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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    324-93-164-41-002000

    324-93-164-41-002000

    CONN SOCKET SIP 64POS GOLD

    Mill-Max Manufacturing Corp.

    3,849
    RFQ
    324-93-164-41-002000

    Tabla de datos

    324 Tube Active SIP 64 (1 x 64) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    122-13-952-41-001000

    122-13-952-41-001000

    CONN IC DIP SOCKET 52POS GOLD

    Mill-Max Manufacturing Corp.

    3,961
    RFQ
    122-13-952-41-001000

    Tabla de datos

    122 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    28-3508-21

    28-3508-21

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    3,256
    RFQ
    28-3508-21

    Tabla de datos

    508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    28-3508-31

    28-3508-31

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    2,396
    RFQ
    28-3508-31

    Tabla de datos

    508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    APH-1830-G-T

    APH-1830-G-T

    APH-1830-G-T

    Samtec Inc.

    3,213
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1530-G-T

    APH-1530-G-T

    APH-1530-G-T

    Samtec Inc.

    3,876
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0530-G-T

    APH-0530-G-T

    APH-0530-G-T

    Samtec Inc.

    4,741
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1030-G-T

    APH-1030-G-T

    APH-1030-G-T

    Samtec Inc.

    4,076
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0630-G-T

    APH-0630-G-T

    APH-0630-G-T

    Samtec Inc.

    4,157
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0230-G-T

    APH-0230-G-T

    APH-0230-G-T

    Samtec Inc.

    3,556
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0330-G-T

    APH-0330-G-T

    APH-0330-G-T

    Samtec Inc.

    3,309
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1330-G-T

    APH-1330-G-T

    APH-1330-G-T

    Samtec Inc.

    3,880
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    110-43-652-61-105000

    110-43-652-61-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,471
    RFQ

    -

    110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-43-952-61-105000

    110-43-952-61-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,712
    RFQ

    -

    110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    32-6575-11

    32-6575-11

    CONN IC DIP SOCKET ZIF 32POS TIN

    Aries Electronics

    4,152
    RFQ
    32-6575-11

    Tabla de datos

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    517-83-370-19-121111

    517-83-370-19-121111

    CONN SOCKET PGA 370POS GOLD

    Preci-Dip

    4,621
    RFQ
    517-83-370-19-121111

    Tabla de datos

    517 Bulk Active PGA 370 (19 x 19) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-93-640-61-007000

    116-93-640-61-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,646
    RFQ

    -

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-0515-G-2

    HLS-0515-G-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,371
    RFQ
    HLS-0515-G-2

    Tabla de datos

    HLS Bulk Active SIP 75 (5 x 15) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    APH-0428-G-R

    APH-0428-G-R

    APH-0428-G-R

    Samtec Inc.

    3,916
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0528-G-R

    APH-0528-G-R

    APH-0528-G-R

    Samtec Inc.

    4,468
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
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