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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    7010321946

    7010321946

    TEXTOOLTEST & BURN-IN BALL GRID

    3M

    0
    RFQ

    -

    - Bulk Active - - - - - - - - - - - - - - -
    558-10-420M26-001101

    558-10-420M26-001101

    PGA SOLDER TAIL 1.27MM

    Preci-Dip

    0
    RFQ
    558-10-420M26-001101

    Tabla de datos

    558 Bulk Active PGA 420 (26 x 26) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    42-6556-41

    42-6556-41

    CONN IC DIP SOCKET 42POS GOLD

    Aries Electronics

    0
    RFQ
    42-6556-41

    Tabla de datos

    6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder Cup 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    518-77-388M26-001106

    518-77-388M26-001106

    CONN SOCKET PGA 388POS GOLD

    Preci-Dip

    0
    RFQ
    518-77-388M26-001106

    Tabla de datos

    518 Bulk Active PGA 388 (26 x 26) 0.050" (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
    514-83-478M26-131148

    514-83-478M26-131148

    CONN SOCKET BGA 478POS GOLD

    Preci-Dip

    0
    RFQ
    514-83-478M26-131148

    Tabla de datos

    514 Bulk Active BGA 478 (26 x 26) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    558-10-400M20-000104

    558-10-400M20-000104

    BGA SURFACE MOUNT 1.27MM

    Preci-Dip

    0
    RFQ
    558-10-400M20-000104

    Tabla de datos

    558 Bulk Active BGA 400 (20 x 20) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    223-33-320-41-001000

    223-33-320-41-001000

    STANDARD WIRE WRAP DIP SOCKET

    Mill-Max Manufacturing Corp.

    0
    RFQ

    -

    - Tube Active - - - - - - - - - - - - - - -
    514-83-480M29-001148

    514-83-480M29-001148

    CONN SOCKET BGA 480POS GOLD

    Preci-Dip

    0
    RFQ
    514-83-480M29-001148

    Tabla de datos

    514 Bulk Active BGA 480 (29 x 29) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    518-77-400M20-000105

    518-77-400M20-000105

    CONN SOCKET PGA 400POS GOLD

    Preci-Dip

    0
    RFQ
    518-77-400M20-000105

    Tabla de datos

    518 Bulk Active PGA 400 (20 x 20) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
    110-33-640-41-001000

    110-33-640-41-001000

    STANDRD SOLDER TAIL DIP SOCKET

    Mill-Max Manufacturing Corp.

    0
    RFQ

    -

    110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Thermoplastic -55°C ~ 125°C
    210-33-640-41-001000

    210-33-640-41-001000

    STANDRD SOLDER TAIL DIP SOCKET

    Mill-Max Manufacturing Corp.

    0
    RFQ
    210-33-640-41-001000

    Tabla de datos

    210 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Thermoplastic -55°C ~ 125°C
    65-PRS10008-12

    65-PRS10008-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    0
    RFQ
    65-PRS10008-12

    Tabla de datos

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    550-10-652M35-001166

    550-10-652M35-001166

    BGA PIN ADAPTER 1.27MM SMD

    Preci-Dip

    0
    RFQ
    550-10-652M35-001166

    Tabla de datos

    550 Bulk Active BGA 652 (35 x 35) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    66-PLS11054-12

    66-PLS11054-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    0
    RFQ
    66-PLS11054-12

    Tabla de datos

    PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    550-10-456M26-001152

    550-10-456M26-001152

    BGA SOLDER TAIL

    Preci-Dip

    0
    RFQ
    550-10-456M26-001152

    Tabla de datos

    550 Bulk Active BGA 456 (26 x 26) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    546-83-528-21-121147

    546-83-528-21-121147

    CONN SOCKET PGA 528POS GOLD

    Preci-Dip

    0
    RFQ
    546-83-528-21-121147

    Tabla de datos

    546 Bulk Active PGA 528 (21 x 21) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    558-10-432M31-001101

    558-10-432M31-001101

    PGA SOLDER TAIL 1.27MM

    Preci-Dip

    0
    RFQ
    558-10-432M31-001101

    Tabla de datos

    558 Bulk Active PGA 432 (31 x 31) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    68-PLS11033-12

    68-PLS11033-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    0
    RFQ
    68-PLS11033-12

    Tabla de datos

    PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    546-83-529-21-121147

    546-83-529-21-121147

    CONN SOCKET PGA 529POS GOLD

    Preci-Dip

    0
    RFQ
    546-83-529-21-121147

    Tabla de datos

    546 Bulk Active PGA 529 (21 x 21) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    42-3554-16

    42-3554-16

    CONN IC DIP SOCKET ZIF 42POS

    Aries Electronics

    0
    RFQ
    42-3554-16

    Tabla de datos

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    Total 19086 Record«Prev1... 889890891892893894895896...955Next»
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