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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    22-4518-01

    22-4518-01

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    3,261
    RFQ
    22-4518-01

    Tabla de datos

    518 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    HLS-0309-T-10

    HLS-0309-T-10

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,146
    RFQ
    HLS-0309-T-10

    Tabla de datos

    HLS Tube Active SIP 27 (3 x 9) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    ICA-316-ZWGG

    ICA-316-ZWGG

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    2,942
    RFQ
    ICA-316-ZWGG

    Tabla de datos

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    HLS-0404-G-2

    HLS-0404-G-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,277
    RFQ
    HLS-0404-G-2

    Tabla de datos

    HLS Bulk Active SIP 16 (4 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    HLS-0408-T-2

    HLS-0408-T-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,557
    RFQ
    HLS-0408-T-2

    Tabla de datos

    HLS Bulk Active SIP 32 (4 x 8) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    10-6621-30

    10-6621-30

    CONN IC DIP SOCKET 10POS TIN

    Aries Electronics

    3,954
    RFQ
    10-6621-30

    Tabla de datos

    6621 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Bottom Entry; Through Board Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    24-3518-11H

    24-3518-11H

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    4,100
    RFQ
    24-3518-11H

    Tabla de datos

    518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    28-6501-30

    28-6501-30

    CONN IC DIP SOCKET 28POS TIN

    Aries Electronics

    3,639
    RFQ
    28-6501-30

    Tabla de datos

    501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    ICA-320-AGG

    ICA-320-AGG

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    3,892
    RFQ
    ICA-320-AGG

    Tabla de datos

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICO-320-AGG

    ICO-320-AGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    3,543
    RFQ
    ICO-320-AGG

    Tabla de datos

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    510-83-179-18-001101

    510-83-179-18-001101

    CONN SOCKET PGA 179POS GOLD

    Preci-Dip

    4,040
    RFQ
    510-83-179-18-001101

    Tabla de datos

    510 Bulk Active PGA 179 (18 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-179-18-111101

    510-83-179-18-111101

    CONN SOCKET PGA 179POS GOLD

    Preci-Dip

    4,571
    RFQ
    510-83-179-18-111101

    Tabla de datos

    510 Bulk Active PGA 179 (18 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-179-18-112101

    510-83-179-18-112101

    CONN SOCKET PGA 179POS GOLD

    Preci-Dip

    2,733
    RFQ
    510-83-179-18-112101

    Tabla de datos

    510 Bulk Active PGA 179 (18 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-179-18-113101

    510-83-179-18-113101

    CONN SOCKET PGA 179POS GOLD

    Preci-Dip

    3,954
    RFQ
    510-83-179-18-113101

    Tabla de datos

    510 Bulk Active PGA 179 (18 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-174-17-061101

    510-83-174-17-061101

    CONN SOCKET PGA 174POS GOLD

    Preci-Dip

    3,568
    RFQ
    510-83-174-17-061101

    Tabla de datos

    510 Bulk Active PGA 174 (17 x 17) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-174-17-081101

    510-83-174-17-081101

    CONN SOCKET PGA 174POS GOLD

    Preci-Dip

    3,981
    RFQ
    510-83-174-17-081101

    Tabla de datos

    510 Bulk Active PGA 174 (17 x 17) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    10-3503-21

    10-3503-21

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    4,198
    RFQ
    10-3503-21

    Tabla de datos

    503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    10-3503-31

    10-3503-31

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    4,050
    RFQ
    10-3503-31

    Tabla de datos

    503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    HLS-0120-G-30

    HLS-0120-G-30

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,653
    RFQ
    HLS-0120-G-30

    Tabla de datos

    HLS Tube Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    510-83-155-16-093101

    510-83-155-16-093101

    CONN SOCKET PGA 155POS GOLD

    Preci-Dip

    2,116
    RFQ
    510-83-155-16-093101

    Tabla de datos

    510 Bulk Active PGA 155 (16 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    Total 19086 Record«Prev1... 413414415416417418419420...955Next»
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