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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    4818-3000-CP

    4818-3000-CP

    CONN IC DIP SOCKET 18POS TIN

    3M

    756
    RFQ
    4818-3000-CP

    Tabla de datos

    4800 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 35.0µin (0.90µm) Phosphor Bronze Polyester, Glass Filled -25°C ~ 85°C
    08-3518-10T

    08-3518-10T

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    579
    RFQ
    08-3518-10T

    Tabla de datos

    518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    ICM-324-1-GT-HT

    ICM-324-1-GT-HT

    MACHINE PIN SOCKET, IC, DIP, 24P

    Adam Tech

    215
    RFQ
    ICM-324-1-GT-HT

    Tabla de datos

    ICM Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Polyphenylene Sulfide (PPS) -40°C ~ 105°C
    SA183000

    SA183000

    CONN IC DIP SOCKET 18POS GOLD

    On Shore Technology Inc.

    769
    RFQ
    SA183000

    Tabla de datos

    SA Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Thermoplastic, Polyester, Glass Filled -40°C ~ 105°C
    06-0518-10

    06-0518-10

    CONN SOCKET SIP 6POS GOLD

    Aries Electronics

    717
    RFQ
    06-0518-10

    Tabla de datos

    518 Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    ICM-628-1-GT-HT

    ICM-628-1-GT-HT

    MACHINE PIN SOCKET, IC, DIP, 28P

    Adam Tech

    706
    RFQ
    ICM-628-1-GT-HT

    Tabla de datos

    ICM Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Polyphenylene Sulfide (PPS) -40°C ~ 105°C
    A-CCS 028-Z-SM

    A-CCS 028-Z-SM

    CONN SOCKET PLCC 28POS TIN

    Assmann WSW Components

    77
    RFQ
    A-CCS 028-Z-SM

    Tabla de datos

    - Tube Active PLCC 28 (4 x 7) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Polyamide (PA9T), Nylon 9T, Glass Filled -40°C ~ 105°C
    917-47-108-41-005000

    917-47-108-41-005000

    CONN SOCKET TRANSIST TO-5 8POS

    Mill-Max Manufacturing Corp.

    87
    RFQ
    917-47-108-41-005000

    Tabla de datos

    917 Tube Active Transistor, TO-5 8 (Round) - Gold Flash Beryllium Copper Through Hole Closed Frame Solder - Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    917-47-210-41-005000

    917-47-210-41-005000

    CONN SOCKET TRANSIST TO-5 10POS

    Mill-Max Manufacturing Corp.

    31
    RFQ
    917-47-210-41-005000

    Tabla de datos

    917 Tube Active Transistor, TO-100 10 (Round) - Gold Flash Beryllium Copper Through Hole Closed Frame Solder - Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-43-308-10-001000

    110-43-308-10-001000

    CONN IC DIP SOCKET 8POS GOLD

    Mill-Max Manufacturing Corp.

    55
    RFQ
    110-43-308-10-001000

    Tabla de datos

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4), 4 Loaded 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    ICA-308-SGT

    ICA-308-SGT

    CONN IC DIP SOCKET 8POS GOLD

    Samtec Inc.

    79
    RFQ
    ICA-308-SGT

    Tabla de datos

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    XR2A-1611-N

    XR2A-1611-N

    CONN IC DIP SOCKET 16POS GOLD

    Omron Electronics Inc-EMC Div

    49
    RFQ
    XR2A-1611-N

    Tabla de datos

    XR2 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
    110-13-318-41-001000

    110-13-318-41-001000

    CONN IC DIP SOCKET 18POS GOLD

    Mill-Max Manufacturing Corp.

    90
    RFQ
    110-13-318-41-001000

    Tabla de datos

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    123-13-308-41-001000

    123-13-308-41-001000

    CONN IC DIP SOCKET 8POS GOLD

    Mill-Max Manufacturing Corp.

    99
    RFQ
    123-13-308-41-001000

    Tabla de datos

    123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-13-624-41-001000

    110-13-624-41-001000

    CONN IC DIP SOCKET 24POS GOLD

    Mill-Max Manufacturing Corp.

    48
    RFQ
    110-13-624-41-001000

    Tabla de datos

    110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-99-964-41-001000

    110-99-964-41-001000

    CONN IC DIP SOCKET 64POS TINLEAD

    Mill-Max Manufacturing Corp.

    95
    RFQ
    110-99-964-41-001000

    Tabla de datos

    110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-47-964-41-001000

    110-47-964-41-001000

    CONN IC DIP SOCKET 64POS GOLD

    Mill-Max Manufacturing Corp.

    42
    RFQ
    110-47-964-41-001000

    Tabla de datos

    110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    40-0518-11

    40-0518-11

    CONN SOCKET SIP 40POS GOLD

    Aries Electronics

    85
    RFQ
    40-0518-11

    Tabla de datos

    518 Bulk Active SIP 40 (1 x 40) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    24-526-10

    24-526-10

    CONN IC DIP SOCKET ZIF 24POS TIN

    Aries Electronics

    62
    RFQ
    24-526-10

    Tabla de datos

    Lo-PRO®file, 526 Bulk Active DIP, ZIF (ZIP) 24 (2 x 12) 0.100" (2.54mm) Tin 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    24-6554-10

    24-6554-10

    CONN IC DIP SOCKET ZIF 24POS TIN

    Aries Electronics

    63
    RFQ
    24-6554-10

    Tabla de datos

    55 Tube Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    Total 19086 Record«Prev1... 4950515253545556...955Next»
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