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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    36-3575-11

    36-3575-11

    CONN IC DIP SOCKET ZIF 36POS TIN

    Aries Electronics

    4,022
    RFQ
    36-3575-11

    Tabla de datos

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    36-6573-11

    36-6573-11

    CONN IC DIP SOCKET ZIF 36POS TIN

    Aries Electronics

    4,024
    RFQ
    36-6573-11

    Tabla de datos

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    36-6574-11

    36-6574-11

    CONN IC DIP SOCKET ZIF 36POS TIN

    Aries Electronics

    3,054
    RFQ
    36-6574-11

    Tabla de datos

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    44-6552-11

    44-6552-11

    CONN IC DIP SOCKET ZIF 44POS GLD

    Aries Electronics

    4,201
    RFQ
    44-6552-11

    Tabla de datos

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    44-6553-11

    44-6553-11

    CONN IC DIP SOCKET ZIF 44POS GLD

    Aries Electronics

    3,839
    RFQ
    44-6553-11

    Tabla de datos

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    550-10-192M16-001152

    550-10-192M16-001152

    BGA SOLDER TAIL

    Preci-Dip

    4,593
    RFQ
    550-10-192M16-001152

    Tabla de datos

    550 Bulk Active BGA 192 (16 x 16) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    115-43-950-61-001000

    115-43-950-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,446
    RFQ

    -

    115 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    441-PPG21001-10

    441-PPG21001-10

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,455
    RFQ
    441-PPG21001-10

    Tabla de datos

    - Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    116-43-650-61-001000

    116-43-650-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,935
    RFQ

    -

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    322-13-164-41-001000

    322-13-164-41-001000

    SOCKET 2 LEVEL WRAPOST SIP 64POS

    Mill-Max Manufacturing Corp.

    4,308
    RFQ
    322-13-164-41-001000

    Tabla de datos

    322 Tube Active SIP 64 (1 x 64) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-0512-G-2

    HLS-0512-G-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,738
    RFQ
    HLS-0512-G-2

    Tabla de datos

    HLS Bulk Active SIP 60 (5 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    110-13-624-61-801000

    110-13-624-61-801000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,762
    RFQ

    -

    110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-650-61-006000

    116-93-650-61-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,599
    RFQ

    -

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    714-43-258-31-018000

    714-43-258-31-018000

    CONN IC DIP SOCKET 58POS GOLD

    Mill-Max Manufacturing Corp.

    4,707
    RFQ
    714-43-258-31-018000

    Tabla de datos

    714 Bulk Active DIP, 0.1" (2.54mm) Row Spacing 58 (2 x 29) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    122-11-964-41-001000

    122-11-964-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,740
    RFQ
    122-11-964-41-001000

    Tabla de datos

    122 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APO-628-G-R

    APO-628-G-R

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,575
    RFQ
    APO-628-G-R

    Tabla de datos

    APO Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    517-83-411-20-111111

    517-83-411-20-111111

    CONN SOCKET PGA 411POS GOLD

    Preci-Dip

    3,657
    RFQ
    517-83-411-20-111111

    Tabla de datos

    517 Bulk Active PGA 411 (20 x 20) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    APH-0430-G-H

    APH-0430-G-H

    APH-0430-G-H

    Samtec Inc.

    2,558
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1030-G-H

    APH-1030-G-H

    APH-1030-G-H

    Samtec Inc.

    2,822
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0630-G-H

    APH-0630-G-H

    APH-0630-G-H

    Samtec Inc.

    4,436
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
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