -
    546-87-403-19-111147

    546-87-403-19-111147

    CONN SOCKET PGA 403POS GOLD

    Preci-Dip

    0
    RFQ
    546-87-403-19-111147

    Tabla de datos

    546 Bulk Active PGA 403 (19 x 19) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-93-223-18-095002

    510-93-223-18-095002

    SKT PGA SOLDRTL

    Mill-Max Manufacturing Corp.

    0
    RFQ
    510-93-223-18-095002

    Tabla de datos

    510 Tube Active PGA 223 (18 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    510-13-121-11-000002

    510-13-121-11-000002

    SKT PGA SOLDRTL

    Mill-Max Manufacturing Corp.

    0
    RFQ
    510-13-121-11-000002

    Tabla de datos

    510 Bulk Active PGA 121 (11 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    510-13-121-11-000003

    510-13-121-11-000003

    SKT PGA SOLDRTL

    Mill-Max Manufacturing Corp.

    0
    RFQ
    510-13-121-11-000003

    Tabla de datos

    510 Bulk Active PGA 121 (11 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    24-3572-16

    24-3572-16

    CONN IC DIP SOCKET ZIF 24POS

    Aries Electronics

    0
    RFQ
    24-3572-16

    Tabla de datos

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
    116-43-964-61-001000

    116-43-964-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    0
    RFQ

    -

    116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-964-61-001000

    116-93-964-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    0
    RFQ

    -

    116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    28-6556-41

    28-6556-41

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    0
    RFQ
    28-6556-41

    Tabla de datos

    6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder Cup 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    Total 19086 Record«Prev1... 868869870871872873874875...955Next»
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