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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    116-83-652-41-013101

    116-83-652-41-013101

    CONN IC DIP SOCKET 52POS GOLD

    Preci-Dip

    3,674
    RFQ
    116-83-652-41-013101

    Tabla de datos

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    614-41-320-31-012000

    614-41-320-31-012000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    4,407
    RFQ
    614-41-320-31-012000

    Tabla de datos

    614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-41-420-31-012000

    614-41-420-31-012000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    3,011
    RFQ
    614-41-420-31-012000

    Tabla de datos

    614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-91-320-31-012000

    614-91-320-31-012000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    2,838
    RFQ
    614-91-320-31-012000

    Tabla de datos

    614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-91-420-31-012000

    614-91-420-31-012000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    3,157
    RFQ
    614-91-420-31-012000

    Tabla de datos

    614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-41-318-31-012000

    614-41-318-31-012000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    2,270
    RFQ
    614-41-318-31-012000

    Tabla de datos

    614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-91-318-31-012000

    614-91-318-31-012000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    2,880
    RFQ
    614-91-318-31-012000

    Tabla de datos

    614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-322-41-006000

    116-93-322-41-006000

    CONN IC DIP SOCKET 22POS GOLD

    Mill-Max Manufacturing Corp.

    2,592
    RFQ
    116-93-322-41-006000

    Tabla de datos

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-422-41-006000

    116-93-422-41-006000

    CONN IC DIP SOCKET 22POS GOLD

    Mill-Max Manufacturing Corp.

    2,319
    RFQ
    116-93-422-41-006000

    Tabla de datos

    116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-322-41-006000

    116-43-322-41-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,819
    RFQ
    116-43-322-41-006000

    Tabla de datos

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-422-41-006000

    116-43-422-41-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,134
    RFQ
    116-43-422-41-006000

    Tabla de datos

    116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-41-320-31-002000

    614-41-320-31-002000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    2,216
    RFQ
    614-41-320-31-002000

    Tabla de datos

    614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-41-420-31-002000

    614-41-420-31-002000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    2,677
    RFQ
    614-41-420-31-002000

    Tabla de datos

    614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-91-320-31-002000

    614-91-320-31-002000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    4,740
    RFQ
    614-91-320-31-002000

    Tabla de datos

    614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-91-420-31-002000

    614-91-420-31-002000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    4,665
    RFQ
    614-91-420-31-002000

    Tabla de datos

    614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    114-47-642-41-117000

    114-47-642-41-117000

    STANDRD SOLDRTL DBL SKT

    Mill-Max Manufacturing Corp.

    4,106
    RFQ
    114-47-642-41-117000

    Tabla de datos

    114 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    346-93-157-41-013000

    346-93-157-41-013000

    CONN SOCKET SIP 57POS GOLD

    Mill-Max Manufacturing Corp.

    4,534
    RFQ
    346-93-157-41-013000

    Tabla de datos

    346 Bulk Active SIP 57 (1 x 57) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    346-43-157-41-013000

    346-43-157-41-013000

    CONN SOCKET SIP 57POS GOLD

    Mill-Max Manufacturing Corp.

    2,350
    RFQ
    346-43-157-41-013000

    Tabla de datos

    346 Bulk Active SIP 57 (1 x 57) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-316-41-007000

    116-93-316-41-007000

    CONN IC DIP SOCKET 16POS GOLD

    Mill-Max Manufacturing Corp.

    2,150
    RFQ
    116-93-316-41-007000

    Tabla de datos

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-316-41-007000

    116-43-316-41-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,704
    RFQ
    116-43-316-41-007000

    Tabla de datos

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    Total 19086 Record«Prev1... 565566567568569570571572...955Next»
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