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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    299-93-316-10-001000

    299-93-316-10-001000

    CONN IC DIP SOCKET 16POS GOLD

    Mill-Max Manufacturing Corp.

    78
    RFQ
    299-93-316-10-001000

    Tabla de datos

    299 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-93-632-31-012000

    614-93-632-31-012000

    CONN IC DIP SOCKET 32POS GOLD

    Mill-Max Manufacturing Corp.

    48
    RFQ
    614-93-632-31-012000

    Tabla de datos

    614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    ICO-640-SGT

    ICO-640-SGT

    CONN IC DIP SOCKET 40POS GOLD

    Samtec Inc.

    52
    RFQ
    ICO-640-SGT

    Tabla de datos

    ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    110-93-628-41-801000

    110-93-628-41-801000

    CONN IC DIP SOCKET 28POS GOLD

    Mill-Max Manufacturing Corp.

    58
    RFQ
    110-93-628-41-801000

    Tabla de datos

    110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    10-2822-90

    10-2822-90

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    29
    RFQ
    10-2822-90

    Tabla de datos

    Vertisockets™ 800 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    123-93-632-41-001000

    123-93-632-41-001000

    CONN IC DIP SOCKET 32POS GOLD

    Mill-Max Manufacturing Corp.

    66
    RFQ
    123-93-632-41-001000

    Tabla de datos

    123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    299-43-320-11-001000

    299-43-320-11-001000

    CONN IC DIP SOCKET 20POS GOLD

    Mill-Max Manufacturing Corp.

    99
    RFQ
    299-43-320-11-001000

    Tabla de datos

    299 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    4592

    4592

    CONN TRANSIST TO-5 8POS TIN

    Keystone Electronics

    57
    RFQ
    4592

    Tabla de datos

    - Bulk Active Transistor, TO-5 8 (Round) - Tin - Brass Chassis Mount Closed Frame Solder - Tin - Brass Polyester, Glass Filled -
    299-93-320-10-001000

    299-93-320-10-001000

    CONN IC DIP SOCKET 20POS GOLD

    Mill-Max Manufacturing Corp.

    59
    RFQ
    299-93-320-10-001000

    Tabla de datos

    299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    16-823-90

    16-823-90

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    55
    RFQ
    16-823-90

    Tabla de datos

    Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    08-810-90

    08-810-90

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    60
    RFQ
    08-810-90

    Tabla de datos

    Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    40-C182-10

    40-C182-10

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    68
    RFQ
    40-C182-10

    Tabla de datos

    EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    117-93-656-41-005000

    117-93-656-41-005000

    CONN IC DIP SOCKET 56POS GOLD

    Mill-Max Manufacturing Corp.

    69
    RFQ
    117-93-656-41-005000

    Tabla de datos

    117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 56 (2 x 28) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    299-43-618-10-002000

    299-43-618-10-002000

    CONN IC DIP SOCKET 18POS GOLD

    Mill-Max Manufacturing Corp.

    41
    RFQ
    299-43-618-10-002000

    Tabla de datos

    299 Tube Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    TCC03DKSN-S1713

    TCC03DKSN-S1713

    CONN TRANSIST TO-262 3POS GOLD

    Sullins Connector Solutions

    10
    RFQ
    TCC03DKSN-S1713

    Tabla de datos

    - Tray Active Transistor, TO-262 3 (Rectangular) 0.150" (3.81mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.150" (3.81mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyphenylene Sulfide (PPS) -50°C ~ 175°C
    117-93-764-41-005000

    117-93-764-41-005000

    CONN IC DIP SOCKET 64POS GOLD

    Mill-Max Manufacturing Corp.

    8
    RFQ
    117-93-764-41-005000

    Tabla de datos

    117 Tube Active DIP, 0.75" (19.05mm) Row Spacing 64 (2 x 32) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    16-810-90C

    16-810-90C

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    49
    RFQ
    16-810-90C

    Tabla de datos

    Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    299-43-628-10-002000

    299-43-628-10-002000

    CONN IC DIP SOCKET 28POS GOLD

    Mill-Max Manufacturing Corp.

    51
    RFQ
    299-43-628-10-002000

    Tabla de datos

    299 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    346-43-164-41-013000

    346-43-164-41-013000

    CONN SOCKET SIP 64POS GOLD

    Mill-Max Manufacturing Corp.

    51
    RFQ
    346-43-164-41-013000

    Tabla de datos

    346 Tube Active SIP 64 (1 x 64) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    18-6810-90T

    18-6810-90T

    CONN IC DIP SOCKET 18POS TIN

    Aries Electronics

    41
    RFQ
    18-6810-90T

    Tabla de datos

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    Total 19086 Record«Prev1... 5455565758596061...955Next»
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