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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    123-13-650-41-001000

    123-13-650-41-001000

    CONN IC DIP SOCKET 50POS GOLD

    Mill-Max Manufacturing Corp.

    2,309
    RFQ
    123-13-650-41-001000

    Tabla de datos

    123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    510-41-084-10-031001

    510-41-084-10-031001

    SKT PGA SOLDRTL

    Mill-Max Manufacturing Corp.

    4,672
    RFQ
    510-41-084-10-031001

    Tabla de datos

    510 Bulk Active PGA 84 (10 x 10) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    514-87-281-19-081117

    514-87-281-19-081117

    CONN SOCKET PGA 281POS GOLD

    Preci-Dip

    2,433
    RFQ
    514-87-281-19-081117

    Tabla de datos

    514 Bulk Active PGA 281 (19 x 19) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    714-43-252-31-018000

    714-43-252-31-018000

    CONN IC DIP SOCKET 52POS GOLD

    Mill-Max Manufacturing Corp.

    2,150
    RFQ
    714-43-252-31-018000

    Tabla de datos

    714 Bulk Active DIP, 0.1" (2.54mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    36-6503-31

    36-6503-31

    CONN IC DIP SOCKET 36POS GOLD

    Aries Electronics

    4,452
    RFQ
    36-6503-31

    Tabla de datos

    503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    110-41-964-61-001000

    110-41-964-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,806
    RFQ

    -

    110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-93-650-61-001000

    115-93-650-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,674
    RFQ

    -

    115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-652-61-003000

    116-43-652-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,955
    RFQ

    -

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-648-61-007000

    116-43-648-61-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,755
    RFQ

    -

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    510-91-085-11-041003

    510-91-085-11-041003

    SKT PGA SOLDRTL

    Mill-Max Manufacturing Corp.

    3,907
    RFQ
    510-91-085-11-041003

    Tabla de datos

    510 Bulk Active PGA 85 (11 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-43-648-61-003000

    115-43-648-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,271
    RFQ

    -

    115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    517-83-364-17-091111

    517-83-364-17-091111

    CONN SOCKET PGA 364POS GOLD

    Preci-Dip

    2,632
    RFQ
    517-83-364-17-091111

    Tabla de datos

    517 Bulk Active PGA 364 (17 x 17) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    122-11-952-41-001000

    122-11-952-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,351
    RFQ
    122-11-952-41-001000

    Tabla de datos

    122 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-83-168-17-101112

    614-83-168-17-101112

    CONN SOCKET PGA 168POS GOLD

    Preci-Dip

    2,857
    RFQ
    614-83-168-17-101112

    Tabla de datos

    614 Bulk Active PGA 168 (17 x 17) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    40-C182-20

    40-C182-20

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    2,231
    RFQ
    40-C182-20

    Tabla de datos

    EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    APH-0428-G-T

    APH-0428-G-T

    APH-0428-G-T

    Samtec Inc.

    3,588
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0528-G-T

    APH-0528-G-T

    APH-0528-G-T

    Samtec Inc.

    3,243
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0928-G-T

    APH-0928-G-T

    APH-0928-G-T

    Samtec Inc.

    3,451
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0628-G-T

    APH-0628-G-T

    APH-0628-G-T

    Samtec Inc.

    2,526
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1228-G-T

    APH-1228-G-T

    APH-1228-G-T

    Samtec Inc.

    3,277
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    Total 19086 Record«Prev1... 825826827828829830831832...955Next»
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