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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    550-10-356M26-001152

    550-10-356M26-001152

    BGA SOLDER TAIL

    Preci-Dip

    0
    RFQ
    550-10-356M26-001152

    Tabla de datos

    550 Bulk Active BGA 356 (26 x 26) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    546-87-528-21-121147

    546-87-528-21-121147

    CONN SOCKET PGA 528POS GOLD

    Preci-Dip

    0
    RFQ
    546-87-528-21-121147

    Tabla de datos

    546 Bulk Active PGA 528 (21 x 21) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    550-10-357M19-001152

    550-10-357M19-001152

    BGA SOLDER TAIL

    Preci-Dip

    0
    RFQ
    550-10-357M19-001152

    Tabla de datos

    550 Bulk Active BGA 357 (19 x 19) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    546-87-545-17-000147

    546-87-545-17-000147

    CONN SOCKET PGA 545POS GOLD

    Preci-Dip

    0
    RFQ
    546-87-545-17-000147

    Tabla de datos

    546 Bulk Active PGA 545 (17 x 17) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    32-3551-16

    32-3551-16

    CONN IC DIP SOCKET ZIF 32POS

    Aries Electronics

    0
    RFQ
    32-3551-16

    Tabla de datos

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    32-3552-16

    32-3552-16

    CONN IC DIP SOCKET ZIF 32POS

    Aries Electronics

    0
    RFQ
    32-3552-16

    Tabla de datos

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    32-3553-16

    32-3553-16

    CONN IC DIP SOCKET ZIF 32POS

    Aries Electronics

    0
    RFQ
    32-3553-16

    Tabla de datos

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    32-6552-16

    32-6552-16

    CONN IC DIP SOCKET ZIF 32POS

    Aries Electronics

    0
    RFQ
    32-6552-16

    Tabla de datos

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    32-6553-16

    32-6553-16

    CONN IC DIP SOCKET ZIF 32POS

    Aries Electronics

    0
    RFQ
    32-6553-16

    Tabla de datos

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
    32-3554-16

    32-3554-16

    CONN IC DIP SOCKET ZIF 32POS

    Aries Electronics

    0
    RFQ
    32-3554-16

    Tabla de datos

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    550-10-360M19-001152

    550-10-360M19-001152

    BGA SOLDER TAIL

    Preci-Dip

    0
    RFQ
    550-10-360M19-001152

    Tabla de datos

    550 Bulk Active BGA 360 (19 x 19) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    110-88-320-41-530000

    110-88-320-41-530000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    0
    RFQ
    110-88-320-41-530000

    Tabla de datos

    110 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    210-83-306-41-101000

    210-83-306-41-101000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    0
    RFQ
    210-83-306-41-101000

    Tabla de datos

    210 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 300.0µin (7.62µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-88-316-41-530000

    110-88-316-41-530000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    0
    RFQ
    110-88-316-41-530000

    Tabla de datos

    110 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    42-6556-40

    42-6556-40

    CONN IC DIP SOCKET 42POS GOLD

    Aries Electronics

    0
    RFQ
    42-6556-40

    Tabla de datos

    6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder Cup 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    550-10-520M31-001166

    550-10-520M31-001166

    BGA PIN ADAPTER 1.27MM SMD

    Preci-Dip

    0
    RFQ
    550-10-520M31-001166

    Tabla de datos

    550 Bulk Active BGA 520 (31 x 31) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    210-88-306-41-001000

    210-88-306-41-001000

    STANDRD SOLDER TAIL DIP SOCKET

    Mill-Max Manufacturing Corp.

    0
    RFQ

    -

    - Tube Active - - - - - - - - - - - - - - -
    514-87-500M30-001148

    514-87-500M30-001148

    CONN SOCKET BGA 500POS GOLD

    Preci-Dip

    0
    RFQ
    514-87-500M30-001148

    Tabla de datos

    514 Bulk Active BGA 500 (30 x 30) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    144-PGM12001-41

    144-PGM12001-41

    CONN SOCKET PGA GOLD

    Aries Electronics

    0
    RFQ
    144-PGM12001-41

    Tabla de datos

    PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    514-83-388M26-001148

    514-83-388M26-001148

    CONN SOCKET BGA 388POS GOLD

    Preci-Dip

    0
    RFQ
    514-83-388M26-001148

    Tabla de datos

    514 Bulk Active BGA 388 (26 x 26) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    Total 19086 Record«Prev1... 880881882883884885886887...955Next»
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