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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    DIP324-011B

    DIP324-011B

    DIP324-011B-DIP SOCKET 24 CTS

    Amphenol ICC (FCI)

    3,401
    RFQ
    DIP324-011B

    Tabla de datos

    - Bag Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    116-83-306-41-003101

    116-83-306-41-003101

    CONN IC DIP SOCKET 6POS GOLD

    Preci-Dip

    4,654
    RFQ
    116-83-306-41-003101

    Tabla de datos

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    02-0513-11H

    02-0513-11H

    CONN SOCKET SIP 2POS GOLD

    Aries Electronics

    2,067
    RFQ
    02-0513-11H

    Tabla de datos

    0513 Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    04-0513-10

    04-0513-10

    CONN SOCKET SIP 4POS GOLD

    Aries Electronics

    3,376
    RFQ
    04-0513-10

    Tabla de datos

    0513 Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    ED020PLCZ-SM-N

    ED020PLCZ-SM-N

    CONN SOCKET PLCC 20POS

    On Shore Technology Inc.

    2,678
    RFQ
    ED020PLCZ-SM-N

    Tabla de datos

    ED Tube Active PLCC 20 (4 x 5) 0.050" (1.27mm) - - Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) - - Phosphor Bronze Polyphenylene Sulfide (PPS) -55°C ~ 105°C
    AR 18 HGL-TT

    AR 18 HGL-TT

    SOCKET

    Assmann WSW Components

    4,262
    RFQ

    -

    AR Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    110-87-318-41-001151

    110-87-318-41-001151

    CONN IC DIP SOCKET 18POS GOLD

    Preci-Dip

    2,274
    RFQ

    -

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame, No Center Bar Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    PRT-07937

    PRT-07937

    DIP SOCKETS SOLDER TAIL - 8-PIN

    SparkFun Electronics

    2,585
    RFQ

    -

    - Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) - - - - Through Hole Open Frame Solder - - - - - -
    110-87-312-01-680101

    110-87-312-01-680101

    CONN IC DIP SOCKET 12POS GOLD

    Preci-Dip

    4,105
    RFQ
    110-87-312-01-680101

    Tabla de datos

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6), 6 Loaded 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    614-87-308-31-012101

    614-87-308-31-012101

    CONN IC DIP SOCKET 8POS GOLD

    Preci-Dip

    4,770
    RFQ
    614-87-308-31-012101

    Tabla de datos

    614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    DIP318-001B

    DIP318-001B

    DIP318-001B-DIP SOCKET 18 CTS

    Amphenol ICC (FCI)

    3,533
    RFQ
    DIP318-001B

    Tabla de datos

    - Bag Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    110-87-314-41-005101

    110-87-314-41-005101

    CONN IC DIP SOCKET 14POS GOLD

    Preci-Dip

    4,355
    RFQ
    110-87-314-41-005101

    Tabla de datos

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    SIP050-1X09-157B

    SIP050-1X09-157B

    1X09-157B-SIP SOCKET 9 CTS

    Amphenol ICC (FCI)

    3,176
    RFQ
    SIP050-1X09-157B

    Tabla de datos

    SIP050-1x Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    110-83-310-41-001101

    110-83-310-41-001101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    3,816
    RFQ
    110-83-310-41-001101

    Tabla de datos

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-306-41-009101

    116-87-306-41-009101

    CONN IC DIP SOCKET 6POS GOLD

    Preci-Dip

    4,550
    RFQ
    116-87-306-41-009101

    Tabla de datos

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    A-CCS044-Z-SM/P

    A-CCS044-Z-SM/P

    SOCKET

    Assmann WSW Components

    3,301
    RFQ

    -

    - Bulk Active PLCC 44 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Through Hole Closed Frame Solder 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Polyphenylene Sulfide (PPS), Glass Filled -40°C ~ 105°C
    114-83-308-41-117101

    114-83-308-41-117101

    CONN IC DIP SOCKET 8POS GOLD

    Preci-Dip

    3,857
    RFQ
    114-83-308-41-117101

    Tabla de datos

    114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    822473-3

    822473-3

    CONN SOCKET PLCC 32POS TIN-LEAD

    TE Connectivity AMP Connectors

    4,379
    RFQ
    822473-3

    Tabla de datos

    - Tube Obsolete PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin-Lead - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead - Phosphor Bronze Thermoplastic -
    614-87-610-41-001101

    614-87-610-41-001101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    2,326
    RFQ
    614-87-610-41-001101

    Tabla de datos

    614 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    940-99-084-24-000000

    940-99-084-24-000000

    CONN SOCKET PLCC 84POS TIN-LEAD

    Mill-Max Manufacturing Corp.

    2,492
    RFQ
    940-99-084-24-000000

    Tabla de datos

    940 Tube Obsolete PLCC 84 (4 x 21) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    Total 19086 Record«Prev1... 99100101102103104105106...955Next»
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