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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    122-13-950-41-001000

    122-13-950-41-001000

    CONN IC DIP SOCKET 50POS GOLD

    Mill-Max Manufacturing Corp.

    3,587
    RFQ
    122-13-950-41-001000

    Tabla de datos

    122 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    510-93-068-11-061002

    510-93-068-11-061002

    SKT PGA SOLDRTL

    Mill-Max Manufacturing Corp.

    4,474
    RFQ
    510-93-068-11-061002

    Tabla de datos

    510 Bulk Active PGA 68 (11 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    28-6508-21

    28-6508-21

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    3,610
    RFQ
    28-6508-21

    Tabla de datos

    508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    28-6508-31

    28-6508-31

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    2,628
    RFQ
    28-6508-31

    Tabla de datos

    508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    550-80-241-18-071101

    550-80-241-18-071101

    PGA SOLDER TAIL

    Preci-Dip

    3,311
    RFQ
    550-80-241-18-071101

    Tabla de datos

    550 Bulk Active PGA 241 (18 x 18) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    APH-1822-G-T

    APH-1822-G-T

    APH-1822-G-T

    Samtec Inc.

    3,672
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0522-G-T

    APH-0522-G-T

    APH-0522-G-T

    Samtec Inc.

    3,428
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1022-G-T

    APH-1022-G-T

    APH-1022-G-T

    Samtec Inc.

    4,121
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0622-G-T

    APH-0622-G-T

    APH-0622-G-T

    Samtec Inc.

    2,320
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1722-G-T

    APH-1722-G-T

    APH-1722-G-T

    Samtec Inc.

    3,239
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0422-G-T

    APH-0422-G-T

    APH-0422-G-T

    Samtec Inc.

    4,236
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1222-G-T

    APH-1222-G-T

    APH-1222-G-T

    Samtec Inc.

    3,460
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    510-91-101-13-061002

    510-91-101-13-061002

    SKT PGA SOLDRTL

    Mill-Max Manufacturing Corp.

    2,593
    RFQ
    510-91-101-13-061002

    Tabla de datos

    510 Bulk Active PGA 101 (13 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-13-322-61-801000

    110-13-322-61-801000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,588
    RFQ

    -

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-83-181-15-051112

    614-83-181-15-051112

    CONN SOCKET PGA 181POS GOLD

    Preci-Dip

    2,158
    RFQ
    614-83-181-15-051112

    Tabla de datos

    614 Bulk Active PGA 181 (15 x 15) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-43-650-61-105000

    110-43-650-61-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,027
    RFQ

    -

    110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-43-950-61-105000

    110-43-950-61-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,660
    RFQ

    -

    110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-652-61-008000

    116-93-652-61-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,219
    RFQ

    -

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-432-61-008000

    116-43-432-61-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,118
    RFQ

    -

    116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    514-87-255M16-001148

    514-87-255M16-001148

    CONN SOCKET BGA 255POS GOLD

    Preci-Dip

    2,931
    RFQ
    514-87-255M16-001148

    Tabla de datos

    514 Bulk Active BGA 255 (16 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    Total 19086 Record«Prev1... 833834835836837838839840...955Next»
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