Sesión o Registro
    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    116-87-636-41-007101

    116-87-636-41-007101

    CONN IC DIP SOCKET 36POS GOLD

    Preci-Dip

    4,976
    RFQ
    116-87-636-41-007101

    Tabla de datos

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    346-93-113-41-013000

    346-93-113-41-013000

    CONN SOCKET SIP 13POS GOLD

    Mill-Max Manufacturing Corp.

    2,955
    RFQ
    346-93-113-41-013000

    Tabla de datos

    346 Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    346-43-113-41-013000

    346-43-113-41-013000

    CONN SOCKET SIP 13POS GOLD

    Mill-Max Manufacturing Corp.

    3,849
    RFQ
    346-43-113-41-013000

    Tabla de datos

    346 Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    124-83-424-41-002101

    124-83-424-41-002101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    2,379
    RFQ

    -

    124 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    18-3513-10H

    18-3513-10H

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    4,352
    RFQ
    18-3513-10H

    Tabla de datos

    Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    24-6513-11

    24-6513-11

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    3,618
    RFQ
    24-6513-11

    Tabla de datos

    Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    115-83-650-41-003101

    115-83-650-41-003101

    CONN IC DIP SOCKET 50POS GOLD

    Preci-Dip

    3,033
    RFQ
    115-83-650-41-003101

    Tabla de datos

    115 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    3-1571552-4

    3-1571552-4

    CONN IC DIP SOCKET 48POS GOLD

    TE Connectivity AMP Connectors

    2,315
    RFQ
    3-1571552-4

    Tabla de datos

    800 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
    HLS-0112-T-10

    HLS-0112-T-10

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,477
    RFQ
    HLS-0112-T-10

    Tabla de datos

    HLS Tube Active SIP 12 (1 x 12) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    510-83-072-11-061101

    510-83-072-11-061101

    CONN SOCKET PGA 72POS GOLD

    Preci-Dip

    2,440
    RFQ
    510-83-072-11-061101

    Tabla de datos

    510 Bulk Active PGA 72 (11 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0204-G-10

    HLS-0204-G-10

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,768
    RFQ
    HLS-0204-G-10

    Tabla de datos

    HLS Tube Active SIP 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    211-1-48-006

    211-1-48-006

    CONN IC DIP SOCKET 48POS GOLD

    CNC Tech

    4,523
    RFQ
    211-1-48-006

    Tabla de datos

    - Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT) -55°C ~ 105°C
    124-83-624-41-002101

    124-83-624-41-002101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    3,307
    RFQ

    -

    124 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    299-87-320-10-001101

    299-87-320-10-001101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    3,967
    RFQ
    299-87-320-10-001101

    Tabla de datos

    299 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0105-G-3

    HLS-0105-G-3

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,914
    RFQ
    HLS-0105-G-3

    Tabla de datos

    HLS Tube Active SIP 5 (1 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    8-1437539-9

    8-1437539-9

    CONN IC DIP SOCKET 28POS GOLD

    TE Connectivity AMP Connectors

    4,666
    RFQ
    8-1437539-9

    Tabla de datos

    800 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) - - - Polyester -55°C ~ 105°C
    110-83-952-41-001101

    110-83-952-41-001101

    CONN IC DIP SOCKET 52POS GOLD

    Preci-Dip

    3,589
    RFQ
    110-83-952-41-001101

    Tabla de datos

    110 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICA-632-ZSTT

    ICA-632-ZSTT

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    4,949
    RFQ
    ICA-632-ZSTT

    Tabla de datos

    ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    510-87-124-13-001101

    510-87-124-13-001101

    CONN SOCKET PGA 124POS GOLD

    Preci-Dip

    2,974
    RFQ
    510-87-124-13-001101

    Tabla de datos

    510 Bulk Active PGA 124 (13 x 13) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-124-13-041101

    510-87-124-13-041101

    CONN SOCKET PGA 124POS GOLD

    Preci-Dip

    4,027
    RFQ
    510-87-124-13-041101

    Tabla de datos

    510 Bulk Active PGA 124 (13 x 13) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    Total 19086 Record«Prev1... 256257258259260261262263...955Next»
    KATY Electronic Technology Co., LTD

    Casa

    KATY Electronic Technology Co., LTD

    Productos

    KATY Electronic Technology Co., LTD

    Teléfono

    KATY Electronic Technology Co., LTD

    Usuarios