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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    APH-1614-T-R

    APH-1614-T-R

    APH-1614-T-R

    Samtec Inc.

    3,003
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0908-G-T

    APH-0908-G-T

    APH-0908-G-T

    Samtec Inc.

    2,670
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1214-T-R

    APH-1214-T-R

    APH-1214-T-R

    Samtec Inc.

    2,339
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0814-T-R

    APH-0814-T-R

    APH-0814-T-R

    Samtec Inc.

    4,689
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0708-G-T

    APH-0708-G-T

    APH-0708-G-T

    Samtec Inc.

    2,423
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    16-810-90

    16-810-90

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    2,051
    RFQ
    16-810-90

    Tabla de datos

    Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    13-7450-10

    13-7450-10

    CONN SOCKET SIP 13POS TIN

    Aries Electronics

    3,989
    RFQ
    13-7450-10

    Tabla de datos

    700 Elevator Strip-Line™ Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    13-7970-10

    13-7970-10

    CONN SOCKET SIP 13POS TIN

    Aries Electronics

    2,789
    RFQ
    13-7970-10

    Tabla de datos

    700 Elevator Strip-Line™ Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    38-3513-11

    38-3513-11

    CONN IC DIP SOCKET 38POS GOLD

    Aries Electronics

    2,978
    RFQ
    38-3513-11

    Tabla de datos

    Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 38 (2 x 19) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    15-0503-21

    15-0503-21

    CONN SOCKET SIP 15POS GOLD

    Aries Electronics

    4,522
    RFQ
    15-0503-21

    Tabla de datos

    0503 Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
    15-0503-31

    15-0503-31

    CONN SOCKET SIP 15POS GOLD

    Aries Electronics

    2,677
    RFQ
    15-0503-31

    Tabla de datos

    0503 Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
    22-0508-20

    22-0508-20

    CONN SOCKET SIP 22POS GOLD

    Aries Electronics

    3,820
    RFQ
    22-0508-20

    Tabla de datos

    508 Bulk Active SIP 22 (1 x 22) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    22-0508-30

    22-0508-30

    CONN SOCKET SIP 22POS GOLD

    Aries Electronics

    3,069
    RFQ
    22-0508-30

    Tabla de datos

    508 Bulk Active SIP 22 (1 x 22) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    22-1508-30

    22-1508-30

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    4,887
    RFQ
    22-1508-30

    Tabla de datos

    508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    510-83-181-17-001101

    510-83-181-17-001101

    CONN SOCKET PGA 181POS GOLD

    Preci-Dip

    4,223
    RFQ
    510-83-181-17-001101

    Tabla de datos

    510 Bulk Active PGA 181 (17 x 17) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-181-17-082101

    510-83-181-17-082101

    CONN SOCKET PGA 181POS GOLD

    Preci-Dip

    4,457
    RFQ
    510-83-181-17-082101

    Tabla de datos

    510 Bulk Active PGA 181 (17 x 17) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-181-14-031101

    510-83-181-14-031101

    CONN SOCKET PGA 181POS GOLD

    Preci-Dip

    4,615
    RFQ
    510-83-181-14-031101

    Tabla de datos

    510 Bulk Active PGA 181 (14 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-181-15-001101

    510-83-181-15-001101

    CONN SOCKET PGA 181POS GOLD

    Preci-Dip

    4,701
    RFQ
    510-83-181-15-001101

    Tabla de datos

    510 Bulk Active PGA 181 (15 x 15) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    18-0501-20

    18-0501-20

    CONN SOCKET SIP 18POS TIN

    Aries Electronics

    4,663
    RFQ
    18-0501-20

    Tabla de datos

    501 Bulk Active SIP 18 (1 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    18-0501-30

    18-0501-30

    CONN SOCKET SIP 18POS TIN

    Aries Electronics

    4,210
    RFQ
    18-0501-30

    Tabla de datos

    501 Bulk Active SIP 18 (1 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    Total 19086 Record«Prev1... 423424425426427428429430...955Next»
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