Sesión o Registro
    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    116-47-636-41-001000

    116-47-636-41-001000

    STANDRD SOLDRTL

    Mill-Max Manufacturing Corp.

    2,799
    RFQ
    116-47-636-41-001000

    Tabla de datos

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    546-83-133-14-002136

    546-83-133-14-002136

    CONN SOCKET PGA 133POS GOLD

    Preci-Dip

    4,937
    RFQ
    546-83-133-14-002136

    Tabla de datos

    546 Bulk Active PGA 133 (14 x 14) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICA-640-WGG-2

    ICA-640-WGG-2

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    2,285
    RFQ
    ICA-640-WGG-2

    Tabla de datos

    ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    22-4503-21

    22-4503-21

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    3,618
    RFQ
    22-4503-21

    Tabla de datos

    503 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    24-0508-21

    24-0508-21

    CONN SOCKET SIP 24POS GOLD

    Aries Electronics

    3,232
    RFQ
    24-0508-21

    Tabla de datos

    508 Bulk Active SIP 24 (1 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    24-1508-21

    24-1508-21

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    3,306
    RFQ
    24-1508-21

    Tabla de datos

    508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    714-43-159-31-018000

    714-43-159-31-018000

    CONN SOCKET SIP 59POS GOLD

    Mill-Max Manufacturing Corp.

    4,836
    RFQ
    714-43-159-31-018000

    Tabla de datos

    714 Bulk Active SIP 59 (1 x 59) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    34-81150-610C

    34-81150-610C

    CONN IC DIP SOCKET 34POS GOLD

    Aries Electronics

    3,259
    RFQ
    34-81150-610C

    Tabla de datos

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 34 (2 x 17) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    34-81250-610C

    34-81250-610C

    CONN IC DIP SOCKET 34POS GOLD

    Aries Electronics

    2,788
    RFQ
    34-81250-610C

    Tabla de datos

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 34 (2 x 17) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    614-41-642-31-012000

    614-41-642-31-012000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    2,166
    RFQ
    614-41-642-31-012000

    Tabla de datos

    614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-91-642-31-012000

    614-91-642-31-012000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    3,465
    RFQ
    614-91-642-31-012000

    Tabla de datos

    614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    316-93-132-41-008000

    316-93-132-41-008000

    SOCKET ELEVATED SIP 32POS

    Mill-Max Manufacturing Corp.

    2,826
    RFQ
    316-93-132-41-008000

    Tabla de datos

    316 Tube Active SIP 32 (1 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    550-80-149-15-063101

    550-80-149-15-063101

    PGA SOLDER TAIL

    Preci-Dip

    4,735
    RFQ
    550-80-149-15-063101

    Tabla de datos

    550 Bulk Active PGA 149 (15 x 15) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    323-93-132-41-001000

    323-93-132-41-001000

    CONN SOCKET SIP 32POS GOLD

    Mill-Max Manufacturing Corp.

    4,197
    RFQ
    323-93-132-41-001000

    Tabla de datos

    323 Tube Active SIP 32 (1 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-13-324-41-001000

    612-13-324-41-001000

    SOCKET CARRIER SLDRTL .300 24POS

    Mill-Max Manufacturing Corp.

    4,780
    RFQ
    612-13-324-41-001000

    Tabla de datos

    612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-13-424-41-001000

    612-13-424-41-001000

    SOCKET CARRIER SLDRTL .400 24POS

    Mill-Max Manufacturing Corp.

    3,306
    RFQ
    612-13-424-41-001000

    Tabla de datos

    612 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-13-624-41-001000

    612-13-624-41-001000

    SOCKET CARRIER SLDRTL .600 24POS

    Mill-Max Manufacturing Corp.

    3,194
    RFQ
    612-13-624-41-001000

    Tabla de datos

    612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    546-87-181-15-051135

    546-87-181-15-051135

    CONN SOCKET PGA 181POS GOLD

    Preci-Dip

    4,053
    RFQ
    546-87-181-15-051135

    Tabla de datos

    546 Bulk Active PGA 181 (15 x 15) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    546-87-181-15-051136

    546-87-181-15-051136

    CONN SOCKET PGA 181POS GOLD

    Preci-Dip

    2,681
    RFQ
    546-87-181-15-051136

    Tabla de datos

    546 Bulk Active PGA 181 (15 x 15) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0614-TT-22

    HLS-0614-TT-22

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,246
    RFQ
    HLS-0614-TT-22

    Tabla de datos

    HLS Bulk Active SIP 84 (6 x 14) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
    Total 19086 Record«Prev1... 696697698699700701702703...955Next»
    Correo electrónico
    Lo que contiene
    KATY Electronic Technology Co., LTD

    Casa

    KATY Electronic Technology Co., LTD

    Productos

    KATY Electronic Technology Co., LTD

    Teléfono

    KATY Electronic Technology Co., LTD

    Usuarios