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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    104-13-304-41-770000

    104-13-304-41-770000

    CONN IC DIP SOCKET 4POS GOLD

    Mill-Max Manufacturing Corp.

    3,257
    RFQ
    104-13-304-41-770000

    Tabla de datos

    104 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic -
    21-0508-20

    21-0508-20

    CONN SOCKET SIP 21POS GOLD

    Aries Electronics

    3,517
    RFQ
    21-0508-20

    Tabla de datos

    508 Bulk Active SIP 21 (1 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    605-93-304-11-480000

    605-93-304-11-480000

    SOCKET CARRIER LOWPRO .300 4POS

    Mill-Max Manufacturing Corp.

    2,816
    RFQ
    605-93-304-11-480000

    Tabla de datos

    605 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    605-43-304-11-480000

    605-43-304-11-480000

    SKT CARRIER LOWPRO

    Mill-Max Manufacturing Corp.

    4,527
    RFQ
    605-43-304-11-480000

    Tabla de datos

    605 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    16-C280-11H

    16-C280-11H

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    3,187
    RFQ
    16-C280-11H

    Tabla de datos

    EJECT-A-DIP™ Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    ICA-314-ZWGG

    ICA-314-ZWGG

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    3,353
    RFQ
    ICA-314-ZWGG

    Tabla de datos

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    28-3513-11

    28-3513-11

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    2,206
    RFQ
    28-3513-11

    Tabla de datos

    Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    24-6518-11H

    24-6518-11H

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    4,974
    RFQ
    24-6518-11H

    Tabla de datos

    518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    510-83-125-13-041101

    510-83-125-13-041101

    CONN SOCKET PGA 125POS GOLD

    Preci-Dip

    4,248
    RFQ
    510-83-125-13-041101

    Tabla de datos

    510 Bulk Active PGA 125 (13 x 13) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICO-628-LGT

    ICO-628-LGT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,320
    RFQ
    ICO-628-LGT

    Tabla de datos

    ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    714-43-121-31-018000

    714-43-121-31-018000

    CONN SOCKET SIP 21POS GOLD

    Mill-Max Manufacturing Corp.

    3,855
    RFQ
    714-43-121-31-018000

    Tabla de datos

    714 Bulk Active SIP 21 (1 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APH-0508-T-H

    APH-0508-T-H

    APH-0508-T-H

    Samtec Inc.

    4,314
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1908-T-H

    APH-1908-T-H

    APH-1908-T-H

    Samtec Inc.

    2,003
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0608-T-H

    APH-0608-T-H

    APH-0608-T-H

    Samtec Inc.

    4,079
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0908-T-H

    APH-0908-T-H

    APH-0908-T-H

    Samtec Inc.

    3,381
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1408-T-H

    APH-1408-T-H

    APH-1408-T-H

    Samtec Inc.

    2,669
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0708-T-H

    APH-0708-T-H

    APH-0708-T-H

    Samtec Inc.

    4,204
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1208-T-H

    APH-1208-T-H

    APH-1208-T-H

    Samtec Inc.

    2,010
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1808-T-H

    APH-1808-T-H

    APH-1808-T-H

    Samtec Inc.

    4,441
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    28-6518-102

    28-6518-102

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    2,170
    RFQ
    28-6518-102

    Tabla de datos

    518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    Total 19086 Record«Prev1... 361362363364365366367368...955Next»
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