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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    APH-0706-G-T

    APH-0706-G-T

    APH-0706-G-T

    Samtec Inc.

    2,585
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1806-G-T

    APH-1806-G-T

    APH-1806-G-T

    Samtec Inc.

    4,550
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    28-516-11S

    28-516-11S

    CONN IC DIP SOCKET ZIF 28POS GLD

    Aries Electronics

    3,990
    RFQ
    28-516-11S

    Tabla de datos

    516 Bulk Active DIP, ZIF (ZIP) 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled -
    ICO-632-AGT

    ICO-632-AGT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,302
    RFQ
    ICO-632-AGT

    Tabla de datos

    ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    612-41-306-41-001000

    612-41-306-41-001000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    4,541
    RFQ
    612-41-306-41-001000

    Tabla de datos

    612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-91-306-41-001000

    612-91-306-41-001000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    4,796
    RFQ
    612-91-306-41-001000

    Tabla de datos

    612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    30-3513-11H

    30-3513-11H

    CONN IC DIP SOCKET 30POS GOLD

    Aries Electronics

    2,357
    RFQ
    30-3513-11H

    Tabla de datos

    Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    714-43-137-31-018000

    714-43-137-31-018000

    CONN SOCKET SIP 37POS GOLD

    Mill-Max Manufacturing Corp.

    4,401
    RFQ
    714-43-137-31-018000

    Tabla de datos

    714 Bulk Active SIP 37 (1 x 37) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-99-432-41-001000

    110-99-432-41-001000

    CONN IC DIP SOCKET 32POS TINLEAD

    Mill-Max Manufacturing Corp.

    3,929
    RFQ
    110-99-432-41-001000

    Tabla de datos

    110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    317-43-105-41-005000

    317-43-105-41-005000

    CONN SKT STRIP

    Mill-Max Manufacturing Corp.

    4,445
    RFQ
    317-43-105-41-005000

    Tabla de datos

    317 Bulk Active SIP 5 (1 x 5) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-47-322-41-003000

    115-47-322-41-003000

    STANDRD SOLDRTL DBL SKT

    Mill-Max Manufacturing Corp.

    2,436
    RFQ
    115-47-322-41-003000

    Tabla de datos

    115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    50-9513-11

    50-9513-11

    CONN IC DIP SOCKET 50POS GOLD

    Aries Electronics

    2,846
    RFQ
    50-9513-11

    Tabla de datos

    Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-C195-21

    14-C195-21

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    4,923
    RFQ
    14-C195-21

    Tabla de datos

    EJECT-A-DIP™ Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    14-C195-31

    14-C195-31

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    2,072
    RFQ
    14-C195-31

    Tabla de datos

    EJECT-A-DIP™ Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    14-C280-21

    14-C280-21

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    2,596
    RFQ
    14-C280-21

    Tabla de datos

    EJECT-A-DIP™ Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    14-C280-31

    14-C280-31

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    4,764
    RFQ
    14-C280-31

    Tabla de datos

    EJECT-A-DIP™ Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    37-PGM10013-10

    37-PGM10013-10

    CONN SOCKET PGA GOLD

    Aries Electronics

    2,028
    RFQ
    37-PGM10013-10

    Tabla de datos

    PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    111-41-318-41-001000

    111-41-318-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,850
    RFQ
    111-41-318-41-001000

    Tabla de datos

    111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    510-83-233-18-071101

    510-83-233-18-071101

    CONN SOCKET PGA 233POS GOLD

    Preci-Dip

    3,167
    RFQ
    510-83-233-18-071101

    Tabla de datos

    510 Bulk Active PGA 233 (18 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICO-632-ZMGG

    ICO-632-ZMGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    2,286
    RFQ
    ICO-632-ZMGG

    Tabla de datos

    ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    Total 19086 Record«Prev1... 488489490491492493494495...955Next»
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