Sesión o Registro
    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    614-87-145-15-081112

    614-87-145-15-081112

    CONN SOCKET PGA 145POS GOLD

    Preci-Dip

    3,822
    RFQ
    614-87-145-15-081112

    Tabla de datos

    614 Bulk Active PGA 145 (15 x 15) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    126-41-642-41-001000

    126-41-642-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,790
    RFQ
    126-41-642-41-001000

    Tabla de datos

    126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-91-642-41-001000

    126-91-642-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,487
    RFQ
    126-91-642-41-001000

    Tabla de datos

    126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-41-952-41-006000

    116-41-952-41-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,063
    RFQ
    116-41-952-41-006000

    Tabla de datos

    116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-952-41-006000

    116-91-952-41-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,855
    RFQ
    116-91-952-41-006000

    Tabla de datos

    116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-0510-T-10

    HLS-0510-T-10

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,085
    RFQ
    HLS-0510-T-10

    Tabla de datos

    HLS Bulk Active SIP 50 (5 x 10) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    104-11-636-41-780000

    104-11-636-41-780000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,858
    RFQ
    104-11-636-41-780000

    Tabla de datos

    104 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-93-432-41-001000

    614-93-432-41-001000

    SOCKET CARRIER LOWPRO .400 32POS

    Mill-Max Manufacturing Corp.

    2,035
    RFQ
    614-93-432-41-001000

    Tabla de datos

    614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-93-632-41-001000

    614-93-632-41-001000

    SOCKET CARRIER LOWPRO .600 32POS

    Mill-Max Manufacturing Corp.

    2,604
    RFQ
    614-93-632-41-001000

    Tabla de datos

    614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-43-432-41-001000

    614-43-432-41-001000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    4,915
    RFQ
    614-43-432-41-001000

    Tabla de datos

    614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-43-632-41-001000

    614-43-632-41-001000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    2,758
    RFQ
    614-43-632-41-001000

    Tabla de datos

    614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    546-87-182-14-001135

    546-87-182-14-001135

    CONN SOCKET PGA 182POS GOLD

    Preci-Dip

    3,048
    RFQ
    546-87-182-14-001135

    Tabla de datos

    546 Bulk Active PGA 182 (14 x 14) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    546-87-182-14-001136

    546-87-182-14-001136

    CONN SOCKET PGA 182POS GOLD

    Preci-Dip

    4,966
    RFQ
    546-87-182-14-001136

    Tabla de datos

    546 Bulk Active PGA 182 (14 x 14) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    123-91-642-41-001000

    123-91-642-41-001000

    SOCKET IC OPEN 3 LVL .600 42POS

    Mill-Max Manufacturing Corp.

    4,685
    RFQ

    -

    123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    123-41-642-41-001000

    123-41-642-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,526
    RFQ
    123-41-642-41-001000

    Tabla de datos

    123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    32-6621-30

    32-6621-30

    CONN IC DIP SOCKET 32POS TIN

    Aries Electronics

    4,577
    RFQ
    32-6621-30

    Tabla de datos

    6621 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Bottom Entry; Through Board Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    712-93-132-41-001000

    712-93-132-41-001000

    SOCKET CARRIER SIP 32POS

    Mill-Max Manufacturing Corp.

    4,304
    RFQ
    712-93-132-41-001000

    Tabla de datos

    712 Tube Active SIP 32 (1 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    514-83-144-12-000117

    514-83-144-12-000117

    CONN SOCKET PGA 144POS GOLD

    Preci-Dip

    2,789
    RFQ
    514-83-144-12-000117

    Tabla de datos

    514 Bulk Active PGA 144 (12 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    25-0503-21

    25-0503-21

    CONN SOCKET SIP 25POS GOLD

    Aries Electronics

    2,035
    RFQ
    25-0503-21

    Tabla de datos

    0503 Bulk Active SIP 25 (1 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
    18-3508-211

    18-3508-211

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    2,808
    RFQ
    18-3508-211

    Tabla de datos

    508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    Total 19086 Record«Prev1... 698699700701702703704705...955Next»
    Correo electrónico
    Lo que contiene
    KATY Electronic Technology Co., LTD

    Casa

    KATY Electronic Technology Co., LTD

    Productos

    KATY Electronic Technology Co., LTD

    Teléfono

    KATY Electronic Technology Co., LTD

    Usuarios