Sesión o Registro
    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    144-PGM13095-11

    144-PGM13095-11

    CONN SOCKET PGA GOLD

    Aries Electronics

    2,198
    RFQ
    144-PGM13095-11

    Tabla de datos

    PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    28-3552-16

    28-3552-16

    CONN IC DIP SOCKET ZIF 28POS

    Aries Electronics

    3,961
    RFQ
    28-3552-16

    Tabla de datos

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    APH-0532-G-R

    APH-0532-G-R

    APH-0532-G-R

    Samtec Inc.

    2,210
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0932-G-R

    APH-0932-G-R

    APH-0932-G-R

    Samtec Inc.

    3,168
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0632-G-R

    APH-0632-G-R

    APH-0632-G-R

    Samtec Inc.

    4,209
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0332-G-R

    APH-0332-G-R

    APH-0332-G-R

    Samtec Inc.

    3,542
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1732-G-R

    APH-1732-G-R

    APH-1732-G-R

    Samtec Inc.

    3,081
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0832-G-R

    APH-0832-G-R

    APH-0832-G-R

    Samtec Inc.

    2,782
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    232-1270-01-0602

    232-1270-01-0602

    CONN SOCKET PGA ZIF 32POS GOLD

    3M

    2,666
    RFQ
    232-1270-01-0602

    Tabla de datos

    Textool™ Bulk Obsolete PGA, ZIF (ZIP) 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
    232-1270-02-0602

    232-1270-02-0602

    CONN SOCKET PGA ZIF 32POS GOLD

    3M

    2,983
    RFQ
    232-1270-02-0602

    Tabla de datos

    Textool™ Bulk Obsolete PGA, ZIF (ZIP) 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
    517-83-529-21-121111

    517-83-529-21-121111

    CONN SOCKET PGA 529POS GOLD

    Preci-Dip

    4,917
    RFQ
    517-83-529-21-121111

    Tabla de datos

    517 Bulk Active PGA 529 (21 x 21) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    232-1270-51-0602

    232-1270-51-0602

    STAGGERED ZIP STRIP POCKETS 32 C

    3M

    4,636
    RFQ

    -

    Textool™ - Obsolete - - - - - - - - - - - - - - -
    546-87-403-19-111147

    546-87-403-19-111147

    CONN SOCKET PGA 403POS GOLD

    Preci-Dip

    3,429
    RFQ
    546-87-403-19-111147

    Tabla de datos

    546 Bulk Active PGA 403 (19 x 19) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-93-223-18-095002

    510-93-223-18-095002

    SKT PGA SOLDRTL

    Mill-Max Manufacturing Corp.

    4,239
    RFQ
    510-93-223-18-095002

    Tabla de datos

    510 Tube Active PGA 223 (18 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    510-13-121-11-000002

    510-13-121-11-000002

    SKT PGA SOLDRTL

    Mill-Max Manufacturing Corp.

    2,906
    RFQ
    510-13-121-11-000002

    Tabla de datos

    510 Bulk Active PGA 121 (11 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    510-13-121-11-000003

    510-13-121-11-000003

    SKT PGA SOLDRTL

    Mill-Max Manufacturing Corp.

    2,813
    RFQ
    510-13-121-11-000003

    Tabla de datos

    510 Bulk Active PGA 121 (11 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    24-3572-16

    24-3572-16

    CONN IC DIP SOCKET ZIF 24POS

    Aries Electronics

    3,347
    RFQ
    24-3572-16

    Tabla de datos

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
    116-43-964-61-001000

    116-43-964-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,298
    RFQ

    -

    116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-964-61-001000

    116-93-964-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,450
    RFQ

    -

    116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    28-6556-41

    28-6556-41

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    4,355
    RFQ
    28-6556-41

    Tabla de datos

    6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder Cup 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    Total 19086 Record«Prev1... 868869870871872873874875...955Next»
    Correo electrónico
    Lo que contiene
    KATY Electronic Technology Co., LTD

    Casa

    KATY Electronic Technology Co., LTD

    Productos

    KATY Electronic Technology Co., LTD

    Teléfono

    KATY Electronic Technology Co., LTD

    Usuarios