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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    APA-314-T-B

    APA-314-T-B

    ADAPTER PLUG

    Samtec Inc.

    2,182
    RFQ
    APA-314-T-B

    Tabla de datos

    APA Bulk Active - 14 (2 x 7) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    121-13-304-41-001000

    121-13-304-41-001000

    CONN IC DIP SOCKET 4POS GOLD

    Mill-Max Manufacturing Corp.

    2,285
    RFQ
    121-13-304-41-001000

    Tabla de datos

    121 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    08-6503-21

    08-6503-21

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    2,876
    RFQ
    08-6503-21

    Tabla de datos

    503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    08-6503-31

    08-6503-31

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    2,527
    RFQ
    08-6503-31

    Tabla de datos

    503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    24-6513-10H

    24-6513-10H

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    2,008
    RFQ
    24-6513-10H

    Tabla de datos

    Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    346-93-129-41-013000

    346-93-129-41-013000

    CONN SOCKET SIP 29POS GOLD

    Mill-Max Manufacturing Corp.

    3,459
    RFQ
    346-93-129-41-013000

    Tabla de datos

    346 Bulk Active SIP 29 (1 x 29) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    346-43-129-41-013000

    346-43-129-41-013000

    CONN SOCKET SIP 29POS GOLD

    Mill-Max Manufacturing Corp.

    3,272
    RFQ
    346-43-129-41-013000

    Tabla de datos

    346 Bulk Active SIP 29 (1 x 29) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    40-6513-11

    40-6513-11

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    3,980
    RFQ
    40-6513-11

    Tabla de datos

    Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    ICA-320-ZSGG

    ICA-320-ZSGG

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    2,086
    RFQ
    ICA-320-ZSGG

    Tabla de datos

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    37-0518-11H

    37-0518-11H

    CONN SOCKET SIP 37POS GOLD

    Aries Electronics

    2,489
    RFQ
    37-0518-11H

    Tabla de datos

    518 Bulk Active SIP 37 (1 x 37) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    14-810-90RWR

    14-810-90RWR

    CONN IC DIP SOCKET 14POS TIN

    Aries Electronics

    4,191
    RFQ
    14-810-90RWR

    Tabla de datos

    Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    ICA-422-SGG-L

    ICA-422-SGG-L

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    2,484
    RFQ
    ICA-422-SGG-L

    Tabla de datos

    ICA Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    116-83-636-41-004101

    116-83-636-41-004101

    CONN IC DIP SOCKET 36POS GOLD

    Preci-Dip

    3,850
    RFQ
    116-83-636-41-004101

    Tabla de datos

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    28-3518-111

    28-3518-111

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    3,795
    RFQ
    28-3518-111

    Tabla de datos

    518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    28-6518-111

    28-6518-111

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    2,427
    RFQ
    28-6518-111

    Tabla de datos

    518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    510-87-225-15-000101

    510-87-225-15-000101

    CONN SOCKET PGA 225POS GOLD

    Preci-Dip

    4,752
    RFQ
    510-87-225-15-000101

    Tabla de datos

    510 Bulk Active PGA 225 (15 x 15) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    APO-422-T-J

    APO-422-T-J

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    2,475
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    HLS-0209-G-11

    HLS-0209-G-11

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,120
    RFQ
    HLS-0209-G-11

    Tabla de datos

    HLS Tube Active SIP 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    HLS-0308-G-2

    HLS-0308-G-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,179
    RFQ
    HLS-0308-G-2

    Tabla de datos

    HLS Tube Active SIP 24 (3 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    12-0503-21

    12-0503-21

    CONN SOCKET SIP 12POS GOLD

    Aries Electronics

    3,530
    RFQ
    12-0503-21

    Tabla de datos

    0503 Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
    Total 19086 Record«Prev1... 375376377378379380381382...955Next»
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