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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    32-3513-10

    32-3513-10

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    3,005
    RFQ
    32-3513-10

    Tabla de datos

    Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    510-83-084-10-001101

    510-83-084-10-001101

    CONN SOCKET PGA 84POS GOLD

    Preci-Dip

    3,844
    RFQ
    510-83-084-10-001101

    Tabla de datos

    510 Bulk Active PGA 84 (10 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-084-10-031101

    510-83-084-10-031101

    CONN SOCKET PGA 84POS GOLD

    Preci-Dip

    2,205
    RFQ
    510-83-084-10-031101

    Tabla de datos

    510 Bulk Active PGA 84 (10 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-084-11-002101

    510-83-084-11-002101

    CONN SOCKET PGA 84POS GOLD

    Preci-Dip

    3,495
    RFQ
    510-83-084-11-002101

    Tabla de datos

    510 Bulk Active PGA 84 (11 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-084-11-041101

    510-83-084-11-041101

    CONN SOCKET PGA 84POS GOLD

    Preci-Dip

    2,858
    RFQ
    510-83-084-11-041101

    Tabla de datos

    510 Bulk Active PGA 84 (11 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-084-11-042101

    510-83-084-11-042101

    CONN SOCKET PGA 84POS GOLD

    Preci-Dip

    4,806
    RFQ
    510-83-084-11-042101

    Tabla de datos

    510 Bulk Active PGA 84 (11 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-084-12-051101

    510-83-084-12-051101

    CONN SOCKET PGA 84POS GOLD

    Preci-Dip

    4,453
    RFQ
    510-83-084-12-051101

    Tabla de datos

    510 Bulk Active PGA 84 (12 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    10-6503-30

    10-6503-30

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    2,849
    RFQ
    10-6503-30

    Tabla de datos

    503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    124-83-628-41-002101

    124-83-628-41-002101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    4,887
    RFQ

    -

    124 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    816-AG10D

    816-AG10D

    CONN IC DIP SOCKET 16POS GOLD

    TE Connectivity AMP Connectors

    4,885
    RFQ
    816-AG10D

    Tabla de datos

    800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) - - - Polyester -55°C ~ 105°C
    510-83-084-13-081101

    510-83-084-13-081101

    CONN SOCKET PGA 84POS GOLD

    Preci-Dip

    4,764
    RFQ
    510-83-084-13-081101

    Tabla de datos

    510 Bulk Active PGA 84 (13 x 13) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-084-13-082101

    510-83-084-13-082101

    CONN SOCKET PGA 84POS GOLD

    Preci-Dip

    4,165
    RFQ
    510-83-084-13-082101

    Tabla de datos

    510 Bulk Active PGA 84 (13 x 13) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    614-83-950-41-001101

    614-83-950-41-001101

    CONN IC DIP SOCKET 50POS GOLD

    Preci-Dip

    4,534
    RFQ
    614-83-950-41-001101

    Tabla de datos

    614 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    36-1518-11

    36-1518-11

    CONN IC DIP SOCKET 36POS GOLD

    Aries Electronics

    2,174
    RFQ
    36-1518-11

    Tabla de datos

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    ICF-322-TL-I-TR

    ICF-322-TL-I-TR

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    4,272
    RFQ
    ICF-322-TL-I-TR

    Tabla de datos

    ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    ICF-322-STL-I-TR

    ICF-322-STL-I-TR

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    3,836
    RFQ
    ICF-322-STL-I-TR

    Tabla de datos

    ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    ICF-322-STL-O-TR

    ICF-322-STL-O-TR

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    4,365
    RFQ
    ICF-322-STL-O-TR

    Tabla de datos

    ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    APH-0504-T-R

    APH-0504-T-R

    APH-0504-T-R

    Samtec Inc.

    2,314
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1404-T-R

    APH-1404-T-R

    APH-1404-T-R

    Samtec Inc.

    2,478
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1004-T-R

    APH-1004-T-R

    APH-1004-T-R

    Samtec Inc.

    3,447
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
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