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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    116-83-636-41-007101

    116-83-636-41-007101

    CONN IC DIP SOCKET 36POS GOLD

    Preci-Dip

    2,557
    RFQ
    116-83-636-41-007101

    Tabla de datos

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0110-G-11

    HLS-0110-G-11

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,892
    RFQ
    HLS-0110-G-11

    Tabla de datos

    HLS Tube Active SIP 10 (1 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    ICA-314-ZAGT

    ICA-314-ZAGT

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    2,783
    RFQ
    ICA-314-ZAGT

    Tabla de datos

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICA-314-WGT

    ICA-314-WGT

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    3,242
    RFQ
    ICA-314-WGT

    Tabla de datos

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    510-87-143-15-081101

    510-87-143-15-081101

    CONN SOCKET PGA 143POS GOLD

    Preci-Dip

    2,859
    RFQ
    510-87-143-15-081101

    Tabla de datos

    510 Bulk Active PGA 143 (15 x 15) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-628-41-011101

    116-83-628-41-011101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    2,572
    RFQ
    116-83-628-41-011101

    Tabla de datos

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICA-624-WTT-2

    ICA-624-WTT-2

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    2,284
    RFQ
    ICA-624-WTT-2

    Tabla de datos

    ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    122-87-640-41-001101

    122-87-640-41-001101

    CONN IC DIP SOCKET 40POS GOLD

    Preci-Dip

    4,705
    RFQ
    122-87-640-41-001101

    Tabla de datos

    122 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0210-T-2

    HLS-0210-T-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,670
    RFQ
    HLS-0210-T-2

    Tabla de datos

    HLS Tube Active SIP 20 (2 x 10) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    346-43-116-41-013000

    346-43-116-41-013000

    CONN SOCKET SIP 16POS GOLD

    Mill-Max Manufacturing Corp.

    3,235
    RFQ
    346-43-116-41-013000

    Tabla de datos

    346 Bulk Active SIP 16 (1 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    848-AG11D-ES

    848-AG11D-ES

    CONN IC DIP SOCKET 48POS GOLD

    TE Connectivity AMP Connectors

    3,165
    RFQ
    848-AG11D-ES

    Tabla de datos

    800 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead - Copper Alloy Polyester -55°C ~ 105°C
    07-0503-21

    07-0503-21

    CONN SOCKET SIP 7POS GOLD

    Aries Electronics

    4,122
    RFQ
    07-0503-21

    Tabla de datos

    0503 Bulk Active SIP 7 (1 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
    07-0503-31

    07-0503-31

    CONN SOCKET SIP 7POS GOLD

    Aries Electronics

    3,113
    RFQ
    07-0503-31

    Tabla de datos

    0503 Bulk Active SIP 7 (1 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
    08-2820-90

    08-2820-90

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    4,201
    RFQ
    08-2820-90

    Tabla de datos

    Vertisockets™ 800 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    08-6820-90C

    08-6820-90C

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    3,663
    RFQ
    08-6820-90C

    Tabla de datos

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    08-6823-90C

    08-6823-90C

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    3,714
    RFQ
    08-6823-90C

    Tabla de datos

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    217-83-764-41-005101

    217-83-764-41-005101

    DIL SOLDER TAIL 1.778MM

    Preci-Dip

    2,578
    RFQ

    -

    217 - Active - - - - - - - - - - - - - - -
    146-83-636-41-035101

    146-83-636-41-035101

    CONN IC DIP SOCKET 36POS GOLD

    Preci-Dip

    2,753
    RFQ
    146-83-636-41-035101

    Tabla de datos

    146 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    146-83-636-41-036101

    146-83-636-41-036101

    CONN IC DIP SOCKET 36POS GOLD

    Preci-Dip

    4,029
    RFQ
    146-83-636-41-036101

    Tabla de datos

    146 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    4593

    4593

    CONN SOCKET TRANSIST TO-100 8POS

    Keystone Electronics

    3,885
    RFQ
    4593

    Tabla de datos

    - Bulk Active Transistor, TO-100 8 (Round) - Tin - Brass Chassis Mount Closed Frame Solder - Tin - Brass Polyester, Glass Filled -
    Total 19086 Record«Prev1... 281282283284285286287288...955Next»
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