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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    08-6810-90

    08-6810-90

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    3,172
    RFQ
    08-6810-90

    Tabla de datos

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    116-87-640-41-013101

    116-87-640-41-013101

    CONN IC DIP SOCKET 40POS GOLD

    Preci-Dip

    4,861
    RFQ
    116-87-640-41-013101

    Tabla de datos

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICA-320-WGG-2

    ICA-320-WGG-2

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    3,786
    RFQ
    ICA-320-WGG-2

    Tabla de datos

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICO-318-CGG

    ICO-318-CGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    2,350
    RFQ
    ICO-318-CGG

    Tabla de datos

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    APA-314-G-M

    APA-314-G-M

    ADAPTER PLUG

    Samtec Inc.

    4,392
    RFQ
    APA-314-G-M

    Tabla de datos

    APA Tube Active - 14 (2 x 7) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    ICF-322-STL-I

    ICF-322-STL-I

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    3,907
    RFQ
    ICF-322-STL-I

    Tabla de datos

    ICF Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    APA-324-T-P

    APA-324-T-P

    ADAPTER PLUG

    Samtec Inc.

    4,359
    RFQ
    APA-324-T-P

    Tabla de datos

    APA Tube Active - 24 (2 x 12) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    APA-624-T-P

    APA-624-T-P

    ADAPTER PLUG

    Samtec Inc.

    2,072
    RFQ
    APA-624-T-P

    Tabla de datos

    APA Tube Active - 24 (2 x 12) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    ICA-648-WTT-3

    ICA-648-WTT-3

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    4,290
    RFQ
    ICA-648-WTT-3

    Tabla de datos

    ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    346-93-135-41-013000

    346-93-135-41-013000

    CONN SOCKET SIP 35POS GOLD

    Mill-Max Manufacturing Corp.

    4,228
    RFQ
    346-93-135-41-013000

    Tabla de datos

    346 Bulk Active SIP 35 (1 x 35) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    346-43-135-41-013000

    346-43-135-41-013000

    CONN SOCKET SIP 35POS GOLD

    Mill-Max Manufacturing Corp.

    3,271
    RFQ
    346-43-135-41-013000

    Tabla de datos

    346 Bulk Active SIP 35 (1 x 35) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    ICO-320-ZCGG

    ICO-320-ZCGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,673
    RFQ
    ICO-320-ZCGG

    Tabla de datos

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICO-422-ZCGT

    ICO-422-ZCGT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    2,551
    RFQ
    ICO-422-ZCGT

    Tabla de datos

    ICO Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    1107659-01

    1107659-01

    700 ELEVATOR STRIP-LINE SOCKET

    Aries Electronics

    2,736
    RFQ
    1107659-01

    Tabla de datos

    - - Active - - - - - - - - - - - - - - -
    32-9513-11

    32-9513-11

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    4,029
    RFQ
    32-9513-11

    Tabla de datos

    Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    34-3513-10H

    34-3513-10H

    CONN IC DIP SOCKET 34POS GOLD

    Aries Electronics

    3,935
    RFQ
    34-3513-10H

    Tabla de datos

    Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 34 (2 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    24-C182-11H

    24-C182-11H

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    2,588
    RFQ
    24-C182-11H

    Tabla de datos

    EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    16-81000-310C

    16-81000-310C

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    2,137
    RFQ
    16-81000-310C

    Tabla de datos

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-81100-310C

    16-81100-310C

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    3,922
    RFQ
    16-81100-310C

    Tabla de datos

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-81150-310C

    16-81150-310C

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    2,198
    RFQ
    16-81150-310C

    Tabla de datos

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    Total 19086 Record«Prev1... 409410411412413414415416...955Next»
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