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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    317-47-108-41-005000

    317-47-108-41-005000

    CONN SOCKET SIP 8POS GOLD

    Mill-Max Manufacturing Corp.

    470
    RFQ
    317-47-108-41-005000

    Tabla de datos

    317 Tube Active SIP 8 (1 x 8) 0.070" (1.78mm) Gold Flash Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    ICF-308-T-O

    ICF-308-T-O

    CONN IC DIP SOCKET 8POS TIN

    Samtec Inc.

    16
    RFQ
    ICF-308-T-O

    Tabla de datos

    ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    XR2A-0815

    XR2A-0815

    CONN IC DIP SOCKET 8POS GOLD

    Omron Electronics Inc-EMC Div

    118
    RFQ
    XR2A-0815

    Tabla de datos

    XR2 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
    110-47-422-41-001000

    110-47-422-41-001000

    CONN IC DIP SOCKET 22POS GOLD

    Mill-Max Manufacturing Corp.

    225
    RFQ
    110-47-422-41-001000

    Tabla de datos

    110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    AR 14-HZL/07-TT

    AR 14-HZL/07-TT

    CONN IC DIP SOCKET 14POS GOLD

    Assmann WSW Components

    2,942
    RFQ
    AR 14-HZL/07-TT

    Tabla de datos

    - Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    115-47-318-41-001000

    115-47-318-41-001000

    CONN IC DIP SOCKET 18POS GOLD

    Mill-Max Manufacturing Corp.

    440
    RFQ
    115-47-318-41-001000

    Tabla de datos

    115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    210-1-28-006

    210-1-28-006

    CONN IC DIP SOCKET 28POS GOLD

    CNC Tech

    1,264
    RFQ
    210-1-28-006

    Tabla de datos

    - Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT) -40°C ~ 105°C
    214-99-314-01-670800

    214-99-314-01-670800

    CONN IC DIP SOCKET 14POS TINLEAD

    Mill-Max Manufacturing Corp.

    356
    RFQ
    214-99-314-01-670800

    Tabla de datos

    214 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    210-93-314-41-001000

    210-93-314-41-001000

    CONN IC DIP SOCKET 14POS GOLD

    Mill-Max Manufacturing Corp.

    282
    RFQ
    210-93-314-41-001000

    Tabla de datos

    210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    940-44-020-24-000000

    940-44-020-24-000000

    CONN SOCKET PLCC 20POS TIN

    Mill-Max Manufacturing Corp.

    105
    RFQ
    940-44-020-24-000000

    Tabla de datos

    940 Tube Active PLCC 20 (4 x 5) 0.100" (2.54mm) Tin 150.0µin (3.81µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-47-314-41-006000

    116-47-314-41-006000

    CONN IC DIP SOCKET 14POS GOLD

    Mill-Max Manufacturing Corp.

    570
    RFQ
    116-47-314-41-006000

    Tabla de datos

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-47-624-41-001000

    115-47-624-41-001000

    CONN IC DIP SOCKET 24POS GOLD

    Mill-Max Manufacturing Corp.

    345
    RFQ
    115-47-624-41-001000

    Tabla de datos

    115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    210-47-628-41-001000

    210-47-628-41-001000

    CONN IC DIP SOCKET 28POS GOLD

    Mill-Max Manufacturing Corp.

    308
    RFQ
    210-47-628-41-001000

    Tabla de datos

    210 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-93-314-41-001000

    115-93-314-41-001000

    CONN IC DIP SOCKET 14POS GOLD

    Mill-Max Manufacturing Corp.

    332
    RFQ
    115-93-314-41-001000

    Tabla de datos

    115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    10-2513-10

    10-2513-10

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    338
    RFQ
    10-2513-10

    Tabla de datos

    Lo-PRO®file, 513 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    317-47-116-41-005000

    317-47-116-41-005000

    CONN SOCKET SIP 16POS GOLD

    Mill-Max Manufacturing Corp.

    190
    RFQ
    317-47-116-41-005000

    Tabla de datos

    317 Tube Active SIP 16 (1 x 16) 0.070" (1.78mm) Gold Flash Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    214-99-318-01-670800

    214-99-318-01-670800

    CONN IC DIP SOCKET 18POS TINLEAD

    Mill-Max Manufacturing Corp.

    390
    RFQ
    214-99-318-01-670800

    Tabla de datos

    214 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    214-44-318-01-670800

    214-44-318-01-670800

    CONN IC DIP SOCKET 18POS TIN

    Mill-Max Manufacturing Corp.

    362
    RFQ
    214-44-318-01-670800

    Tabla de datos

    214 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    214-99-320-01-670800

    214-99-320-01-670800

    CONN IC DIP SOCKET 20POS TINLEAD

    Mill-Max Manufacturing Corp.

    789
    RFQ
    214-99-320-01-670800

    Tabla de datos

    214 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-47-628-41-605000

    110-47-628-41-605000

    CONN IC DIP SOCKET 28POS GOLD

    Mill-Max Manufacturing Corp.

    242
    RFQ
    110-47-628-41-605000

    Tabla de datos

    110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    Total 19086 Record«Prev1... 2627282930313233...955Next»
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