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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    605-41-304-11-480000

    605-41-304-11-480000

    SKT CARRIER LOWPRO

    Mill-Max Manufacturing Corp.

    3,762
    RFQ
    605-41-304-11-480000

    Tabla de datos

    605 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    605-91-304-11-480000

    605-91-304-11-480000

    SKT CARRIER LOWPRO

    Mill-Max Manufacturing Corp.

    3,647
    RFQ
    605-91-304-11-480000

    Tabla de datos

    605 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    5-1437535-4

    5-1437535-4

    CONN SOCKET SIP 20POS GOLD

    TE Connectivity AMP Connectors

    4,950
    RFQ

    -

    500 Tube Obsolete SIP 20 (1 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper - -
    34-0518-11H

    34-0518-11H

    CONN SOCKET SIP 34POS GOLD

    Aries Electronics

    2,806
    RFQ
    34-0518-11H

    Tabla de datos

    518 Bulk Active SIP 34 (1 x 34) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    34-1518-11H

    34-1518-11H

    CONN IC DIP SOCKET 34POS GOLD

    Aries Electronics

    3,182
    RFQ
    34-1518-11H

    Tabla de datos

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 34 (2 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    20-6820-90TWR

    20-6820-90TWR

    CONN IC DIP SOCKET 20POS TIN

    Aries Electronics

    2,492
    RFQ
    20-6820-90TWR

    Tabla de datos

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    116-87-628-41-013101

    116-87-628-41-013101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    3,914
    RFQ
    116-87-628-41-013101

    Tabla de datos

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-133-13-002101

    510-83-133-13-002101

    CONN SOCKET PGA 133POS GOLD

    Preci-Dip

    4,093
    RFQ
    510-83-133-13-002101

    Tabla de datos

    510 Bulk Active PGA 133 (13 x 13) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-133-13-041101

    510-83-133-13-041101

    CONN SOCKET PGA 133POS GOLD

    Preci-Dip

    3,723
    RFQ
    510-83-133-13-041101

    Tabla de datos

    510 Bulk Active PGA 133 (13 x 13) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    24-3518-10E

    24-3518-10E

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    4,335
    RFQ
    24-3518-10E

    Tabla de datos

    518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    510-87-224-18-091101

    510-87-224-18-091101

    CONN SOCKET PGA 224POS GOLD

    Preci-Dip

    2,504
    RFQ
    510-87-224-18-091101

    Tabla de datos

    510 Bulk Active PGA 224 (18 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    11-0503-21

    11-0503-21

    CONN SOCKET SIP 11POS GOLD

    Aries Electronics

    3,519
    RFQ
    11-0503-21

    Tabla de datos

    0503 Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
    11-0503-31

    11-0503-31

    CONN SOCKET SIP 11POS GOLD

    Aries Electronics

    2,081
    RFQ
    11-0503-31

    Tabla de datos

    0503 Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
    39-0518-00

    39-0518-00

    CONN SOCKET SIP 39POS GOLD

    Aries Electronics

    3,852
    RFQ
    39-0518-00

    Tabla de datos

    518 Bulk Active SIP 39 (1 x 39) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    14-820-90

    14-820-90

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    2,014
    RFQ
    14-820-90

    Tabla de datos

    Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    116-83-648-41-002101

    116-83-648-41-002101

    CONN IC DIP SOCKET 48POS GOLD

    Preci-Dip

    2,517
    RFQ
    116-83-648-41-002101

    Tabla de datos

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    APO-314-T-H

    APO-314-T-H

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,541
    RFQ
    APO-314-T-H

    Tabla de datos

    APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    HLS-0120-G-2

    HLS-0120-G-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,152
    RFQ
    HLS-0120-G-2

    Tabla de datos

    HLS Tube Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    HLS-0314-TT-22

    HLS-0314-TT-22

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,138
    RFQ
    HLS-0314-TT-22

    Tabla de datos

    HLS Tube Active SIP 42 (3 x 14) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
    ICA-628-SGT-L

    ICA-628-SGT-L

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    2,236
    RFQ
    ICA-628-SGT-L

    Tabla de datos

    ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    Total 19086 Record«Prev1... 359360361362363364365366...955Next»
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