Sesión o Registro
    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    410-93-214-10-001000

    410-93-214-10-001000

    SOCKET DUAL IN-LINE SLDRTL 14POS

    Mill-Max Manufacturing Corp.

    2,001
    RFQ
    410-93-214-10-001000

    Tabla de datos

    410 Tube Active Zig-Zag, Left Stackable 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    38-6511-11

    38-6511-11

    CONN IC DIP SOCKET 38POS GOLD

    Aries Electronics

    2,468
    RFQ
    38-6511-11

    Tabla de datos

    511 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 38 (2 x 19) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    510-83-257-19-081101

    510-83-257-19-081101

    CONN SOCKET PGA 257POS GOLD

    Preci-Dip

    4,339
    RFQ
    510-83-257-19-081101

    Tabla de datos

    510 Bulk Active PGA 257 (19 x 19) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-41-320-41-008000

    116-41-320-41-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,289
    RFQ
    116-41-320-41-008000

    Tabla de datos

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-41-420-41-008000

    116-41-420-41-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,429
    RFQ
    116-41-420-41-008000

    Tabla de datos

    116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-320-41-008000

    116-91-320-41-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,277
    RFQ
    116-91-320-41-008000

    Tabla de datos

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-420-41-008000

    116-91-420-41-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,096
    RFQ
    116-91-420-41-008000

    Tabla de datos

    116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    346-93-156-41-013000

    346-93-156-41-013000

    CONN SOCKET SIP 56POS GOLD

    Mill-Max Manufacturing Corp.

    3,649
    RFQ
    346-93-156-41-013000

    Tabla de datos

    346 Bulk Active SIP 56 (1 x 56) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    346-43-156-41-013000

    346-43-156-41-013000

    CONN SOCKET SIP 56POS GOLD

    Mill-Max Manufacturing Corp.

    3,959
    RFQ
    346-43-156-41-013000

    Tabla de datos

    346 Bulk Active SIP 56 (1 x 56) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-41-318-41-008000

    116-41-318-41-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,847
    RFQ
    116-41-318-41-008000

    Tabla de datos

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-318-41-008000

    116-91-318-41-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,358
    RFQ
    116-91-318-41-008000

    Tabla de datos

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    27-7580-10

    27-7580-10

    CONN SOCKET SIP 27POS TIN

    Aries Electronics

    4,253
    RFQ
    27-7580-10

    Tabla de datos

    700 Elevator Strip-Line™ Bulk Active SIP 27 (1 x 27) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    123-11-210-41-001000

    123-11-210-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,187
    RFQ
    123-11-210-41-001000

    Tabla de datos

    123 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-318-41-003000

    116-93-318-41-003000

    CONN IC DIP SOCKET 18POS GOLD

    Mill-Max Manufacturing Corp.

    4,177
    RFQ
    116-93-318-41-003000

    Tabla de datos

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-318-41-003000

    116-43-318-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,322
    RFQ
    116-43-318-41-003000

    Tabla de datos

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-93-428-41-001000

    115-93-428-41-001000

    CONN IC DIP SOCKET 28POS GOLD

    Mill-Max Manufacturing Corp.

    2,079
    RFQ
    115-93-428-41-001000

    Tabla de datos

    115 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-43-428-41-001000

    115-43-428-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,430
    RFQ
    115-43-428-41-001000

    Tabla de datos

    115 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-320-41-003000

    116-93-320-41-003000

    CONN IC DIP SOCKET 20POS GOLD

    Mill-Max Manufacturing Corp.

    4,913
    RFQ
    116-93-320-41-003000

    Tabla de datos

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-420-41-003000

    116-93-420-41-003000

    CONN IC DIP SOCKET 20POS GOLD

    Mill-Max Manufacturing Corp.

    3,273
    RFQ
    116-93-420-41-003000

    Tabla de datos

    116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-320-41-003000

    116-43-320-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,628
    RFQ
    116-43-320-41-003000

    Tabla de datos

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    Total 19086 Record«Prev1... 558559560561562563564565...955Next»
    KATY Electronic Technology Co., LTD

    Casa

    KATY Electronic Technology Co., LTD

    Productos

    KATY Electronic Technology Co., LTD

    Teléfono

    KATY Electronic Technology Co., LTD

    Usuarios