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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    146-93-320-41-013000

    146-93-320-41-013000

    CONN IC DIP SOCKET 20POS GOLD

    Mill-Max Manufacturing Corp.

    2,540
    RFQ
    146-93-320-41-013000

    Tabla de datos

    146 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    146-43-320-41-013000

    146-43-320-41-013000

    CONN SKT DBL

    Mill-Max Manufacturing Corp.

    2,717
    RFQ
    146-43-320-41-013000

    Tabla de datos

    146 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    605-41-320-11-480000

    605-41-320-11-480000

    SKT CARRIER LOWPRO

    Mill-Max Manufacturing Corp.

    3,965
    RFQ
    605-41-320-11-480000

    Tabla de datos

    605 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    605-41-420-11-480000

    605-41-420-11-480000

    SKT CARRIER LOWPRO

    Mill-Max Manufacturing Corp.

    3,674
    RFQ
    605-41-420-11-480000

    Tabla de datos

    605 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    605-91-320-11-480000

    605-91-320-11-480000

    SKT CARRIER LOWPRO

    Mill-Max Manufacturing Corp.

    4,473
    RFQ
    605-91-320-11-480000

    Tabla de datos

    605 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    605-91-420-11-480000

    605-91-420-11-480000

    SKT CARRIER LOWPRO

    Mill-Max Manufacturing Corp.

    3,343
    RFQ
    605-91-420-11-480000

    Tabla de datos

    605 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-41-210-41-003000

    612-41-210-41-003000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    4,296
    RFQ
    612-41-210-41-003000

    Tabla de datos

    612 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-91-210-41-003000

    612-91-210-41-003000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    3,451
    RFQ
    612-91-210-41-003000

    Tabla de datos

    612 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-41-322-41-007000

    116-41-322-41-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,369
    RFQ
    116-41-322-41-007000

    Tabla de datos

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-41-422-41-007000

    116-41-422-41-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,492
    RFQ
    116-41-422-41-007000

    Tabla de datos

    116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-322-41-007000

    116-91-322-41-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,353
    RFQ
    116-91-322-41-007000

    Tabla de datos

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-422-41-007000

    116-91-422-41-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,287
    RFQ
    116-91-422-41-007000

    Tabla de datos

    116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    714-43-144-31-018000

    714-43-144-31-018000

    CONN SOCKET SIP 44POS GOLD

    Mill-Max Manufacturing Corp.

    3,375
    RFQ
    714-43-144-31-018000

    Tabla de datos

    714 Bulk Active SIP 44 (1 x 44) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    24-0501-21

    24-0501-21

    CONN SOCKET SIP 24POS GOLD

    Aries Electronics

    2,015
    RFQ
    24-0501-21

    Tabla de datos

    501 Bulk Active SIP 24 (1 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    24-0501-31

    24-0501-31

    CONN SOCKET SIP 24POS GOLD

    Aries Electronics

    3,953
    RFQ
    24-0501-31

    Tabla de datos

    501 Bulk Active SIP 24 (1 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    146-93-318-41-013000

    146-93-318-41-013000

    CONN IC DIP SOCKET 18POS GOLD

    Mill-Max Manufacturing Corp.

    2,719
    RFQ
    146-93-318-41-013000

    Tabla de datos

    146 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    146-43-318-41-013000

    146-43-318-41-013000

    CONN SKT DBL

    Mill-Max Manufacturing Corp.

    2,734
    RFQ
    146-43-318-41-013000

    Tabla de datos

    146 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    605-41-318-11-480000

    605-41-318-11-480000

    SKT CARRIER LOWPRO

    Mill-Max Manufacturing Corp.

    3,515
    RFQ
    605-41-318-11-480000

    Tabla de datos

    605 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    605-91-318-11-480000

    605-91-318-11-480000

    SKT CARRIER LOWPRO

    Mill-Max Manufacturing Corp.

    4,375
    RFQ
    605-91-318-11-480000

    Tabla de datos

    605 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    124-93-310-41-002000

    124-93-310-41-002000

    CONN IC DIP SOCKET 10POS GOLD

    Mill-Max Manufacturing Corp.

    3,325
    RFQ
    124-93-310-41-002000

    Tabla de datos

    124 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    Total 19086 Record«Prev1... 562563564565566567568569...955Next»
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