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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    APA-628-G-M

    APA-628-G-M

    ADAPTER PLUG

    Samtec Inc.

    2,934
    RFQ
    APA-628-G-M

    Tabla de datos

    APA Tube Active - 28 (2 x 14) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    28-3553-11

    28-3553-11

    CONN IC DIP SOCKET ZIF 28POS GLD

    Aries Electronics

    4,246
    RFQ
    28-3553-11

    Tabla de datos

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    28-6551-11

    28-6551-11

    CONN IC DIP SOCKET ZIF 28POS GLD

    Aries Electronics

    4,430
    RFQ
    28-6551-11

    Tabla de datos

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    28-6552-11

    28-6552-11

    CONN IC DIP SOCKET ZIF 28POS GLD

    Aries Electronics

    4,408
    RFQ
    28-6552-11

    Tabla de datos

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    28-6553-11

    28-6553-11

    CONN IC DIP SOCKET ZIF 28POS

    Aries Electronics

    3,751
    RFQ
    28-6553-11

    Tabla de datos

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    28-3554-11

    28-3554-11

    CONN IC DIP SOCKET ZIF 24POS GLD

    Aries Electronics

    3,531
    RFQ
    28-3554-11

    Tabla de datos

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -55°C ~ 250°C
    115-41-964-41-001000

    115-41-964-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,404
    RFQ
    115-41-964-41-001000

    Tabla de datos

    115 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-91-964-41-001000

    115-91-964-41-001000

    SKT IC OPEN LOWPRO

    Mill-Max Manufacturing Corp.

    3,423
    RFQ
    115-91-964-41-001000

    Tabla de datos

    115 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    40-6556-30

    40-6556-30

    40 POS TEST SOCK RECEPT SOLDER

    Aries Electronics

    4,906
    RFQ

    -

    6556 - Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    40-6556-20

    40-6556-20

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    3,256
    RFQ
    40-6556-20

    Tabla de datos

    6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    121-11-432-41-001000

    121-11-432-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,567
    RFQ
    121-11-432-41-001000

    Tabla de datos

    121 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    121-11-632-41-001000

    121-11-632-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,067
    RFQ
    121-11-632-41-001000

    Tabla de datos

    121 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-41-650-41-007000

    116-41-650-41-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,631
    RFQ
    116-41-650-41-007000

    Tabla de datos

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-650-41-007000

    116-91-650-41-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,954
    RFQ
    116-91-650-41-007000

    Tabla de datos

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-41-642-31-018000

    614-41-642-31-018000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    4,877
    RFQ
    614-41-642-31-018000

    Tabla de datos

    614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-91-642-31-018000

    614-91-642-31-018000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    4,523
    RFQ
    614-91-642-31-018000

    Tabla de datos

    614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-99-310-61-001000

    110-99-310-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,984
    RFQ

    -

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    38-6823-90T

    38-6823-90T

    CONN IC DIP SOCKET 38POS TIN

    Aries Electronics

    2,350
    RFQ
    38-6823-90T

    Tabla de datos

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 38 (2 x 19) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    614-41-640-41-001000

    614-41-640-41-001000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    3,801
    RFQ
    614-41-640-41-001000

    Tabla de datos

    614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-91-640-41-001000

    614-91-640-41-001000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    3,954
    RFQ
    614-91-640-41-001000

    Tabla de datos

    614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    Total 19086 Record«Prev1... 699700701702703704705706...955Next»
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