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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    69-PLS11031-12

    69-PLS11031-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    0
    RFQ
    69-PLS11031-12

    Tabla de datos

    PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    69-PLS13112-12

    69-PLS13112-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    0
    RFQ
    69-PLS13112-12

    Tabla de datos

    PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    69-PRS11031-12

    69-PRS11031-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    0
    RFQ
    69-PRS11031-12

    Tabla de datos

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    69-PRS11055-12

    69-PRS11055-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    0
    RFQ
    69-PRS11055-12

    Tabla de datos

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    69-PRS13112-12

    69-PRS13112-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    0
    RFQ
    69-PRS13112-12

    Tabla de datos

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    518-77-400M20-000106

    518-77-400M20-000106

    CONN SOCKET PGA 400POS GOLD

    Preci-Dip

    0
    RFQ
    518-77-400M20-000106

    Tabla de datos

    518 Bulk Active PGA 400 (20 x 20) 0.050" (1.27mm) Gold Flash Beryllium Copper Surface Mount Closed Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
    20-PLS13120-12

    20-PLS13120-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    0
    RFQ
    20-PLS13120-12

    Tabla de datos

    PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    20-PRS13120-12

    20-PRS13120-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    0
    RFQ
    20-PRS13120-12

    Tabla de datos

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    36-3553-16

    36-3553-16

    CONN IC DIP SOCKET ZIF 36POS

    Aries Electronics

    0
    RFQ
    36-3553-16

    Tabla de datos

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    36-6551-16

    36-6551-16

    CONN IC DIP SOCKET ZIF 36POS

    Aries Electronics

    0
    RFQ
    36-6551-16

    Tabla de datos

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    36-6552-16

    36-6552-16

    CONN IC DIP SOCKET ZIF 36POS

    Aries Electronics

    0
    RFQ
    36-6552-16

    Tabla de datos

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    36-6553-16

    36-6553-16

    CONN IC DIP SOCKET ZIF 36POS

    Aries Electronics

    0
    RFQ
    36-6553-16

    Tabla de datos

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
    36-3552-16

    36-3552-16

    CONN IC DIP SOCKET ZIF 36POS

    Aries Electronics

    0
    RFQ
    36-3552-16

    Tabla de datos

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    36-3554-16

    36-3554-16

    CONN IC DIP SOCKET ZIF 36POS

    Aries Electronics

    0
    RFQ
    36-3554-16

    Tabla de datos

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    36-6554-16

    36-6554-16

    CONN IC DIP SOCKET ZIF 36POS

    Aries Electronics

    0
    RFQ
    36-6554-16

    Tabla de datos

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    550-80-361-18-101135

    550-80-361-18-101135

    PGA SOLDER TAIL

    Preci-Dip

    0
    RFQ
    550-80-361-18-101135

    Tabla de datos

    550 Bulk Active PGA 361 (18 x 18) 0.050" (1.27mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.050" (1.27mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    192-PGM17043-10H

    192-PGM17043-10H

    CONN SOCKET PGA GOLD

    Aries Electronics

    0
    RFQ
    192-PGM17043-10H

    Tabla de datos

    PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    44-6556-41

    44-6556-41

    CONN IC DIP SOCKET 44POS GOLD

    Aries Electronics

    0
    RFQ
    44-6556-41

    Tabla de datos

    6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder Cup 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    546-83-545-17-000147

    546-83-545-17-000147

    CONN SOCKET PGA 545POS GOLD

    Preci-Dip

    0
    RFQ
    546-83-545-17-000147

    Tabla de datos

    546 Bulk Active PGA 545 (17 x 17) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    80-PRS13127-12

    80-PRS13127-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    0
    RFQ
    80-PRS13127-12

    Tabla de datos

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    Total 19086 Record«Prev1... 890891892893894895896897...955Next»
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