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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    AR06-HZL/01-TT

    AR06-HZL/01-TT

    CONN IC DIP SOCKET 6POS GOLD

    Assmann WSW Components

    3,599
    RFQ
    AR06-HZL/01-TT

    Tabla de datos

    - Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    AW 127-11/Z-T

    AW 127-11/Z-T

    SOCKET 11 CONTACTS SINGLE ROW

    Assmann WSW Components

    2,733
    RFQ
    AW 127-11/Z-T

    Tabla de datos

    - - Active - - - - - - - - - - - - - - -
    SIP1X06-011B

    SIP1X06-011B

    SIP1X06-011B-SIP SOCKET 6 CTS

    Amphenol ICC (FCI)

    3,866
    RFQ
    SIP1X06-011B

    Tabla de datos

    SIP1x Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    01-0518-11

    01-0518-11

    CONN SOCKET SIP 1POS GOLD

    Aries Electronics

    3,132
    RFQ
    01-0518-11

    Tabla de datos

    518 Bulk Active SIP 1 (1 x 1) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    HLS-2001-TT-12

    HLS-2001-TT-12

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,063
    RFQ
    HLS-2001-TT-12

    Tabla de datos

    HLS Bulk Active SIP 20 (20 x 1) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
    01-0518-10H

    01-0518-10H

    CONN SOCKET SIP 1POS GOLD

    Aries Electronics

    4,922
    RFQ
    01-0518-10H

    Tabla de datos

    518 Bulk Active SIP 1 (1 x 1) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    AW 127-12/Z-T

    AW 127-12/Z-T

    SOCKET 12 CONTACTS SINGLE ROW

    Assmann WSW Components

    4,416
    RFQ
    AW 127-12/Z-T

    Tabla de datos

    - - Active - - - - - - - - - - - - - - -
    1825093-1

    1825093-1

    CONN IC DIP SOCKET 6POS GOLD

    TE Connectivity AMP Connectors

    2,312
    RFQ
    1825093-1

    Tabla de datos

    Diplomate DL Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Thermoplastic, Glass Filled -55°C ~ 125°C
    110-87-306-41-005101

    110-87-306-41-005101

    CONN IC DIP SOCKET 6POS GOLD

    Preci-Dip

    2,318
    RFQ
    110-87-306-41-005101

    Tabla de datos

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-87-306-41-605101

    110-87-306-41-605101

    CONN IC DIP SOCKET 6POS GOLD

    Preci-Dip

    2,652
    RFQ
    110-87-306-41-605101

    Tabla de datos

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    614-87-304-41-001101

    614-87-304-41-001101

    CONN IC DIP SOCKET 321POS GOLD

    Preci-Dip

    4,308
    RFQ
    614-87-304-41-001101

    Tabla de datos

    614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 321 (21 x 21) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    DIP308-001B

    DIP308-001B

    DIP SOCKET 8 CTS

    Amphenol ICC (FCI)

    2,581
    RFQ
    DIP308-001B

    Tabla de datos

    - Bag Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    110-87-304-41-105101

    110-87-304-41-105101

    CONN IC DIP SOCKET 4POS GOLD

    Preci-Dip

    3,983
    RFQ
    110-87-304-41-105101

    Tabla de datos

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    SIP050-1X03-160B

    SIP050-1X03-160B

    1X03-160B-SIP SOCKET 3 CTS

    Amphenol ICC (FCI)

    4,170
    RFQ
    SIP050-1X03-160B

    Tabla de datos

    SIP050-1x Bulk Active SIP 3 (1 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    A14-LCG

    A14-LCG

    CONN IC DIP SOCKET 14POS GOLD

    Assmann WSW Components

    3,901
    RFQ

    -

    - - Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold - - Through Hole Open Frame - 0.100" (2.54mm) Gold - - - -
    1-390262-3

    1-390262-3

    CONN IC DIP SOCKET 32POS TIN

    TE Connectivity AMP Connectors

    4,993
    RFQ
    1-390262-3

    Tabla de datos

    - Tape & Reel (TR) Obsolete DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze - -40°C ~ 105°C
    612-87-304-41-001101

    612-87-304-41-001101

    CONN IC DIP SOCKET 4POS GOLD

    Preci-Dip

    2,263
    RFQ
    612-87-304-41-001101

    Tabla de datos

    612 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    AR 08 HGL-TT

    AR 08 HGL-TT

    SOCKET

    Assmann WSW Components

    3,339
    RFQ
    AR 08 HGL-TT

    Tabla de datos

    AR Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    01-0518-10T

    01-0518-10T

    CONN SOCKET SIP 1POS GOLD

    Aries Electronics

    4,905
    RFQ
    01-0518-10T

    Tabla de datos

    518 Bulk Active SIP 1 (1 x 1) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    110-83-304-41-001101

    110-83-304-41-001101

    CONN IC DIP SOCKET 4POS GOLD

    Preci-Dip

    3,505
    RFQ
    110-83-304-41-001101

    Tabla de datos

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    Total 19086 Record«Prev1... 8081828384858687...955Next»
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