Sesión o Registro
    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    510-87-145-15-081101

    510-87-145-15-081101

    CONN SOCKET PGA 145POS GOLD

    Preci-Dip

    4,168
    RFQ
    510-87-145-15-081101

    Tabla de datos

    510 Bulk Active PGA 145 (15 x 15) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0503-T-2

    HLS-0503-T-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,510
    RFQ
    HLS-0503-T-2

    Tabla de datos

    HLS Bulk Active SIP 15 (5 x 3) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    299-87-324-10-001101

    299-87-324-10-001101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    3,047
    RFQ
    299-87-324-10-001101

    Tabla de datos

    299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICO-318-LGT

    ICO-318-LGT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    2,703
    RFQ
    ICO-318-LGT

    Tabla de datos

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    916657-3

    916657-3

    CONN SOCKET PGA ZIF 321POS GOLD

    TE Connectivity AMP Connectors

    2,375
    RFQ
    916657-3

    Tabla de datos

    - Tray Obsolete PGA, ZIF (ZIP) 321 (19 x 19) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Phosphor Bronze Liquid Crystal Polymer (LCP) -
    146-87-642-41-035101

    146-87-642-41-035101

    CONN IC DIP SOCKET 42POS GOLD

    Preci-Dip

    4,768
    RFQ
    146-87-642-41-035101

    Tabla de datos

    146 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0113-G-2

    HLS-0113-G-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,713
    RFQ
    HLS-0113-G-2

    Tabla de datos

    HLS Tube Active SIP 13 (1 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    ICF-316-SM-O

    ICF-316-SM-O

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    3,264
    RFQ
    ICF-316-SM-O

    Tabla de datos

    ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    ICA-422-ZWTT

    ICA-422-ZWTT

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    3,180
    RFQ
    ICA-422-ZWTT

    Tabla de datos

    ICA Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    4726

    4726

    SMT SOCKET - WIDE SOIC-8 (200MIL

    Adafruit Industries LLC

    4,107
    RFQ
    4726

    Tabla de datos

    - Bulk Active SOIC 8 (2 x 4) 0.050" (1.27mm) - - - Surface Mount Closed Frame Solder 0.050" (1.27mm) - - - - -
    HLS-0106-G-3

    HLS-0106-G-3

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,995
    RFQ
    HLS-0106-G-3

    Tabla de datos

    HLS Tube Active SIP 6 (1 x 6) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    12-3503-20

    12-3503-20

    CONN IC DIP SOCKET 12POS GOLD

    Aries Electronics

    3,653
    RFQ
    12-3503-20

    Tabla de datos

    503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    12-3503-30

    12-3503-30

    CONN IC DIP SOCKET 12POS GOLD

    Aries Electronics

    4,283
    RFQ
    12-3503-30

    Tabla de datos

    503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-3518-101

    20-3518-101

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    2,452
    RFQ
    20-3518-101

    Tabla de datos

    518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    40-6513-10T

    40-6513-10T

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    3,415
    RFQ
    40-6513-10T

    Tabla de datos

    Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-3513-11H

    14-3513-11H

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    4,718
    RFQ
    14-3513-11H

    Tabla de datos

    Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    110-83-964-41-005101

    110-83-964-41-005101

    CONN IC DIP SOCKET 64POS GOLD

    Preci-Dip

    2,344
    RFQ
    110-83-964-41-005101

    Tabla de datos

    110 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICF-640-T-I-TR

    ICF-640-T-I-TR

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    4,567
    RFQ
    ICF-640-T-I-TR

    Tabla de datos

    ICF Tape & Reel (TR) Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    116-83-432-41-001101

    116-83-432-41-001101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    4,801
    RFQ
    116-83-432-41-001101

    Tabla de datos

    116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-146-15-061101

    510-87-146-15-061101

    CONN SOCKET PGA 146POS GOLD

    Preci-Dip

    2,303
    RFQ
    510-87-146-15-061101

    Tabla de datos

    510 Bulk Active PGA 146 (15 x 15) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    Total 19086 Record«Prev1... 283284285286287288289290...955Next»
    Correo electrónico
    Lo que contiene
    KATY Electronic Technology Co., LTD

    Casa

    KATY Electronic Technology Co., LTD

    Productos

    KATY Electronic Technology Co., LTD

    Teléfono

    KATY Electronic Technology Co., LTD

    Usuarios