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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    614-13-144-12-000012

    614-13-144-12-000012

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    2,450
    RFQ
    614-13-144-12-000012

    Tabla de datos

    614 Bulk Active PGA 144 (12 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-13-223-18-098012

    614-13-223-18-098012

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    2,091
    RFQ
    614-13-223-18-098012

    Tabla de datos

    614 Bulk Active PGA 223 (18 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-13-225-18-091007

    614-13-225-18-091007

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    4,106
    RFQ
    614-13-225-18-091007

    Tabla de datos

    614 Bulk Active PGA 225 (18 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-13-400-20-000001

    614-13-400-20-000001

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    3,253
    RFQ
    614-13-400-20-000001

    Tabla de datos

    614 Bulk Active PGA 400 (20 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-93-241-18-075012

    614-93-241-18-075012

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    4,951
    RFQ
    614-93-241-18-075012

    Tabla de datos

    614 Bulk Active PGA 241 (18 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    940-44-084-17-400004

    940-44-084-17-400004

    CONN SKT PLCC

    Mill-Max Manufacturing Corp.

    3,993
    RFQ
    940-44-084-17-400004

    Tabla de datos

    940 Tape & Reel (TR) Active PLCC 84 (4 x 21) 0.050" (1.27mm) Tin 150.0µin (3.81µm) - Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 200.0µin (5.08µm) - Polyphenylene Sulfide (PPS) -
    D01-9933201

    D01-9933201

    CONNECTOR

    Harwin Inc.

    3,112
    RFQ
    D01-9933201

    Tabla de datos

    D01-993 Bulk Obsolete SIP 32 (1 x 32) 0.100" (2.54mm) Tin - Brass Through Hole - Solder Cup 0.100" (2.54mm) Tin - Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    8114LB603G

    8114LB603G

    HEATSINK

    Boyd Laconia, LLC

    4,580
    RFQ

    -

    - - Active - - - - - - - - - - - - - - -
    PX-20LCC

    PX-20LCC

    LEADLESS CHIP CARRIER 20P PBT RO

    Kycon, Inc.

    2,565
    RFQ

    -

    PX Tube Obsolete PLCC 20 (4 x 5) 0.050" (1.27mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 75°C
    PX-28LCC

    PX-28LCC

    LEADLESS CHIP CARRIER 28P PBT RO

    Kycon, Inc.

    3,088
    RFQ

    -

    PX Tube Obsolete PLCC 28 (4 x 7) 0.050" (1.27mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 75°C
    PX-32LCC

    PX-32LCC

    LEADLESS CHIP CARRIER 32P PBT RO

    Kycon, Inc.

    2,741
    RFQ

    -

    PX Tube Obsolete PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 75°C
    PX-44LCC

    PX-44LCC

    LEADLESS CHIP CARRIER 44P PBT RO

    Kycon, Inc.

    2,445
    RFQ

    -

    PX Tube Obsolete PLCC 44 (4 x 11) 0.050" (1.27mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 75°C
    PX-52LCC

    PX-52LCC

    LEADLESS CHIP CARRIER 52P PBT RO

    Kycon, Inc.

    2,000
    RFQ

    -

    PX Tube Obsolete PLCC 52 (4 x 13) 0.050" (1.27mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 75°C
    PX-68LCC

    PX-68LCC

    LEADLESS CHIP CARRIER 68P PBT RO

    Kycon, Inc.

    3,668
    RFQ

    -

    PX Tube Obsolete PLCC 68 (4 x 17) 0.050" (1.27mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 75°C
    PX-84LCC

    PX-84LCC

    LEADLESS CHIP CARRIER 84P PBT RO

    Kycon, Inc.

    4,339
    RFQ

    -

    PX Tube Obsolete PLCC 84 (4 x 21) 0.050" (1.27mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 75°C
    2255-929A-90-2401

    2255-929A-90-2401

    CONN TEST & BURN-IN BGA SOCKET

    3M

    2,690
    RFQ

    -

    - Bulk Obsolete - - - - - - - - - - - - - - -
    2320-9220-02-2401

    2320-9220-02-2401

    CONN TEST & BURN-IN BGA SOCKET

    3M

    4,434
    RFQ

    -

    - Bulk Obsolete - - - - - - - - - - - - - - -
    2432-9235-01-2401

    2432-9235-01-2401

    CONN TEST & BURN-IN BGA SOCKET

    3M

    3,096
    RFQ

    -

    - Bulk Obsolete - - - - - - - - - - - - - - -
    2256-6321-9UA-1902

    2256-6321-9UA-1902

    GRID ZIP 21 X 21

    3M

    3,181
    RFQ
    2256-6321-9UA-1902

    Tabla de datos

    Textool™ Bulk Obsolete PGA, ZIF (ZIP) 256 (21 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
    276-6321-9UA-1902

    276-6321-9UA-1902

    TEST BURN-IN PGA

    3M

    4,616
    RFQ
    276-6321-9UA-1902

    Tabla de datos

    Textool™ Bulk Obsolete PGA, ZIF (ZIP) 76 (21 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
    Total 19086 Record«Prev1... 948949950951952953954955Next»
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