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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    12-6810-90C

    12-6810-90C

    CONN IC DIP SOCKET 12POS GOLD

    Aries Electronics

    45
    RFQ
    12-6810-90C

    Tabla de datos

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    APA-640-T-B

    APA-640-T-B

    ADAPTER PLUG

    Samtec Inc.

    100
    RFQ
    APA-640-T-B

    Tabla de datos

    APA Bulk Active - 40 (2 x 20) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    APA-640-G-A1

    APA-640-G-A1

    ADAPTER PLUG

    Samtec Inc.

    98
    RFQ
    APA-640-G-A1

    Tabla de datos

    APA Bulk Active - 40 (2 x 20) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    28-823-90C

    28-823-90C

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    7
    RFQ
    28-823-90C

    Tabla de datos

    Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    299-93-628-10-002000

    299-93-628-10-002000

    CONN IC DIP SOCKET 28POS GOLD

    Mill-Max Manufacturing Corp.

    56
    RFQ
    299-93-628-10-002000

    Tabla de datos

    299 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-13-640-41-801000

    110-13-640-41-801000

    CONN IC DIP SOCKET 40POS GOLD

    Mill-Max Manufacturing Corp.

    30
    RFQ
    110-13-640-41-801000

    Tabla de datos

    110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APA-316-G-P

    APA-316-G-P

    ADAPTER PLUG

    Samtec Inc.

    26
    RFQ
    APA-316-G-P

    Tabla de datos

    APA Tube Active - 16 (2 x 8) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    40-516-11

    40-516-11

    CONN IC DIP SOCKET ZIF 40POS GLD

    Aries Electronics

    20
    RFQ
    40-516-11

    Tabla de datos

    516 Bulk Active DIP, ZIF (ZIP) 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled -
    110-13-324-41-801000

    110-13-324-41-801000

    CONN IC DIP SOCKET 24POS GOLD

    Mill-Max Manufacturing Corp.

    55
    RFQ
    110-13-324-41-801000

    Tabla de datos

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    209-PGM17020-10

    209-PGM17020-10

    CONN SOCKET PGA GOLD

    Aries Electronics

    8
    RFQ
    209-PGM17020-10

    Tabla de datos

    PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    2-2129710-8

    2-2129710-8

    CONN SOCKET LGA 3647POS GOLD

    TE Connectivity AMP Connectors

    34
    RFQ
    2-2129710-8

    Tabla de datos

    - Tray Active LGA 3647 - Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder - - - Copper Alloy Thermoplastic -
    256-1292-00-0602J

    256-1292-00-0602J

    CONN IC DIP SOCKET ZIF 56POS GLD

    3M

    13
    RFQ
    256-1292-00-0602J

    Tabla de datos

    Textool™ Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 56 (2 x 28) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
    260-4204-01

    260-4204-01

    CONN SOCKET QFN 60POS GOLD

    3M

    14
    RFQ
    260-4204-01

    Tabla de datos

    Textool™ Bulk Active QFN 60 (4 x 15) 0.016" (0.40mm) Gold - Beryllium Copper Through Hole Open Frame Solder 0.016" (0.40mm) Gold - Beryllium Copper Polyethersulfone (PES) -
    ICO-314-STT

    ICO-314-STT

    CONN IC DIP SOCKET 14POS TIN

    Samtec Inc.

    68
    RFQ
    ICO-314-STT

    Tabla de datos

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    123-83-314-41-001101

    123-83-314-41-001101

    CONN IC DIP SOCKET 14POS GOLD

    Preci-Dip

    30
    RFQ
    123-83-314-41-001101

    Tabla de datos

    123 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    4590

    4590

    CONN TRANSIST TO-5 3POS TIN

    Keystone Electronics

    58
    RFQ
    4590

    Tabla de datos

    - Bulk Active Transistor, TO-5 3 (Round) - Tin - Brass Chassis Mount Closed Frame Solder - Tin - Brass Polyester, Glass Filled -
    APA-314-T-A1

    APA-314-T-A1

    ADAPTER PLUG

    Samtec Inc.

    98
    RFQ
    APA-314-T-A1

    Tabla de datos

    APA Bulk Active - 14 (2 x 7) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    299-83-308-10-001101

    299-83-308-10-001101

    CONN IC DIP SOCKET 8POS GOLD

    Preci-Dip

    47
    RFQ
    299-83-308-10-001101

    Tabla de datos

    299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICO-320-MTT

    ICO-320-MTT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    66
    RFQ
    ICO-320-MTT

    Tabla de datos

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    XR2C-2015

    XR2C-2015

    CONN SOCKET SIP 20POS GOLD

    Omron Electronics Inc-EMC Div

    43
    RFQ
    XR2C-2015

    Tabla de datos

    XR2 Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
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