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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    510-87-145-15-081101

    510-87-145-15-081101

    CONN SOCKET PGA 145POS GOLD

    Preci-Dip

    4,168
    RFQ
    510-87-145-15-081101

    Tabla de datos

    510 Bulk Active PGA 145 (15 x 15) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0503-T-2

    HLS-0503-T-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,510
    RFQ
    HLS-0503-T-2

    Tabla de datos

    HLS Bulk Active SIP 15 (5 x 3) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    299-87-324-10-001101

    299-87-324-10-001101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    3,047
    RFQ
    299-87-324-10-001101

    Tabla de datos

    299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICO-318-LGT

    ICO-318-LGT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    2,703
    RFQ
    ICO-318-LGT

    Tabla de datos

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    916657-3

    916657-3

    CONN SOCKET PGA ZIF 321POS GOLD

    TE Connectivity AMP Connectors

    2,375
    RFQ
    916657-3

    Tabla de datos

    - Tray Obsolete PGA, ZIF (ZIP) 321 (19 x 19) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Phosphor Bronze Liquid Crystal Polymer (LCP) -
    146-87-642-41-035101

    146-87-642-41-035101

    CONN IC DIP SOCKET 42POS GOLD

    Preci-Dip

    4,768
    RFQ
    146-87-642-41-035101

    Tabla de datos

    146 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0113-G-2

    HLS-0113-G-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,713
    RFQ
    HLS-0113-G-2

    Tabla de datos

    HLS Tube Active SIP 13 (1 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    ICF-316-SM-O

    ICF-316-SM-O

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    3,264
    RFQ
    ICF-316-SM-O

    Tabla de datos

    ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    ICA-422-ZWTT

    ICA-422-ZWTT

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    3,180
    RFQ
    ICA-422-ZWTT

    Tabla de datos

    ICA Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    4726

    4726

    SMT SOCKET - WIDE SOIC-8 (200MIL

    Adafruit Industries LLC

    4,107
    RFQ
    4726

    Tabla de datos

    - Bulk Active SOIC 8 (2 x 4) 0.050" (1.27mm) - - - Surface Mount Closed Frame Solder 0.050" (1.27mm) - - - - -
    HLS-0106-G-3

    HLS-0106-G-3

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,995
    RFQ
    HLS-0106-G-3

    Tabla de datos

    HLS Tube Active SIP 6 (1 x 6) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    12-3503-20

    12-3503-20

    CONN IC DIP SOCKET 12POS GOLD

    Aries Electronics

    3,653
    RFQ
    12-3503-20

    Tabla de datos

    503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    12-3503-30

    12-3503-30

    CONN IC DIP SOCKET 12POS GOLD

    Aries Electronics

    4,283
    RFQ
    12-3503-30

    Tabla de datos

    503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-3518-101

    20-3518-101

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    2,452
    RFQ
    20-3518-101

    Tabla de datos

    518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    40-6513-10T

    40-6513-10T

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    3,415
    RFQ
    40-6513-10T

    Tabla de datos

    Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-3513-11H

    14-3513-11H

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    4,718
    RFQ
    14-3513-11H

    Tabla de datos

    Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    110-83-964-41-005101

    110-83-964-41-005101

    CONN IC DIP SOCKET 64POS GOLD

    Preci-Dip

    2,344
    RFQ
    110-83-964-41-005101

    Tabla de datos

    110 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICF-640-T-I-TR

    ICF-640-T-I-TR

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    4,567
    RFQ
    ICF-640-T-I-TR

    Tabla de datos

    ICF Tape & Reel (TR) Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    116-83-432-41-001101

    116-83-432-41-001101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    4,801
    RFQ
    116-83-432-41-001101

    Tabla de datos

    116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-146-15-061101

    510-87-146-15-061101

    CONN SOCKET PGA 146POS GOLD

    Preci-Dip

    2,303
    RFQ
    510-87-146-15-061101

    Tabla de datos

    510 Bulk Active PGA 146 (15 x 15) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    Total 19086 Record«Prev1... 283284285286287288289290...955Next»
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