Sesión o Registro
    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    APA-314-T-B

    APA-314-T-B

    ADAPTER PLUG

    Samtec Inc.

    2,182
    RFQ
    APA-314-T-B

    Tabla de datos

    APA Bulk Active - 14 (2 x 7) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    121-13-304-41-001000

    121-13-304-41-001000

    CONN IC DIP SOCKET 4POS GOLD

    Mill-Max Manufacturing Corp.

    2,285
    RFQ
    121-13-304-41-001000

    Tabla de datos

    121 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    08-6503-21

    08-6503-21

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    2,876
    RFQ
    08-6503-21

    Tabla de datos

    503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    08-6503-31

    08-6503-31

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    2,527
    RFQ
    08-6503-31

    Tabla de datos

    503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    24-6513-10H

    24-6513-10H

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    2,008
    RFQ
    24-6513-10H

    Tabla de datos

    Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    346-93-129-41-013000

    346-93-129-41-013000

    CONN SOCKET SIP 29POS GOLD

    Mill-Max Manufacturing Corp.

    3,459
    RFQ
    346-93-129-41-013000

    Tabla de datos

    346 Bulk Active SIP 29 (1 x 29) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    346-43-129-41-013000

    346-43-129-41-013000

    CONN SOCKET SIP 29POS GOLD

    Mill-Max Manufacturing Corp.

    3,272
    RFQ
    346-43-129-41-013000

    Tabla de datos

    346 Bulk Active SIP 29 (1 x 29) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    40-6513-11

    40-6513-11

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    3,980
    RFQ
    40-6513-11

    Tabla de datos

    Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    ICA-320-ZSGG

    ICA-320-ZSGG

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    2,086
    RFQ
    ICA-320-ZSGG

    Tabla de datos

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    37-0518-11H

    37-0518-11H

    CONN SOCKET SIP 37POS GOLD

    Aries Electronics

    2,489
    RFQ
    37-0518-11H

    Tabla de datos

    518 Bulk Active SIP 37 (1 x 37) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    14-810-90RWR

    14-810-90RWR

    CONN IC DIP SOCKET 14POS TIN

    Aries Electronics

    4,191
    RFQ
    14-810-90RWR

    Tabla de datos

    Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    ICA-422-SGG-L

    ICA-422-SGG-L

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    2,484
    RFQ
    ICA-422-SGG-L

    Tabla de datos

    ICA Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    116-83-636-41-004101

    116-83-636-41-004101

    CONN IC DIP SOCKET 36POS GOLD

    Preci-Dip

    3,850
    RFQ
    116-83-636-41-004101

    Tabla de datos

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    28-3518-111

    28-3518-111

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    3,795
    RFQ
    28-3518-111

    Tabla de datos

    518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    28-6518-111

    28-6518-111

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    2,427
    RFQ
    28-6518-111

    Tabla de datos

    518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    510-87-225-15-000101

    510-87-225-15-000101

    CONN SOCKET PGA 225POS GOLD

    Preci-Dip

    4,752
    RFQ
    510-87-225-15-000101

    Tabla de datos

    510 Bulk Active PGA 225 (15 x 15) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    APO-422-T-J

    APO-422-T-J

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    2,475
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    HLS-0209-G-11

    HLS-0209-G-11

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,120
    RFQ
    HLS-0209-G-11

    Tabla de datos

    HLS Tube Active SIP 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    HLS-0308-G-2

    HLS-0308-G-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,179
    RFQ
    HLS-0308-G-2

    Tabla de datos

    HLS Tube Active SIP 24 (3 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    12-0503-21

    12-0503-21

    CONN SOCKET SIP 12POS GOLD

    Aries Electronics

    3,530
    RFQ
    12-0503-21

    Tabla de datos

    0503 Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
    Total 19086 Record«Prev1... 375376377378379380381382...955Next»
    Correo electrónico
    Lo que contiene
    KATY Electronic Technology Co., LTD

    Casa

    KATY Electronic Technology Co., LTD

    Productos

    KATY Electronic Technology Co., LTD

    Teléfono

    KATY Electronic Technology Co., LTD

    Usuarios