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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    2124-6313-9UA-1902

    2124-6313-9UA-1902

    TEST BURN-IN PGA

    3M

    2,537
    RFQ
    2124-6313-9UA-1902

    Tabla de datos

    Textool™ Bulk Obsolete PGA, ZIF (ZIP) 124 (13 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
    2209-6317-9UA-1902

    2209-6317-9UA-1902

    GRID ZIP

    3M

    2,838
    RFQ
    2209-6317-9UA-1902

    Tabla de datos

    Textool™ Bulk Obsolete PGA, ZIF (ZIP) 209 (17 x 17) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
    2225-6317-9UA-1902

    2225-6317-9UA-1902

    TEXTOOL

    3M

    4,579
    RFQ
    2225-6317-9UA-1902

    Tabla de datos

    Textool™ Bulk Obsolete PGA, ZIF (ZIP) 225 (15 x 15) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
    2120-6313-9UA-1902

    2120-6313-9UA-1902

    PGA 13 X13

    3M

    3,378
    RFQ
    2120-6313-9UA-1902

    Tabla de datos

    Textool™ Bulk Obsolete PGA, ZIF (ZIP) 120 (13 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
    2361-6319-9UA-1902

    2361-6319-9UA-1902

    GRID ZIP 19 X 19

    3M

    4,156
    RFQ
    2361-6319-9UA-1902

    Tabla de datos

    Textool™ Bulk Obsolete PGA, ZIF (ZIP) 361 (19 x 19) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
    2144-6315-9UA-1902

    2144-6315-9UA-1902

    GRID ZIP 15 X 15

    3M

    2,645
    RFQ
    2144-6315-9UA-1902

    Tabla de datos

    Textool™ Bulk Obsolete PGA, ZIF (ZIP) 144 (15 x 15) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
    244A-6313-9UA-1902

    244A-6313-9UA-1902

    TEXTOOL

    3M

    4,760
    RFQ
    244A-6313-9UA-1902

    Tabla de datos

    Textool™ Bulk Obsolete PGA, ZIF (ZIP) 169 (13 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
    2108-6313-9UA-1902

    2108-6313-9UA-1902

    GRID ZIP 13 X 13

    3M

    4,861
    RFQ
    2108-6313-9UA-1902

    Tabla de datos

    Textool™ Bulk Obsolete PGA, ZIF (ZIP) 108 (13 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
    284-6311-9UA-1902

    284-6311-9UA-1902

    GRID ZIP 11 X 11

    3M

    2,025
    RFQ
    284-6311-9UA-1902

    Tabla de datos

    Textool™ Bulk Obsolete PGA, ZIF (ZIP) 84 (11 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
    224A-6313-9UA-1902

    224A-6313-9UA-1902

    TEXTOOL 13 X 13 PGA

    3M

    2,544
    RFQ
    224A-6313-9UA-1902

    Tabla de datos

    Textool™ Bulk Obsolete PGA, ZIF (ZIP) 169 (13 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
    2289-6317-9UA-1902

    2289-6317-9UA-1902

    GRID ZIP 17 X 17

    3M

    4,647
    RFQ
    2289-6317-9UA-1902

    Tabla de datos

    Textool™ Bulk Obsolete PGA, ZIF (ZIP) 289 (17 x 17) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
    2225-6315-9UA-1902

    2225-6315-9UA-1902

    GRID ZIP 15X15

    3M

    4,601
    RFQ
    2225-6315-9UA-1902

    Tabla de datos

    Textool™ Bulk Obsolete PGA, ZIF (ZIP) 225 (15 x 15) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
    272-6311-9UA-1902

    272-6311-9UA-1902

    TEST BURN-IN PGA

    3M

    4,064
    RFQ
    272-6311-9UA-1902

    Tabla de datos

    Textool™ Bulk Obsolete PGA, ZIF (ZIP) 72 (11 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
    2180-6315-9UA-1902

    2180-6315-9UA-1902

    GRID ZIP 15 X 15

    3M

    4,515
    RFQ
    2180-6315-9UA-1902

    Tabla de datos

    Textool™ Bulk Discontinued at Digi-Key PGA, ZIF (ZIP) 180 (15 x 15) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
    2169-6317-9UA-1902

    2169-6317-9UA-1902

    PGA

    3M

    2,384
    RFQ
    2169-6317-9UA-1902

    Tabla de datos

    Textool™ Bulk Obsolete PGA, ZIF (ZIP) 169 (17 x 17) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
    272-6325-9UA-1902

    272-6325-9UA-1902

    TEST BURN-IN PGA

    3M

    2,377
    RFQ
    272-6325-9UA-1902

    Tabla de datos

    Textool™ Bulk Obsolete PGA, ZIF (ZIP) 72 (25 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
    2184-6325-9UA-1902

    2184-6325-9UA-1902

    TEST BURN-IN PGA

    3M

    2,733
    RFQ
    2184-6325-9UA-1902

    Tabla de datos

    Textool™ Bulk Obsolete PGA, ZIF (ZIP) 184 (25 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
    2141-6321-9UA-1902

    2141-6321-9UA-1902

    TEST AND BURN-IN PGA

    3M

    4,536
    RFQ
    2141-6321-9UA-1902

    Tabla de datos

    Textool™ Bulk Obsolete PGA, ZIF (ZIP) 141 (21 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
    2192-6325-9UA-1902

    2192-6325-9UA-1902

    TEST BURN-IN PGA

    3M

    3,479
    RFQ
    2192-6325-9UA-1902

    Tabla de datos

    Textool™ Bulk Obsolete PGA, ZIF (ZIP) 192 (25 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
    2280-6319-9UA-1902

    2280-6319-9UA-1902

    TEXTOOL

    3M

    4,786
    RFQ
    2280-6319-9UA-1902

    Tabla de datos

    Textool™ Bulk Obsolete PGA, ZIF (ZIP) 280 (19 x 19) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
    Total 19086 Record«Prev1... 949950951952953954955Next»
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