Sesión o Registro
    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    08-6810-90

    08-6810-90

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    3,172
    RFQ
    08-6810-90

    Tabla de datos

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    116-87-640-41-013101

    116-87-640-41-013101

    CONN IC DIP SOCKET 40POS GOLD

    Preci-Dip

    4,861
    RFQ
    116-87-640-41-013101

    Tabla de datos

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICA-320-WGG-2

    ICA-320-WGG-2

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    3,786
    RFQ
    ICA-320-WGG-2

    Tabla de datos

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICO-318-CGG

    ICO-318-CGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    2,350
    RFQ
    ICO-318-CGG

    Tabla de datos

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    APA-314-G-M

    APA-314-G-M

    ADAPTER PLUG

    Samtec Inc.

    4,392
    RFQ
    APA-314-G-M

    Tabla de datos

    APA Tube Active - 14 (2 x 7) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    ICF-322-STL-I

    ICF-322-STL-I

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    3,907
    RFQ
    ICF-322-STL-I

    Tabla de datos

    ICF Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    APA-324-T-P

    APA-324-T-P

    ADAPTER PLUG

    Samtec Inc.

    4,359
    RFQ
    APA-324-T-P

    Tabla de datos

    APA Tube Active - 24 (2 x 12) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    APA-624-T-P

    APA-624-T-P

    ADAPTER PLUG

    Samtec Inc.

    2,072
    RFQ
    APA-624-T-P

    Tabla de datos

    APA Tube Active - 24 (2 x 12) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    ICA-648-WTT-3

    ICA-648-WTT-3

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    4,290
    RFQ
    ICA-648-WTT-3

    Tabla de datos

    ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    346-93-135-41-013000

    346-93-135-41-013000

    CONN SOCKET SIP 35POS GOLD

    Mill-Max Manufacturing Corp.

    4,228
    RFQ
    346-93-135-41-013000

    Tabla de datos

    346 Bulk Active SIP 35 (1 x 35) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    346-43-135-41-013000

    346-43-135-41-013000

    CONN SOCKET SIP 35POS GOLD

    Mill-Max Manufacturing Corp.

    3,271
    RFQ
    346-43-135-41-013000

    Tabla de datos

    346 Bulk Active SIP 35 (1 x 35) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    ICO-320-ZCGG

    ICO-320-ZCGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,673
    RFQ
    ICO-320-ZCGG

    Tabla de datos

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICO-422-ZCGT

    ICO-422-ZCGT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    2,551
    RFQ
    ICO-422-ZCGT

    Tabla de datos

    ICO Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    1107659-01

    1107659-01

    700 ELEVATOR STRIP-LINE SOCKET

    Aries Electronics

    2,736
    RFQ
    1107659-01

    Tabla de datos

    - - Active - - - - - - - - - - - - - - -
    32-9513-11

    32-9513-11

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    4,029
    RFQ
    32-9513-11

    Tabla de datos

    Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    34-3513-10H

    34-3513-10H

    CONN IC DIP SOCKET 34POS GOLD

    Aries Electronics

    3,935
    RFQ
    34-3513-10H

    Tabla de datos

    Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 34 (2 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    24-C182-11H

    24-C182-11H

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    2,588
    RFQ
    24-C182-11H

    Tabla de datos

    EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    16-81000-310C

    16-81000-310C

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    2,137
    RFQ
    16-81000-310C

    Tabla de datos

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-81100-310C

    16-81100-310C

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    3,922
    RFQ
    16-81100-310C

    Tabla de datos

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-81150-310C

    16-81150-310C

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    2,198
    RFQ
    16-81150-310C

    Tabla de datos

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    Total 19086 Record«Prev1... 409410411412413414415416...955Next»
    Correo electrónico
    Lo que contiene
    KATY Electronic Technology Co., LTD

    Casa

    KATY Electronic Technology Co., LTD

    Productos

    KATY Electronic Technology Co., LTD

    Teléfono

    KATY Electronic Technology Co., LTD

    Usuarios