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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    940-44-028-24-000000

    940-44-028-24-000000

    CONN SOCKET PLCC 28POS TIN

    Mill-Max Manufacturing Corp.

    1,185
    RFQ
    940-44-028-24-000000

    Tabla de datos

    940 Tube Active PLCC 28 (4 x 7) 0.100" (2.54mm) Tin 150.0µin (3.81µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    10-810-90C

    10-810-90C

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    115
    RFQ
    10-810-90C

    Tabla de datos

    Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    40-C212-10

    40-C212-10

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    700
    RFQ
    40-C212-10

    Tabla de datos

    EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    12-810-90C

    12-810-90C

    CONN IC DIP SOCKET 12POS GOLD

    Aries Electronics

    529
    RFQ
    12-810-90C

    Tabla de datos

    Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    ICA-640-SGG

    ICA-640-SGG

    CONN IC DIP SOCKET 40POS GOLD

    Samtec Inc.

    20
    RFQ
    ICA-640-SGG

    Tabla de datos

    ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    346-93-164-41-013000

    346-93-164-41-013000

    CONN SOCKET SIP 64POS GOLD

    Mill-Max Manufacturing Corp.

    170
    RFQ
    346-93-164-41-013000

    Tabla de datos

    346 Tube Active SIP 64 (1 x 64) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APA-628-G-N

    APA-628-G-N

    ADAPTER PLUG

    Samtec Inc.

    230
    RFQ
    APA-628-G-N

    Tabla de datos

    APA Tube Active - 28 (2 x 14) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    20-823-90

    20-823-90

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    802
    RFQ
    20-823-90

    Tabla de datos

    Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    2350616-1

    2350616-1

    DUAL LGA,250 POS, DMD SOCKET

    TE Connectivity AMP Connectors

    296
    RFQ
    2350616-1

    Tabla de datos

    - Tray Active LGA 250 (16 x 25) 0.039" (1.00mm) Gold 3.00µin (0.076µm) Copper Alloy Surface Mount Board Guide, Open Frame Solder - - - - Thermoplastic -25°C ~ 100°C
    299-43-308-11-001000

    299-43-308-11-001000

    CONN IC DIP SOCKET 8POS GOLD

    Mill-Max Manufacturing Corp.

    704
    RFQ
    299-43-308-11-001000

    Tabla de datos

    299 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    40-6823-90

    40-6823-90

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    246
    RFQ
    40-6823-90

    Tabla de datos

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    1-2324271-4

    1-2324271-4

    LEFT SEGMEN LGA4189-4 SOCKET-P4

    TE Connectivity AMP Connectors

    121
    RFQ
    1-2324271-4

    Tabla de datos

    - Tray Active LGA 4189 2092 0.039" (1.00mm) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Open Frame Solder 0.034" (0.86mm) Gold 15.0µin (0.38µm) Copper Alloy Thermoplastic -25°C ~ 100°C
    2-2129710-5

    2-2129710-5

    CONN SOCKET LGA 3647POS GOLD

    TE Connectivity AMP Connectors

    171
    RFQ
    2-2129710-5

    Tabla de datos

    - Tray Last Time Buy LGA 3647 - Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder - - - Copper Alloy Thermoplastic -
    2-2129710-6

    2-2129710-6

    CONN SOCKET LGA 3647POS GOLD

    TE Connectivity AMP Connectors

    249
    RFQ
    2-2129710-6

    Tabla de datos

    - Tray Last Time Buy LGA 3647 - Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder - - - Copper Alloy Thermoplastic -
    264-1300-00-0602J

    264-1300-00-0602J

    CONN IC DIP SOCKET ZIF 64POS GLD

    3M

    169
    RFQ
    264-1300-00-0602J

    Tabla de datos

    Textool™ Tube Active DIP, ZIF (ZIP), 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
    24-6554-16

    24-6554-16

    CONN IC DIP SOCKET ZIF 24POS

    Aries Electronics

    73
    RFQ
    24-6554-16

    Tabla de datos

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    2-2822979-3

    2-2822979-3

    CONN SOCKET LGA 3647POS GOLD

    TE Connectivity AMP Connectors

    168
    RFQ
    2-2822979-3

    Tabla de datos

    - Tray Last Time Buy LGA 3647 0.039" (1.00mm) Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder 0.034" (0.86mm) Gold 30.0µin (0.76µm) Copper Alloy Thermoplastic -
    214-99-308-01-670800

    214-99-308-01-670800

    CONN IC DIP SOCKET 8POS TIN-LEAD

    Mill-Max Manufacturing Corp.

    1,068
    RFQ
    214-99-308-01-670800

    Tabla de datos

    214 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    114-87-310-41-134191

    114-87-310-41-134191

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    2,944
    RFQ
    114-87-310-41-134191

    Tabla de datos

    114 Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-47-210-41-006000

    116-47-210-41-006000

    CONN IC DIP SOCKET 10POS GOLD

    Mill-Max Manufacturing Corp.

    2,142
    RFQ
    116-47-210-41-006000

    Tabla de datos

    116 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    Total 19086 Record«Prev1... 2526272829303132...955Next»
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