Foto | N.º de Parte del Fabricante | Disponibilidad | Cantidad | Hoja de Datos | Serie | Embalaje | Estado del producto | Tipo | Número de posiciones o clavijas (cuadrícula) | Paso: acoplamiento | Acabado de contacto: acoplamiento | Espesor del acabado del contacto: acoplamiento | Material del contacto: acoplamiento | Tipo de montaje | Características | Terminación | Paso: poste | Acabado del contacto: poste | Espesor del acabado del contacto: poste | Material del contacto: Poste | Material de la carcasa | Temperatura de funcionamiento |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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APH-0632-G-TAPH-0632-G-T |
2,041 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-1332-G-TAPH-1332-G-T |
2,588 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-0732-G-TAPH-0732-G-T |
4,818 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-1132-G-TAPH-1132-G-T |
2,321 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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116-43-950-61-001000CONN IC SKT DBL |
4,153 |
|
- |
116 | Tube | Active | DIP, 0.9" (22.86mm) Row Spacing | 50 (2 x 25) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
![]() |
116-93-950-61-001000CONN IC SKT DBL |
2,802 |
|
- |
116 | Tube | Active | DIP, 0.9" (22.86mm) Row Spacing | 50 (2 x 25) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
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32-6554-16CONN IC DIP SOCKET ZIF 32POS |
2,552 |
|
![]() Tabla de datos |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
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APH-0430-G-RAPH-0430-G-R |
2,353 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-1830-G-RAPH-1830-G-R |
2,112 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-1530-G-RAPH-1530-G-R |
4,503 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-1930-G-RAPH-1930-G-R |
2,176 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-0630-G-RAPH-0630-G-R |
4,375 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-1230-G-RAPH-1230-G-R |
4,344 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-1330-G-RAPH-1330-G-R |
3,594 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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550-10-356M26-001166BGA PIN ADAPTER 1.27MM SMD |
2,937 |
|
![]() Tabla de datos |
550 | Bulk | Active | BGA | 356 (26 x 26) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
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116-43-952-61-001000CONN IC SKT DBL |
4,905 |
|
- |
116 | Tube | Active | DIP, 0.9" (22.86mm) Row Spacing | 52 (2 x 26) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
![]() |
116-93-952-61-001000CONN IC SKT DBL |
4,713 |
|
- |
116 | Tube | Active | DIP, 0.9" (22.86mm) Row Spacing | 52 (2 x 26) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
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517-83-528-21-121111CONN SOCKET PGA 528POS GOLD |
3,847 |
|
![]() Tabla de datos |
517 | Bulk | Active | PGA | 528 (21 x 21) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
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44-3571-11CONN IC DIP SOCKET ZIF 44POS GLD |
3,098 |
|
![]() Tabla de datos |
57 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 44 (2 x 22) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
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44-3575-11CONN IC DIP SOCKET ZIF 44POS TIN |
4,949 |
|
![]() Tabla de datos |
57 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 44 (2 x 22) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |