Sesión o Registro
    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    APH-0320-T-T

    APH-0320-T-T

    APH-0320-T-T

    Samtec Inc.

    3,294
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0820-T-T

    APH-0820-T-T

    APH-0820-T-T

    Samtec Inc.

    3,867
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1220-T-T

    APH-1220-T-T

    APH-1220-T-T

    Samtec Inc.

    4,452
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0420-T-T

    APH-0420-T-T

    APH-0420-T-T

    Samtec Inc.

    2,657
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    110-99-304-61-001000

    110-99-304-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,933
    RFQ

    -

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    40-516-10

    40-516-10

    CONN IC DIP SOCKET ZIF 40POS TIN

    Aries Electronics

    3,690
    RFQ
    40-516-10

    Tabla de datos

    516 Bulk Obsolete DIP, ZIF (ZIP) 40 (2 x 20) 0.100" (2.54mm) Tin 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled -
    510-83-184-15-001101

    510-83-184-15-001101

    CONN SOCKET PGA 184POS GOLD

    Preci-Dip

    4,653
    RFQ
    510-83-184-15-001101

    Tabla de datos

    510 Bulk Active PGA 184 (15 x 15) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-184-17-081101

    510-83-184-17-081101

    CONN SOCKET PGA 184POS GOLD

    Preci-Dip

    4,194
    RFQ
    510-83-184-17-081101

    Tabla de datos

    510 Bulk Active PGA 184 (17 x 17) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0306-G-18

    HLS-0306-G-18

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,011
    RFQ
    HLS-0306-G-18

    Tabla de datos

    HLS Tube Active SIP 18 (3 x 6) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    APA-318-G-A1

    APA-318-G-A1

    ADAPTER PLUG

    Samtec Inc.

    4,476
    RFQ
    APA-318-G-A1

    Tabla de datos

    APA Bulk Active - 18 (2 x 9) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    APO-318-G-A1

    APO-318-G-A1

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    2,343
    RFQ
    APO-318-G-A1

    Tabla de datos

    APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    APO-308-G-R

    APO-308-G-R

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    2,292
    RFQ
    APO-308-G-R

    Tabla de datos

    APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    15-0508-21

    15-0508-21

    CONN SOCKET SIP 15POS GOLD

    Aries Electronics

    2,429
    RFQ
    15-0508-21

    Tabla de datos

    508 Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    15-0508-31

    15-0508-31

    CONN SOCKET SIP 15POS GOLD

    Aries Electronics

    3,268
    RFQ
    15-0508-31

    Tabla de datos

    508 Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    28-C182-11H

    28-C182-11H

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    4,055
    RFQ
    28-C182-11H

    Tabla de datos

    EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    510-83-191-18-091101

    510-83-191-18-091101

    CONN SOCKET PGA 191POS GOLD

    Preci-Dip

    2,470
    RFQ
    510-83-191-18-091101

    Tabla de datos

    510 Bulk Active PGA 191 (18 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICA-320-ZWGG

    ICA-320-ZWGG

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    4,186
    RFQ
    ICA-320-ZWGG

    Tabla de datos

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICO-628-MGG

    ICO-628-MGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    2,518
    RFQ
    ICO-628-MGG

    Tabla de datos

    ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    14-3503-21

    14-3503-21

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    4,032
    RFQ
    14-3503-21

    Tabla de datos

    503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    14-3503-31

    14-3503-31

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    4,608
    RFQ
    14-3503-31

    Tabla de datos

    503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    Total 19086 Record«Prev1... 427428429430431432433434...955Next»
    KATY Electronic Technology Co., LTD

    Casa

    KATY Electronic Technology Co., LTD

    Productos

    KATY Electronic Technology Co., LTD

    Teléfono

    KATY Electronic Technology Co., LTD

    Usuarios