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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    24-3554-10

    24-3554-10

    CONN IC DIP SOCKET ZIF 24POS TIN

    Aries Electronics

    2,754
    RFQ
    24-3554-10

    Tabla de datos

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    116-93-210-41-003000

    116-93-210-41-003000

    CONN IC DIP SOCKET 10POS GOLD

    Mill-Max Manufacturing Corp.

    3,740
    RFQ
    116-93-210-41-003000

    Tabla de datos

    116 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-210-41-003000

    116-43-210-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,435
    RFQ
    116-43-210-41-003000

    Tabla de datos

    116 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    111-47-322-41-001000

    111-47-322-41-001000

    STANDRD SOLDRTL DBL SKT

    Mill-Max Manufacturing Corp.

    4,960
    RFQ
    111-47-322-41-001000

    Tabla de datos

    111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    111-47-422-41-001000

    111-47-422-41-001000

    STANDRD SOLDRTL DBL SKT

    Mill-Max Manufacturing Corp.

    3,489
    RFQ
    111-47-422-41-001000

    Tabla de datos

    111 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    32-3503-20

    32-3503-20

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    3,568
    RFQ
    32-3503-20

    Tabla de datos

    503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    32-3503-30

    32-3503-30

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    2,373
    RFQ
    32-3503-30

    Tabla de datos

    503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    605-41-308-11-480000

    605-41-308-11-480000

    SKT CARRIER LOWPRO

    Mill-Max Manufacturing Corp.

    2,163
    RFQ
    605-41-308-11-480000

    Tabla de datos

    605 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    605-91-308-11-480000

    605-91-308-11-480000

    SKT CARRIER LOWPRO

    Mill-Max Manufacturing Corp.

    4,699
    RFQ
    605-91-308-11-480000

    Tabla de datos

    605 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    ICA-422-AGG

    ICA-422-AGG

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    3,000
    RFQ
    ICA-422-AGG

    Tabla de datos

    ICA Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    HLS-0214-G-11

    HLS-0214-G-11

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,907
    RFQ
    HLS-0214-G-11

    Tabla de datos

    HLS Tube Active SIP 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    110-47-322-41-105000

    110-47-322-41-105000

    STANDRD SOLDRTL

    Mill-Max Manufacturing Corp.

    4,533
    RFQ
    110-47-322-41-105000

    Tabla de datos

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-47-422-41-105000

    110-47-422-41-105000

    STANDRD SOLDRTL

    Mill-Max Manufacturing Corp.

    2,942
    RFQ
    110-47-422-41-105000

    Tabla de datos

    110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-0320-S-2

    HLS-0320-S-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,115
    RFQ
    HLS-0320-S-2

    Tabla de datos

    HLS Tube Active SIP 60 (3 x 20) 0.100" (2.54mm) Gold - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    126-93-306-41-002000

    126-93-306-41-002000

    CONN IC DIP SOCKET 6POS GOLD

    Mill-Max Manufacturing Corp.

    2,748
    RFQ
    126-93-306-41-002000

    Tabla de datos

    126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-43-306-41-002000

    126-43-306-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,397
    RFQ
    126-43-306-41-002000

    Tabla de datos

    126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    32-820-90C

    32-820-90C

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    4,743
    RFQ
    32-820-90C

    Tabla de datos

    Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    317-91-112-41-005000

    317-91-112-41-005000

    CONN SKT SNG

    Mill-Max Manufacturing Corp.

    2,520
    RFQ
    317-91-112-41-005000

    Tabla de datos

    317 Bulk Active SIP 12 (1 x 12) 0.070" (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-0120-G-18

    HLS-0120-G-18

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,373
    RFQ
    HLS-0120-G-18

    Tabla de datos

    HLS Tube Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    116-93-308-41-007000

    116-93-308-41-007000

    CONN IC DIP SOCKET 8POS GOLD

    Mill-Max Manufacturing Corp.

    2,304
    RFQ
    116-93-308-41-007000

    Tabla de datos

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    Total 19086 Record«Prev1... 491492493494495496497498...955Next»
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