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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    1981837-2

    1981837-2

    CONN SOCKET LGA 1366POS GOLD

    TE Connectivity AMP Connectors

    3,956
    RFQ
    1981837-2

    Tabla de datos

    - Tray Obsolete LGA 1366 (32 x 41) 0.040" (1.02mm) Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder 0.040" (1.01mm) - - Copper Alloy Thermoplastic -
    APA-316-G-N

    APA-316-G-N

    ADAPTER PLUG

    Samtec Inc.

    3,439
    RFQ
    APA-316-G-N

    Tabla de datos

    APA Tube Active - 16 (2 x 8) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    ICO-640-MGT

    ICO-640-MGT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    3,327
    RFQ
    ICO-640-MGT

    Tabla de datos

    ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    101-93-422-41-560000

    101-93-422-41-560000

    CONN IC DIP SOCKET 22POS GOLD

    Mill-Max Manufacturing Corp.

    486
    RFQ
    101-93-422-41-560000

    Tabla de datos

    101 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-93-420-41-001000

    110-93-420-41-001000

    CONN IC DIP SOCKET 20POS GOLD

    Mill-Max Manufacturing Corp.

    538
    RFQ
    110-93-420-41-001000

    Tabla de datos

    110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    299-43-632-10-002000

    299-43-632-10-002000

    CONN IC DIP SOCKET 32POS GOLD

    Mill-Max Manufacturing Corp.

    300
    RFQ
    299-43-632-10-002000

    Tabla de datos

    299 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-43-424-41-003000

    115-43-424-41-003000

    CONN IC DIP SOCKET 24POS GOLD

    Mill-Max Manufacturing Corp.

    488
    RFQ
    115-43-424-41-003000

    Tabla de datos

    115 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    ICF-640-S-O-TR

    ICF-640-S-O-TR

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    4,319
    RFQ
    ICF-640-S-O-TR

    Tabla de datos

    ICF Tape & Reel (TR) Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    ICO-640-NGT

    ICO-640-NGT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    3,614
    RFQ
    ICO-640-NGT

    Tabla de datos

    ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    116-93-318-41-007000

    116-93-318-41-007000

    CONN IC DIP SOCKET 18POS GOLD

    Mill-Max Manufacturing Corp.

    892
    RFQ
    116-93-318-41-007000

    Tabla de datos

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    8059-2G5

    8059-2G5

    CONN SOCKET TRANSIST TO-5 8POS

    TE Connectivity AMP Connectors

    3,112
    RFQ
    8059-2G5

    Tabla de datos

    - Bulk Obsolete Transistor, TO-5 8 (Round) - Gold - Copper Alloy Through Hole Closed Frame Solder - Gold - Copper Alloy Polyamide (PA), Nylon -55°C ~ 125°C
    2-1437531-2

    2-1437531-2

    CONN IC DIP SOCKET 14POS GOLD

    TE Connectivity AMP Connectors

    2,717
    RFQ
    2-1437531-2

    Tabla de datos

    500 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold - Copper Alloy Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Copper Alloy - -55°C ~ 125°C
    117-93-628-41-005000

    117-93-628-41-005000

    CONN IC DIP SOCKET 28POS GOLD

    Mill-Max Manufacturing Corp.

    193
    RFQ
    117-93-628-41-005000

    Tabla de datos

    117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    3-1437508-1

    3-1437508-1

    CONN TRANSIST TO-5 8POS GOLD

    TE Connectivity AMP Connectors

    2,249
    RFQ
    3-1437508-1

    Tabla de datos

    8058 Bulk Obsolete Transistor, TO-5 8 (Round) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Brass Polytetrafluoroethylene (PTFE) -55°C ~ 125°C
    2-822114-3

    2-822114-3

    CONN SOCKET PQFP 144POS TIN-LEAD

    TE Connectivity AMP Connectors

    4,095
    RFQ
    2-822114-3

    Tabla de datos

    - Tube Obsolete QFP 144 (4 x 36) 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) Phosphor Bronze Liquid Crystal Polymer (LCP) -
    2201838-2

    2201838-2

    CONN SOCKET LGA 2011POS GOLD

    TE Connectivity AMP Connectors

    2,727
    RFQ
    2201838-2

    Tabla de datos

    - Bulk Obsolete LGA 2011 (47 x 58) 0.040" (1.02mm) Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder 0.035" (0.90mm) Gold 30.0µin (0.76µm) Copper Alloy Thermoplastic -
    2201838-1

    2201838-1

    CONN SOCKET LGA 2011POS GOLD

    TE Connectivity AMP Connectors

    2,353
    RFQ
    2201838-1

    Tabla de datos

    - Bulk Obsolete LGA 2011 (47 x 58) 0.040" (1.02mm) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Open Frame Solder 0.035" (0.90mm) Gold 15.0µin (0.38µm) Copper Alloy Thermoplastic -
    ASPI0002-P001A

    ASPI0002-P001A

    SPI 8Pin WSON 8X6

    LOTES

    3,430
    RFQ
    ASPI0002-P001A

    Tabla de datos

    - Tape & Reel (TR) Active SOIC 8 (2 x 4) 0.050" (1.27mm) Gold 15.0µin (0.38µm) Phosphor Bronze Surface Mount Board Guide, Closed Frame Solder 0.050" (1.27mm) Gold Flash Phosphor Bronze Liquid Crystal Polymer (LCP) -
    ASPI0001-P001A

    ASPI0001-P001A

    SPI 8 PIN_IC 150mil

    LOTES

    1,710
    RFQ
    ASPI0001-P001A

    Tabla de datos

    - Tape & Reel (TR) Active SOIC 8 (2 x 4) 0.050" (1.27mm) Gold 1.00µin (0.025µm) Phosphor Bronze Surface Mount Board Guide, Closed Frame Solder 0.050" (1.27mm) Gold 1.00µin (0.025µm) Phosphor Bronze Liquid Crystal Polymer (LCP) -
    ACA-SPI-004-K01

    ACA-SPI-004-K01

    SPI 8 PIN_IC 208mil

    LOTES

    1,660
    RFQ
    ACA-SPI-004-K01

    Tabla de datos

    - Tape & Reel (TR) Active SOIC 8 (2 x 4) 0.050" (1.27mm) Gold 1.00µin (0.025µm) Phosphor Bronze Surface Mount Board Guide, Closed Frame Solder 0.050" (1.27mm) Gold 1.00µin (0.025µm) Phosphor Bronze Liquid Crystal Polymer (LCP) -
    Total 19086 Record«Prev1... 4546474849505152...955Next»
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