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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    50-9508-31

    50-9508-31

    CONN IC DIP SOCKET 50POS GOLD

    Aries Electronics

    4,588
    RFQ
    50-9508-31

    Tabla de datos

    508 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    514-83-360M19-001148

    514-83-360M19-001148

    CONN SOCKET BGA 360POS GOLD

    Preci-Dip

    2,863
    RFQ
    514-83-360M19-001148

    Tabla de datos

    514 Bulk Active BGA 360 (19 x 19) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    28-3575-16

    28-3575-16

    CONN IC DIP SOCKET ZIF 28POS GLD

    Aries Electronics

    4,554
    RFQ
    28-3575-16

    Tabla de datos

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    28-6575-16

    28-6575-16

    CONN IC DIP SOCKET ZIF 28POS TIN

    Aries Electronics

    3,178
    RFQ
    28-6575-16

    Tabla de datos

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    224-PGM15038-11H

    224-PGM15038-11H

    CONN SOCKET PGA GOLD

    Aries Electronics

    3,227
    RFQ
    224-PGM15038-11H

    Tabla de datos

    PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    225-PGM15001-11

    225-PGM15001-11

    CONN SOCKET PGA GOLD

    Aries Electronics

    4,605
    RFQ
    225-PGM15001-11

    Tabla de datos

    PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    68-PGM11032-10T

    68-PGM11032-10T

    CONN SOCKET PGA TIN

    Aries Electronics

    2,340
    RFQ
    68-PGM11032-10T

    Tabla de datos

    PGM Bulk Active PGA - 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    HLS-1212-G-2

    HLS-1212-G-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,889
    RFQ
    HLS-1212-G-2

    Tabla de datos

    HLS Bulk Active SIP 144 (12 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    546-87-503-22-131147

    546-87-503-22-131147

    CONN SOCKET PGA 503POS GOLD

    Preci-Dip

    3,420
    RFQ
    546-87-503-22-131147

    Tabla de datos

    546 Bulk Active PGA 503 (22 x 22) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    546-87-529-21-121147

    546-87-529-21-121147

    CONN SOCKET PGA 529POS GOLD

    Preci-Dip

    3,437
    RFQ
    546-87-529-21-121147

    Tabla de datos

    546 Bulk Active PGA 529 (21 x 21) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    514-87-478M26-131148

    514-87-478M26-131148

    CONN SOCKET BGA 478POS GOLD

    Preci-Dip

    4,923
    RFQ
    514-87-478M26-131148

    Tabla de datos

    514 Bulk Active BGA 478 (26 x 26) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    550-10-500M30-001166

    550-10-500M30-001166

    BGA PIN ADAPTER 1.27MM SMD

    Preci-Dip

    3,303
    RFQ
    550-10-500M30-001166

    Tabla de datos

    550 Bulk Active BGA 500 (30 x 30) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    514-87-480M29-001148

    514-87-480M29-001148

    CONN SOCKET BGA 480POS GOLD

    Preci-Dip

    2,749
    RFQ
    514-87-480M29-001148

    Tabla de datos

    514 Bulk Active BGA 480 (29 x 29) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    232-PGM17037-11

    232-PGM17037-11

    CONN SOCKET PGA GOLD

    Aries Electronics

    4,837
    RFQ
    232-PGM17037-11

    Tabla de datos

    PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    550-10-296-19-131135

    550-10-296-19-131135

    PGA SOLDER TAIL

    Preci-Dip

    4,935
    RFQ
    550-10-296-19-131135

    Tabla de datos

    550 Bulk Active PGA 296 (19 x 19) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    550-10-504M29-001166

    550-10-504M29-001166

    BGA PIN ADAPTER 1.27MM SMD

    Preci-Dip

    2,162
    RFQ
    550-10-504M29-001166

    Tabla de datos

    550 Bulk Active BGA 504 (29 x 29) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    114-PGM13040-51

    114-PGM13040-51

    CONN SOCKET PGA GOLD

    Aries Electronics

    3,011
    RFQ
    114-PGM13040-51

    Tabla de datos

    PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    HLS-0516-G-38

    HLS-0516-G-38

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,567
    RFQ
    HLS-0516-G-38

    Tabla de datos

    HLS Bulk Active SIP 80 (5 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    550-10-352M26-001152

    550-10-352M26-001152

    BGA SOLDER TAIL

    Preci-Dip

    3,800
    RFQ
    550-10-352M26-001152

    Tabla de datos

    550 Bulk Active BGA 352 (26 x 26) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    546-83-403-19-111147

    546-83-403-19-111147

    CONN SOCKET PGA 403POS GOLD

    Preci-Dip

    3,300
    RFQ
    546-83-403-19-111147

    Tabla de datos

    546 Bulk Active PGA 403 (19 x 19) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    Total 19086 Record«Prev1... 879880881882883884885886...955Next»
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