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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    104-11-304-41-770000

    104-11-304-41-770000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,756
    RFQ
    104-11-304-41-770000

    Tabla de datos

    104 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    346-93-126-41-013000

    346-93-126-41-013000

    CONN SOCKET SIP 26POS GOLD

    Mill-Max Manufacturing Corp.

    2,340
    RFQ
    346-93-126-41-013000

    Tabla de datos

    346 Bulk Active SIP 26 (1 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    346-43-126-41-013000

    346-43-126-41-013000

    CONN SOCKET SIP 26POS GOLD

    Mill-Max Manufacturing Corp.

    4,433
    RFQ
    346-43-126-41-013000

    Tabla de datos

    346 Bulk Active SIP 26 (1 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    510-83-121-13-001101

    510-83-121-13-001101

    CONN SOCKET PGA 121POS GOLD

    Preci-Dip

    4,146
    RFQ
    510-83-121-13-001101

    Tabla de datos

    510 Bulk Active PGA 121 (13 x 13) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-121-13-041101

    510-83-121-13-041101

    CONN SOCKET PGA 121POS GOLD

    Preci-Dip

    2,427
    RFQ
    510-83-121-13-041101

    Tabla de datos

    510 Bulk Active PGA 121 (13 x 13) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    48-6518-11

    48-6518-11

    CONN IC DIP SOCKET 48POS GOLD

    Aries Electronics

    3,703
    RFQ
    48-6518-11

    Tabla de datos

    518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    16-6501-30

    16-6501-30

    CONN IC DIP SOCKET 16POS TIN

    Aries Electronics

    3,230
    RFQ
    16-6501-30

    Tabla de datos

    501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    APA-624-T-M

    APA-624-T-M

    ADAPTER PLUG

    Samtec Inc.

    3,042
    RFQ
    APA-624-T-M

    Tabla de datos

    APA Tube Active - 24 (2 x 12) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    APA-422-T-M

    APA-422-T-M

    ADAPTER PLUG

    Samtec Inc.

    3,522
    RFQ
    APA-422-T-M

    Tabla de datos

    APA Bulk Active - 22 (2 x 11) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    08-2810-90

    08-2810-90

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    3,483
    RFQ
    08-2810-90

    Tabla de datos

    Vertisockets™ 800 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    24-516-10

    24-516-10

    CONN IC DIP SOCKET ZIF 24POS TIN

    Aries Electronics

    4,847
    RFQ
    24-516-10

    Tabla de datos

    516 Bulk Obsolete DIP, ZIF (ZIP) 24 (2 x 12) 0.100" (2.54mm) Tin 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled -
    ICO-316-AGT

    ICO-316-AGT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    2,786
    RFQ
    ICO-316-AGT

    Tabla de datos

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICA-648-ZSTT

    ICA-648-ZSTT

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    3,391
    RFQ
    ICA-648-ZSTT

    Tabla de datos

    ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    APA-632-T-A1

    APA-632-T-A1

    ADAPTER PLUG

    Samtec Inc.

    3,594
    RFQ
    APA-632-T-A1

    Tabla de datos

    APA Bulk Active - 32 (2 x 16) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    PGA179H003B1-1836R

    PGA179H003B1-1836R

    PGA SOCKET 179 CTS

    Amphenol ICC (FCI)

    2,799
    RFQ
    PGA179H003B1-1836R

    Tabla de datos

    - - Active PGA 179 (18 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Open Frame - - - - - - -
    ICO-320-MGG

    ICO-320-MGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,216
    RFQ
    ICO-320-MGG

    Tabla de datos

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    510-83-132-13-001101

    510-83-132-13-001101

    CONN SOCKET PGA 132POS GOLD

    Preci-Dip

    4,679
    RFQ
    510-83-132-13-001101

    Tabla de datos

    510 Bulk Active PGA 132 (13 x 13) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-132-13-041101

    510-83-132-13-041101

    CONN SOCKET PGA 132POS GOLD

    Preci-Dip

    2,747
    RFQ
    510-83-132-13-041101

    Tabla de datos

    510 Bulk Active PGA 132 (13 x 13) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-132-14-001101

    510-83-132-14-001101

    CONN SOCKET PGA 132POS GOLD

    Preci-Dip

    3,702
    RFQ
    510-83-132-14-001101

    Tabla de datos

    510 Bulk Active PGA 132 (14 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    18-3511-11

    18-3511-11

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    2,266
    RFQ
    18-3511-11

    Tabla de datos

    511 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    Total 19086 Record«Prev1... 356357358359360361362363...955Next»
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