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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    517-83-365-14-000111

    517-83-365-14-000111

    CONN SOCKET PGA 365POS GOLD

    Preci-Dip

    2,451
    RFQ
    517-83-365-14-000111

    Tabla de datos

    517 Bulk Active PGA 365 (14 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    612-13-952-41-001000

    612-13-952-41-001000

    SOCKET CARRIER SLDRTL .900 52POS

    Mill-Max Manufacturing Corp.

    4,402
    RFQ
    612-13-952-41-001000

    Tabla de datos

    612 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    40-3551-11

    40-3551-11

    CONN IC DIP SOCKET ZIF 40POS GLD

    Aries Electronics

    3,653
    RFQ
    40-3551-11

    Tabla de datos

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    40-3554-11

    40-3554-11

    CONN IC DIP SOCKET ZIF 40POS GLD

    Aries Electronics

    3,062
    RFQ
    40-3554-11

    Tabla de datos

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    APH-1924-G-R

    APH-1924-G-R

    APH-1924-G-R

    Samtec Inc.

    2,350
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0524-G-R

    APH-0524-G-R

    APH-0524-G-R

    Samtec Inc.

    3,567
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0325-G-H

    APH-0325-G-H

    APH-0325-G-H

    Samtec Inc.

    2,782
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1224-G-R

    APH-1224-G-R

    APH-1224-G-R

    Samtec Inc.

    4,212
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0324-G-R

    APH-0324-G-R

    APH-0324-G-R

    Samtec Inc.

    4,713
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1324-G-R

    APH-1324-G-R

    APH-1324-G-R

    Samtec Inc.

    2,925
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0824-G-R

    APH-0824-G-R

    APH-0824-G-R

    Samtec Inc.

    4,491
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0224-G-R

    APH-0224-G-R

    APH-0224-G-R

    Samtec Inc.

    2,675
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    32-6571-11

    32-6571-11

    CONN IC DIP SOCKET ZIF 32POS GLD

    Aries Electronics

    3,907
    RFQ
    32-6571-11

    Tabla de datos

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    32-6573-11

    32-6573-11

    CONN IC DIP SOCKET ZIF 32POS TIN

    Aries Electronics

    3,506
    RFQ
    32-6573-11

    Tabla de datos

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    110-43-316-61-801000

    110-43-316-61-801000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,809
    RFQ

    -

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-93-316-61-801000

    110-93-316-61-801000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,526
    RFQ

    -

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    121-13-952-41-001000

    121-13-952-41-001000

    CONN IC DIP SOCKET 52POS GOLD

    Mill-Max Manufacturing Corp.

    4,204
    RFQ
    121-13-952-41-001000

    Tabla de datos

    121 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    111-43-642-61-001000

    111-43-642-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,441
    RFQ

    -

    111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    111-93-642-61-001000

    111-93-642-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,596
    RFQ

    -

    111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APO-318-G-T

    APO-318-G-T

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    2,655
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
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