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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    C9122-00

    C9122-00

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    3,878
    RFQ
    C9122-00

    Tabla de datos

    Edge-Grip™, C91 Bulk Obsolete DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    HLS-0116-T-2

    HLS-0116-T-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,904
    RFQ
    HLS-0116-T-2

    Tabla de datos

    HLS Tube Active SIP 16 (1 x 16) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    299-87-320-11-001101

    299-87-320-11-001101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    4,887
    RFQ
    299-87-320-11-001101

    Tabla de datos

    299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    IC-628-SGT

    IC-628-SGT

    CONN IC DIP SOCKET 28POS GOLD

    Samtec Inc.

    4,720
    RFQ
    IC-628-SGT

    Tabla de datos

    IC Bulk Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyester, Glass Filled -55°C ~ 125°C
    510-83-073-11-061101

    510-83-073-11-061101

    CONN SOCKET PGA 73POS GOLD

    Preci-Dip

    3,939
    RFQ
    510-83-073-11-061101

    Tabla de datos

    510 Bulk Active PGA 73 (11 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-628-41-009101

    116-83-628-41-009101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    3,534
    RFQ
    116-83-628-41-009101

    Tabla de datos

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    08-2501-20

    08-2501-20

    CONN IC DIP SOCKET 8POS TIN

    Aries Electronics

    3,854
    RFQ
    08-2501-20

    Tabla de datos

    501 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    116-83-424-41-011101

    116-83-424-41-011101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    3,669
    RFQ
    116-83-424-41-011101

    Tabla de datos

    116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICA-318-ZSGT

    ICA-318-ZSGT

    CONN IC DIP SOCKET 18POS GOLD

    Samtec Inc.

    4,784
    RFQ
    ICA-318-ZSGT

    Tabla de datos

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICO-318-ZSGT

    ICO-318-ZSGT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,910
    RFQ
    ICO-318-ZSGT

    Tabla de datos

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    08-0501-20

    08-0501-20

    CONN SOCKET SIP 8POS TIN

    Aries Electronics

    2,196
    RFQ
    08-0501-20

    Tabla de datos

    501 Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    08-0501-30

    08-0501-30

    CONN SOCKET SIP 8POS TIN

    Aries Electronics

    3,255
    RFQ
    08-0501-30

    Tabla de datos

    501 Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    116-87-318-41-013101

    116-87-318-41-013101

    CONN IC DIP SOCKET 18POS GOLD

    Preci-Dip

    4,687
    RFQ
    116-87-318-41-013101

    Tabla de datos

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICF-320-F-O

    ICF-320-F-O

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    2,667
    RFQ
    ICF-320-F-O

    Tabla de datos

    ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 3.00µin (0.076µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    510-87-121-15-001101

    510-87-121-15-001101

    CONN SOCKET PGA 121POS GOLD

    Preci-Dip

    3,276
    RFQ
    510-87-121-15-001101

    Tabla de datos

    510 Bulk Active PGA 121 (15 x 15) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-121-15-061101

    510-87-121-15-061101

    CONN SOCKET PGA 121POS GOLD

    Preci-Dip

    3,379
    RFQ
    510-87-121-15-061101

    Tabla de datos

    510 Bulk Active PGA 121 (15 x 15) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-328-41-011101

    116-87-328-41-011101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    2,064
    RFQ
    116-87-328-41-011101

    Tabla de datos

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    05-0503-21

    05-0503-21

    CONN SOCKET SIP 5POS GOLD

    Aries Electronics

    4,189
    RFQ
    05-0503-21

    Tabla de datos

    0503 Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
    20-4518-10H

    20-4518-10H

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    3,749
    RFQ
    20-4518-10H

    Tabla de datos

    518 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    HLS-0109-G-10

    HLS-0109-G-10

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,181
    RFQ
    HLS-0109-G-10

    Tabla de datos

    HLS Tube Active SIP 9 (1 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    Total 19086 Record«Prev1... 258259260261262263264265...955Next»
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